Apparatus, systems, and/or methods for filtering, recapture, and/or recirculation of coolant are disclosed. In some examples, coolant (e.g., coolant fluid) is used to cool and/or clean a machine, such as a material removal machine, for example. In some examples, a recirculation tank may be in fluid communication with an inlet and/or outlet of a cabinet (and/or housing) of the machine. The recirculation tank may include a recapture reservoir having a filtering surface configured to prevent particulates, debris, and/or swarf from being recirculated with the coolant. A vibration device (e.g., a vibration motor and/or vibrating actuator), may be in contact with and/or configured to vibrate (and/or shake, rattle, oscillate, etc.) the filtering surface, recapture reservoir, and/or recirculation tank so as to keep the filter free from obstruction and/or help settle and/or compact filtered particulates in a bottom of the recapture reservoir and/or recirculation tank.

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid dispenser having a polishing liquid port positioned over the platen to deliver polishing liquid onto the polishing pad, a temperature control system including coolant liquid fluid reservoirs for containing coolant fluids, a thermal controller configured to control the temperature of the coolant fluid within the coolant fluid reservoirs, and a first dispenser having openings in fluid connection with the coolant fluid reservoirs, the openings positioned configured to spray an aerosolized coolant liquid directly onto the polishing pad, and a second dispenser having a coolant port in fluid connection with the coolant fluid reservoirs, the coolant port positioned over the platen and configured to flow a stream of coolant liquid directly onto the polishing pad.

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid dispenser having a polishing liquid port positioned over the platen to deliver polishing liquid onto the polishing pad, a temperature control system including coolant liquid fluid reservoirs for containing coolant fluids, a thermal controller configured to control the temperature of the coolant fluid within the coolant fluid reservoirs, and a first dispenser having openings in fluid connection with the coolant fluid reservoirs, the openings positioned configured to spray an aerosolized coolant liquid directly onto the polishing pad, and a second dispenser having a coolant port in fluid connection with the coolant fluid reservoirs, the coolant port positioned over the platen and configured to flow a stream of coolant liquid directly onto the polishing pad.

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

An example coolant nozzle includes a cylindrical shank having a first axial end and a second axial end; a nozzle head extending from the second axial end of the cylindrical shank; a central coolant channel extending from a central axis of the first axial end of the cylindrical shank to partially through a central axis of the nozzle head; and at least one first coolant delivery channel extending radially outward from the central coolant channel to an outer wall of the nozzle head.

An example coolant nozzle includes a cylindrical shank having a first axial end and a second axial end; a nozzle head extending from the second axial end of the cylindrical shank; a central coolant channel extending from a central axis of the first axial end of the cylindrical shank to partially through a central axis of the nozzle head; and at least one first coolant delivery channel extending radially outward from the central coolant channel to an outer wall of the nozzle head.

The present invention provides a nanolayer-lubricated diamond grinding wheel grinding method based on a shock wave cavitation effect. In the method, after a gas pressure regulation valve is turned on, a shock wave generated by an acceleration tube pushes nanoparticles to move forward, and the nanoparticles are then accelerated by a small de Laval nozzle to acquire a high initial velocity. One wave source of a shock wave speed-increase module generates a high-frequency high-strength shock wave, to impact nanoparticles with an initial velocity, to enable the nanoparticles to be continuously accelerated downward in an axial direction of a large de Laval nozzle, until the nanoparticles are embedded on a grinding wheel surface at a maximum speed to form a nanolayer. The other wave source is used to clean impurities on the grinding wheel surface. In a processing process, the nanoparticles of the nanolayer are autonomously released in a core grinding region, to implement self-lubrication and cooling inside the grinding region. This method significantly enhances lubrication and cooling effects and satisfies the green development idea.

The present invention provides a nanolayer-lubricated diamond grinding wheel grinding method based on a shock wave cavitation effect. In the method, after a gas pressure regulation valve is turned on, a shock wave generated by an acceleration tube pushes nanoparticles to move forward, and the nanoparticles are then accelerated by a small de Laval nozzle to acquire a high initial velocity. One wave source of a shock wave speed-increase module generates a high-frequency high-strength shock wave, to impact nanoparticles with an initial velocity, to enable the nanoparticles to be continuously accelerated downward in an axial direction of a large de Laval nozzle, until the nanoparticles are embedded on a grinding wheel surface at a maximum speed to form a nanolayer. The other wave source is used to clean impurities on the grinding wheel surface. In a processing process, the nanoparticles of the nanolayer are autonomously released in a core grinding region, to implement self-lubrication and cooling inside the grinding region. This method significantly enhances lubrication and cooling effects and satisfies the green development idea.