Patent classifications
B24B55/03
System for adjusting pad surface temperature and polishing apparatus
A system (5) includes a heat exchanging member (11) and a liquid supply unit (30). The liquid supply unit (30) includes a pump device (32) that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device (40) that controls operations of the pump device (32) and the needle valve (MNV).
FILTER BAG DETECTION
A device (A) to detect a filtering means (14) in a water treatment unit (1) including at least one signal transmitter (13) and at least one sensor (12) to detect a signal from the signal transmitter (13), whereby the water treatment unit (1) can be set at least in a work mode or in a sleep mode. The water treatment unit (1) is configured in such a way that the work mode can only be set if at least one signal which is emitted by the signal transmitter (13) is detected by the sensor (12). A filter (14) and a suction head (3) for use in the device (A). A system including a filter (14) and a suction head (3) for use in the device (A).
WAFER POLISHING APPARATUS
The present invention provides a wafer polishing apparatus, including: a surface plate having a polishing pad attached on an upper surface thereof; a slurry injection nozzle configured to inject slurry toward the polishing pad; at least one polishing head configured to accommodate a wafer and rotate at an upper portion of the surface plate; an index configured to support so as to connect the at least one polishing head at an upper portion thereof; and a particle suction part coupled to the index and configured to suck particles generated during polishing of the wafer.
Grinding apparatus
A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. The rotary joint has a communication channel by which the first suction channel and the second suction channel are held in fluid communication with at least a suction source.
POLISHING DEVICE
A polishing device configured to polish a glass substrate is disclosed, including a polishing wheel fixedly arranged, a cooling pipe, and a movable platform. The polishing wheel has an outer peripheral polishing surface, the glass substrate is placed on the platform and is driven by the platform to move so as to make the outer peripheral polishing surface polish the predetermined polishing surface of the glass substrate; the polishing wheel further has a chamber, and the cooling pipe containing a coolant is disposed in the chamber to decrease a temperature of the chamber and then to make temperatures of the outer peripheral polishing surface and the predetermined polishing surface during polishing is lower than a preset temperature. The disclosure solves the problem of high polishing temperature of the polishing wheel and the glass substrate, thereby enhancing the service life of the polishing wheel and the yield of the glass substrate.
Planar grinder
A sample grinder includes a base having a bowl and a rotatable drive plate to operably support a grinding wheel. A head is configured to support a specimen holder and has a first drive for rotational drive of the specimen holder and a second drive for moving the head and specimen holder toward and away from the drive plate. The head has a sleeve that is larger than the specimen holder. A cover is disposed over the bowl and has an opening larger than the sleeve so that the sleeve fits through the opening when the specimen holder is moved toward the rotatable drive plate. The grinding wheel is mountable to the plate in a single radial orientation only. A dressing system is operably connected to a controller to monitor the current of the drive plate motor and/or the head first drive actuates the dressing system based upon the current drawn by the drive plate motor and/or the head first drive motor falling below a predetermined value.
Planar grinder
A sample grinder includes a base having a bowl and a rotatable drive plate to operably support a grinding wheel. A head is configured to support a specimen holder and has a first drive for rotational drive of the specimen holder and a second drive for moving the head and specimen holder toward and away from the drive plate. The head has a sleeve that is larger than the specimen holder. A cover is disposed over the bowl and has an opening larger than the sleeve so that the sleeve fits through the opening when the specimen holder is moved toward the rotatable drive plate. The grinding wheel is mountable to the plate in a single radial orientation only. A dressing system is operably connected to a controller to monitor the current of the drive plate motor and/or the head first drive actuates the dressing system based upon the current drawn by the drive plate motor and/or the head first drive motor falling below a predetermined value.
Grinding coolant supplier, grinding system and grinding method
A grinding coolant supplier configured to supply a grinding coolant to a grinder configured to grind an element of a machine part having a rolling element, the grinding coolant supplier including: a grinding coolant generation apparatus configured to generate a grinding coolant which is a mixture of a water-soluble stock coolant, a first reformed water of which water particles have an average particle size of not smaller than 80 nm and not greater than 150 nm, and a second reformed water of which water particles have an average particle size of not smaller than 5 nm and smaller than 80 nm; and grinding coolant supplying device configured to supply the generated grinding coolant to the grinder.
Grinding coolant supplier, grinding system and grinding method
A grinding coolant supplier configured to supply a grinding coolant to a grinder configured to grind an element of a machine part having a rolling element, the grinding coolant supplier including: a grinding coolant generation apparatus configured to generate a grinding coolant which is a mixture of a water-soluble stock coolant, a first reformed water of which water particles have an average particle size of not smaller than 80 nm and not greater than 150 nm, and a second reformed water of which water particles have an average particle size of not smaller than 5 nm and smaller than 80 nm; and grinding coolant supplying device configured to supply the generated grinding coolant to the grinder.
Hand-held power tool with a cooling unit
A hand-held power tool includes a housing, a motor, a cooling unit, and a plurality of electronics. The housing includes a first housing part and an air intake opening. The motor is assigned to a drive train of the hand-held power tool. The cooling unit is configured to cool the motor. The plurality of electronics is located in the housing. The first housing part includes at least one air channel that is integral with the first housing part. The air intake opening is configured to conduct a cooling air flow directly to the motor via the at least one air channel.