B24C5/04

Nozzle for stress-free polishing metal layers on semiconductor wafers
09724803 · 2017-08-08 · ·

A nozzle for charging and ejecting electrolyte in SFP process is disclosed. The nozzle includes an insulated foundation defining a through-hole, a conductive body as negative electrode connecting with a power source for charging the electrolyte and an insulated nozzle head. The conductive body has a fixing portion located on the insulated foundation. The fixing portion forms a receiving portion inserted into the through-hole and defining a receiving hole passing therethrough. The insulated nozzle head has a cover assembled with the insulated foundation above the conductive body and a tube extending through the cover and defining a main fluid path through where the charged electrolyte is ejected for polishing. The tube is inserted in the receiving hole and stretches out of the receiving hole of the conductive body forming an auxiliary fluid path between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube.

Nozzle for stress-free polishing metal layers on semiconductor wafers
09724803 · 2017-08-08 · ·

A nozzle for charging and ejecting electrolyte in SFP process is disclosed. The nozzle includes an insulated foundation defining a through-hole, a conductive body as negative electrode connecting with a power source for charging the electrolyte and an insulated nozzle head. The conductive body has a fixing portion located on the insulated foundation. The fixing portion forms a receiving portion inserted into the through-hole and defining a receiving hole passing therethrough. The insulated nozzle head has a cover assembled with the insulated foundation above the conductive body and a tube extending through the cover and defining a main fluid path through where the charged electrolyte is ejected for polishing. The tube is inserted in the receiving hole and stretches out of the receiving hole of the conductive body forming an auxiliary fluid path between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube.

Fluid nozzle

A fluid nozzle includes a nozzle chip that includes a through hole having an inlet port from which a fluid supplied to the fluid nozzle is introduced and an outlet port from which the introduced fluid is ejected; and a base metal member that supports the nozzle chip embedded in a rear portion of the base metal member. The fluid nozzle receives the fluid supplied to the rear portion from the inlet port and ejects the fluid from the outlet port. An exposed portion of the base metal member is covered with a ceramic coating so that the base metal member does not touch the fluid.

Fluid nozzle

A fluid nozzle includes a nozzle chip that includes a through hole having an inlet port from which a fluid supplied to the fluid nozzle is introduced and an outlet port from which the introduced fluid is ejected; and a base metal member that supports the nozzle chip embedded in a rear portion of the base metal member. The fluid nozzle receives the fluid supplied to the rear portion from the inlet port and ejects the fluid from the outlet port. An exposed portion of the base metal member is covered with a ceramic coating so that the base metal member does not touch the fluid.

Water jet peening apparatus and method, and method of evaluating nozzle

A water jet peening apparatus includes: a nozzle, which is arranged in water and has a mouth from which water is jetted out; a detecting device, which is arranged in the water and detects sound in at least a part of a period during which the water is being jetted out from the mouth; and a processing device, which determines, based on a result of the detection by the detecting device, presence or absence of abnormality in the nozzle.

Water jet peening apparatus and method, and method of evaluating nozzle

A water jet peening apparatus includes: a nozzle, which is arranged in water and has a mouth from which water is jetted out; a detecting device, which is arranged in the water and detects sound in at least a part of a period during which the water is being jetted out from the mouth; and a processing device, which determines, based on a result of the detection by the detecting device, presence or absence of abnormality in the nozzle.

Orifice for a waterjet cutter

An orifice for a high-pressure waterjet cutter includes a first surface defining an inlet plane, a second surface defining an outlet plane, and an inner bore aligned along a flow axis and extending from the first surface to the second surface. The orifice also includes a first layer of polycrystalline diamond extending from the first surface to a plane between the inlet plane and the outlet plane, and a second, separate layer of polycrystalline diamond extending from the plane to the second surface. The first layer and the second layer are coupled to one another to define a single component. The second layer has material properties different than the first layer.

Orifice for a waterjet cutter

An orifice for a high-pressure waterjet cutter includes a first surface defining an inlet plane, a second surface defining an outlet plane, and an inner bore aligned along a flow axis and extending from the first surface to the second surface. The orifice also includes a first layer of polycrystalline diamond extending from the first surface to a plane between the inlet plane and the outlet plane, and a second, separate layer of polycrystalline diamond extending from the plane to the second surface. The first layer and the second layer are coupled to one another to define a single component. The second layer has material properties different than the first layer.

Method and apparatus for prepping bores and curved inner surfaces with a rotating high-frequencey forced pulsed waterjet

A method of prepping a cylindrical inner surface of a bore using a high-frequency forced pulsed waterjet apparatus entails generating a pressurized waterjet using a high-pressure water pump, generating a high-frequency signal using a high-frequency signal generator, applying the high-frequency signal to a transducer having a microtip to cause the microtip to vibrate to thereby generate the high-frequency forced pulsed waterjet, and rotating the rotatable ultrasonic nozzle inside the bore to prep the inner cylindrical surface of the bore using the high-frequency forced pulsed waterjets exiting from the angled exit orifices of the rotatable ultrasonic nozzle.

Method and apparatus for prepping bores and curved inner surfaces with a rotating high-frequencey forced pulsed waterjet

A method of prepping a cylindrical inner surface of a bore using a high-frequency forced pulsed waterjet apparatus entails generating a pressurized waterjet using a high-pressure water pump, generating a high-frequency signal using a high-frequency signal generator, applying the high-frequency signal to a transducer having a microtip to cause the microtip to vibrate to thereby generate the high-frequency forced pulsed waterjet, and rotating the rotatable ultrasonic nozzle inside the bore to prep the inner cylindrical surface of the bore using the high-frequency forced pulsed waterjets exiting from the angled exit orifices of the rotatable ultrasonic nozzle.