B24D3/002

Polishing Pad
20200331119 · 2020-10-22 ·

A polishing pad including a damping layer made of a resilient material including expanded semi-rigid polyurethane having a microcell structure, an adhesive layer including a layer of a hook-and-loop fastener adapted to interact and connect to a corresponding layer of the hook-and-loop fastener located at a bottom surface of the working element of the machine tool and a polishing layer including microfiber adapted for polishing a surface of a work piece. The polishing layer includes a fabric having a woven mesh of microfibers that define a back side of the polishing layer. The fabric serves as a barrier to the resilient material of the damping layer such that the resilient material does not reach an active side of the polishing layer comprising the microfibers when the damping layer, adhesive layer and polishing layer are combined, and such that the active side of the polishing layer is free of resilient material of the damping layer.

REINFORCING MESH FOR ABRASIVE WHEELS AND RELATED ABRASIVE WHEEL
20200316753 · 2020-10-08 ·

A reinforcing mesh for abrasive wheels comprising: a fabric or nonwoven fabric made of fibres; and at least one recognition element made of conductive material adhering to the fibre fabric.

POLISHING SHEET AND POLISHING METHOD
20200306933 · 2020-10-01 ·

Object: To provide a polishing sheet capable of efficiently polishing a hard material such as a metal product so as to form a smooth surface with minimal unevenness. Solution: A polishing sheet (10) including: a substrate (11); a plurality of three-dimensional elements (12) containing abrasive grains and a binding material; and an intermediate layer (13) provided between the three-dimensional elements (12) and the substrate (11) so as to join the substrate (11) and the three-dimensional elements (12), wherein a Youngs modulus of the substrate (11) at 25 C. is not less than 3.010.sup.9Pa; and a Youngs modulus of the intermediate layer (13) at 25 C. is not less than 1.010.sup.7Pa and not greater than 5.010.sup.8Pa.

Method for manufacturing a polishing pad
10786884 · 2020-09-29 ·

A method for manufacturing a polishing pad for a hand tool having a working element performing an orbital, random orbital, and/or a rotational movement, the polishing pad having attached layers including: a resilient damping layer, an adhesive layer for connection to a corresponding layer located at a bottom surface of the working element, and a polishing layer including microfiber for polishing a surface of a work piece. The method includes the steps of: providing a casting mold having a recess corresponding to form of the polishing pad and a lid for closing the recess; placing the adhesive layer into the recess; pouring the resilient material for the damping layer into the recess on top of the adhesive layer; placing the polishing layer on the resilient material; closing the recess with the lid; and manufacturing the polishing pad under external heat supply until the resilient material is cured.

ABRASIVE ARTICLES WITH PRECISELY SHAPED FEATURES AND METHOD OF MAKING THEREOF

An abrasive article includes a first abrasive element, a second abrasive element, a resilient element having first and second major surfaces, and a carrier. The first element and the second abrasive element each comprises a first major surface and a second major surface. At least the first major surfaces of the first and second abrasive elements comprise a plurality of precisely shaped features. The abrasive elements comprise substantially inorganic, monolithic structures.

ABRASIVE TOOL AND USE OF SUCH AN ABRASIVE TOOL

An abrasive tool, including an abrasive carrier (1) having a shaft (2) for connecting the abrasive carrier (1) to a driving device for rotatably driving the abrasive carrier (1) about a longitudinal axis (X) and having a core (3) connected to an axial end (4) of the shaft (2), and an abrasive article (15) having a surface (16) being circumferentially closed about the longitudinal axis (X) and enclosing a cavity (17) extending along the longitudinal axis (X), wherein the core (3) is accommodated at least partially in the cavity (17), and wherein the core (3) includes a material mixture which includes a plastic with a heat-conductive filler, wherein the plastic is foamed, and wherein the filler has a thermal conductivity greater than 35 watts per meter and per Kelvin.

Abrasive articles with precisely shaped features and method of making thereof

An abrasive article includes a first abrasive element, a second abrasive element, a resilient element having first and second major surfaces, and a carrier. The first element and the second abrasive element each comprises a first major surface and a second major surface. At least the first major surfaces of the first and second abrasive elements comprise a plurality of precisely shaped features. The abrasive elements comprise substantially inorganic, monolithic structures.

Sanding element and method for manufacturing a sanding element
20200198095 · 2020-06-25 ·

Disc-shaped sanding element (1) and method for manufacturing this sanding element (1) with a circular circumference with at least two layers (4,5,6) bonded to each other containing abrasive grains (11, 12), wherein these layers (4,5,6) extend at least to the circumference of the sanding element (1) in order to form a sanding edge (8) on this circumference (7), wherein each of these layers (4,5,6) has layer properties including compressibility, abrasive grain density, abrasive grain size and grain material. The layers (4,5,6) contain a three-dimensional thread or fibre structure in which said abrasive grains (11,12) are distributed, wherein adjacent layers (4,5,6) have at least one different layer property.

APPARATUSES, DEVICE, AND METHODS FOR CLEANING TESTER INTERFACE CONTACT ELEMENTS AND SUPPORT HARDWARE

A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed so that the functionality and performance of the individual die or IC package may be electrically evaluated.

POLYURETHANE FOR POLISHING LAYER, POLISHING LAYER INCLUDING POLYURETHANE AND MODIFICATION METHOD OF THE POLISHING LAYER, POLISHING PAD, AND POLISHING METHOD

Disclosed herein are polyurethanes useful for polishing layers, where the polyurethane is a polyurethane having a Schiff base. Also disclosed herein are polishing layers containing the polyurethanes, polishing methods that use the polishing layers, and a modification method including a step of converting the Schiff base into at least one functional group selected from an aldehyde group, a carboxylic acid group, a hydroxyl group, and an amino group.