A coated super-abrasive grain comprises: a body composed of cubic boron nitride; and a coating film coating at least a portion of a surface of the body, the body having a dislocation density of 9×10.sup.14/m.sup.2 or less, the coating film including one or more types of compounds composed of at least one type of element selected from the group consisting of a group 4 element, a group 5 element and a group 6 element of the periodic table, aluminum and silicon, and at least one type of element selected from the group consisting of oxygen, nitrogen, carbon, and boron.

A sanding tool includes a backing layer an adhesive layer and an abrasive layer. The adhesive layer is provided at the backing layer for bonding the abrasive layer at the backing layer via flocking techniques.

A sanding tool includes a backing layer an adhesive layer and an abrasive layer. The adhesive layer is provided at the backing layer for bonding the abrasive layer at the backing layer via flocking techniques.

In various implementations, a conditioning head includes a substrate comprising a substrate surface; and at least one raised non-planar abrasive region relative to the substrate surface. The non-planar abrasive region comprises an edge shaving region and a point cutting region, the ratio of the surface area of the edge shaving region to the point cutting region is at least 2:1; and wherein the cutting point region comprises one or more protrusions extending no more than 250 microns from the mean height of the edge shaving region

Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80° and no greater than 98°.

The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80° and no greater than 98°.

Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (EDM), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (EDM), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.