A method of making a polycrystalline diamond compact includes forming multiple layers of premixed diamond particles and carbonate material, where the carbonate material includes an alkaline earth metal carbonate, and where each layer has a weight percent ratio of diamond to carbonate that is different from adjacent layers. The layers are subjected to high pressure high temperature conditions to form polycrystalline diamond.

An abrasive article including a bonded abrasive body having a bond material including an inorganic material, abrasive particles contained within the bond material of the bonded abrasive body, porosity within a range of at least 55 vol % to not greater than 90 vol % for a total volume of the bonded abrasive body, and a Solid Phase Variation of not greater than 45%.

An abrasive article including a bonded abrasive body having a bond material including an inorganic material, abrasive particles contained within the bond material of the bonded abrasive body, porosity within a range of at least 55 vol % to not greater than 90 vol % for a total volume of the bonded abrasive body, and a Solid Phase Variation of not greater than 45%.

A sanding tool includes a backing layer an adhesive layer and an abrasive layer. The adhesive layer is provided at the backing layer for bonding the abrasive layer at the backing layer via flocking techniques.

A sanding tool includes a backing layer an adhesive layer and an abrasive layer. The adhesive layer is provided at the backing layer for bonding the abrasive layer at the backing layer via flocking techniques.

Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (EDM), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (EDM), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

An abrasive article including a bonded abrasive having a body of a diameter of at least 260 mm and a volume of at least 20 cubic centimeters, the body also having a bond material including an inorganic material, abrasive particles having an abrasive particle size of at least 40 microns contained in the bond material, and a certain Homogeneity Factor.

An abrasive article including a bonded abrasive having a body of a diameter of at least 260 mm and a volume of at least 20 cubic centimeters, the body also having a bond material including an inorganic material, abrasive particles having an abrasive particle size of at least 40 microns contained in the bond material, and a certain Homogeneity Factor.

An abrasive article including a bonded abrasive body having a certain Homogeneity Factor and a multimodal distribution of abrasive particle sizes where the particles size of a first mode is no greater than 80% of a particle size of a second mode. The bonded body can also have a consistent hardness throughout the body.