A process can include forming at least one precursor abrasive component on a core and infiltrating at least a portion of the precursor abrasive component. The precursor abrasive component can include a body including a metal bond matrix and abrasive particles. Infiltrating can be performed after forming the precursor abrasive component with an infiltrant material. The infiltrant material can include a metal element, an alloy or a combination thereof. In an embodiment, forming at least one precursor abrasive component can include simultaneously joining the precursor abrasive component to the core.

Disclosed are an orderly-micro-grooved PCD grinding wheel for positive rake angle processing and a preparation method thereof. A PCD film is deposited on the outer circumferential surface of a wheel hub, and a plurality of microgrooves with high depth-width ratio and micro-grinding units with positive rake angles are orderly provided on the outer circumferential surface of the entire PCD film. The method includes: depositing the PCD film on the outer circumferential surface of the wheel hub by a HFCVD technique; and manufacturing a plurality of microgrooves with a high depth-width ratio (circumferential width: dozens of micrometers; depth: hundreds of micrometers) and an axial length that is equal to the thickness of the grinding wheel and a plurality of micro-grinding units with positive rake angles on the outer circumferential surface of the entire PCD film by water-jet guided laser technique, where the micro-grinding units and the microgrooves are orderly arranged.

A method for producing a machining segment from a first powdered matrix material and first hard material particles arranged according to a defined first particle pattern, includes: applying a powdered supporting material as a supporting layer with a melting temperature higher than the first matrix material, arranging the first hard material particles according to the defined first particle pattern in the supporting material with a depth of penetration, applying a first layer of the first matrix material to the first hard material particles and the supporting material and fusing the first layer by a powder bed fusion method, and performing a sequence of a plurality of steps N times, N1, wherein, in a first step of the sequence, a layer of the first matrix material is applied to the layer structure, and in a second step of the sequence, the layer of the first matrix material is fused by the powder bed fusion method and connected to the layer structure.

A multi blade that processes semiconductor packages into a desired shape while dividing a package substrate includes plural cutting blades that divide the package substrate into the individual semiconductor packages and a spacer provided between two cutting blades adjacent to each other, and is configured in such a manner that the cutting blades and the spacer have the same rotation axis center. The outer surface of the spacer is formed into a transfer shape of the semiconductor package and is covered by an abrasive grain layer, and the upper surface of the package substrate is ground by the outer surface of the spacer simultaneously with cutting of the package substrate by the plural cutting blades.

A rare earth magnet block is cutoff machined into pieces by rotating a plurality of cutoff abrasive blades. Improvements are made by starting the machining operation from the upper surface of the magnet block downward, interrupting the machining operation, turning the magnet block upside down, placing the magnet block such that the cutoff grooves formed before and after the upside-down turning may be aligned with each other, and restarting the machining operation from the upper surface of the upside-down magnet block downward until the cutoff grooves formed before and after the upside-down turning merge with each other.

A saw blade for a machine tool driven oscillatingly about a longitudinal axis has at least one cutting edge, on which, at least in part, abrasive particles are provided. The saw blade is suitable, in particular, for sawing fiber composites.

A multi blade that processes semiconductor packages into a desired shape while dividing a package substrate includes plural cutting blades that divide the package substrate into the individual semiconductor packages and a spacer provided between two cutting blades adjacent to each other, and is configured in such a manner that the cutting blades and the spacer have the same rotation axis center. The outer surface of the spacer is formed into a transfer shape of the semiconductor package and is covered by an abrasive grain layer, and the upper surface of the package substrate is ground by the outer surface of the spacer simultaneously with cutting of the package substrate by the plural cutting blades.

Tool cores may have removable sections, which may be removable without damaging, cutting or severing attachment configurations for the removable sections. The removable sections may be handled simultaneously. Moving parts used to facilitate removal of the removable sections may be secured in a pre-loaded configuration.

A rare earth magnet block is cutoff machined into pieces by rotating a plurality of cutoff abrasive blades. Improvements are made by starting the machining operation from the upper surface of the magnet block downward, interrupting the machining operation, turning the magnet block upside down, placing the magnet block such that the cutoff grooves formed before and after the upside-down turning may be aligned with each other, and restarting the machining operation from the upper surface of the upside-down magnet block downward until the cutoff grooves formed before and after the upside-down turning merge with each other.

A process can include forming at least one precursor abrasive component on a core and infiltrating at least a portion of the precursor abrasive component. The precursor abrasive component can include a body including a metal bond matrix and abrasive particles. Infiltrating can be performed after forming the precursor abrasive component with an infiltrant material. The infiltrant material can include a metal element, an alloy or a combination thereof. In an embodiment, forming at least one precursor abrasive component can include simultaneously joining the precursor abrasive component to the core.