Patent classifications
B24D7/066
GRINDING TOOL AND METHOD OF FABRICATING THE SAME
A method of fabricating a grinding tool includes providing an abrasive particle, and cutting the abrasive particle with a laser beam so that the cut abrasive particle has four tips adjacent to one another, a cavity of a generally cross shape extending between the four tips, and a material discharge surface at an end of the cavity. The laser beam is applied along a plurality of parallel first cutting lines and a plurality of parallel second cutting lines, the second cutting lines intersecting the first cutting lines, at least the first cutting lines being grouped into a first, a second and a third region, the second region being located between the first and third regions, a number of cutting passes repeated along each of the first cutting lines in each of the first and third regions increasing as the first cutting line is nearer to the second region, and the laser beam repeating a plurality of cutting passes along each of the first cutting lines in the second region.
METHOD OF USING POLISHING OR GRINDING PAD ASSEMBLY
A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad, a reinforcement layer or ring, and multiple floor-contacting disks. In another aspect, the reinforcement layer includes a central hole through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension greater than a linear dimension of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape.
Method of using polishing or grinding pad assembly
A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad, a reinforcement layer or ring, and multiple floor-contacting disks. In another aspect, the reinforcement layer includes a central hole through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension greater than a linear dimension of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape.
Apparatus for releasably coupling abrasive tools to a drive plate of a floor-treating machine
A drive plate attachable to a driven shaft of a floor-finishing machine has a central circular recess and a plurality of radially extending pockets having beveled side edges formed in a surface thereof. Located in the pocket is a rectangular stabilizing bar. The abrasive tool includes a plate sized and shaped to fit into the pockets when inserted from the central recess and having a groove formed therein for receiving the stabilizing bar. On the surface of the tool plate opposite the groove are abrasive members.
A Transmission Arrangement for a Floor Surfacing Machine Comprising a First and Second Idle Pulley, Both Pivotable Around a Common Pivot Axis
A transmission arrangement (113) comprising a first axle (24) that is rotatable about a first axis (33) and is connected to a first pulley (25) that is arranged to drive an endless power transferring means (26) that further is adapted to drive a second pulley (27) that is rotatable about a second axis (34), where the transmission arrangement (113) comprises a first idle pulley (101) and a second idle pulley (102) which both are adapted to guide the endless power transferring means (26), where the first idle pulley (101) is rotatable around a first idle pulley axis (103) and the second idle pulley (102) is rotatable around a second idle pulley axis (104), where the distance between the idle pulley axes (103, 104) is fixed and where the idle pulley axes (103, 104) are pivotable around a common pivot axis (105), wherein the first pulley (25) is positioned between the idle pulleys (101, 102) and the second pulley (27) such that a distance between any one of the idle pulley axes (103, 104) and the second axis (34) exceeds a distance between any one of the idle pulley axes (103,104) and the first axis (33).
Conditioning wheel for polishing pads
The present disclosure describes a chemical mechanical planarization system that includes a pad on a rotating platen, a wafer carrier configured to hold the wafer surface against the pad and apply pressure to the wafer, a slurry dispenser configured to dispense slurry on the pad, and a conditioning wheel configured to condition the pad. The conditioning wheel further includes a base and one or more flexible structures attached to the base with each flexible structure having an elastic body configured to exert a downforce on a feature of the pad, where the downforce is proportional to the height of the feature.
Grinding apparatus
A grinding apparatus includes: a holding table for holding a workpiece thereon; a grinding unit including a grinding wheel for grinding the workpiece held on the holding table, the grinding wheel including a grinding stone made of abrasive grains and grains of photocatalyst bonded by a vitrified bonding material; a grinding water supply unit configured to supply grinding water to the grinding stone when the workpiece held on the holding table is ground by the grinding unit; and a light applying unit disposed adjacent to the holding table and configured to apply light to a grinding surface of the grinding stone while the workpiece held on the holding table being ground.
Polishing system and a polishing tool comprising said polishing system
The present invention relates to a polishing system (100) for providing a polishing finish to a concrete surface, said system comprises a pad lock (2) which, one a second surface (6) thereof, comprises a number of protrusions (32) which are able to enter into engagement with a voids (16) arranged on a first surface (12) of a pad (10) placed between a fixing ring and said pad lock. The use of such a system provides a higher degree of integrity during use of said polishing system.
ABRASIVE ARTICLE AND METHOD OF USE
An abrasive article including a first abrasive body coupled to a substrate, the first abrasive body having abrasive particles including a superabrasive and a bond material including a vitreous material and a second abrasive body coupled to the substrate, the second abrasive body having abrasive particles including a superabrasive and a bond material including at least one non-vitreous phase material, and as wear rate differential between the first abrasive body and second abrasive body of at least 0.08 cc.
Grinding tool and method of fabricating the same
A grinding tool includes a substrate, and at least an abrasive particle affixed to the substrate. The abrasive particle has a base, and four tips adjacent to one another protruding from the base, the base having a cavity of a generally cross shape extending between the four tips, the cavity including a material discharge surface disposed between two adjacent ones of the four tips, the material discharge surface being located at an end of the cavity and adjacent to a side surface of the base, an inner material angle between the material discharge surface and the side surface being between about 120 degrees and about 160 degrees. Moreover, embodiments described herein include a method of manufacturing the grinding tool.