Disclosed are window-mounted polishing pad. Since thermal fusion method and vibration fusion method are not applied while window is inserted into and attached to polishing pad, polishing pad is not deformed and polishing slurry does not leak through a gap between window and the polishing pad. A method of manufacturing the window-mounted polishing pad is also disclosed. The window-mounted polishing pad includes: polishing layer in which first punched hole is formed in thickness direction; window that is inserted into and fixed to the first punched hole of polishing layer; lower support layer; adhesive layer that mediates bonding of polishing layer and lower support layer; a sealing adhesive member positioned between the window and adhesive layer.

Provided is a polishing pad which is capable of providing a high flatness to a polishing workpiece and suppressing the formation of scratches, and a method therefor. The polishing pad comprises a foamed urethane sheet on the surface which includes closed cells and open cells and which satisfies the following requirements: (1) an open cell ratio is 20-80 vol % where the total volume of closed cells and open cells is taken as 100 vol %, (2) the ratio [tan (wet/dry) ratio] of a loss factor tan in a water-absorption state to that in a dry state is 1.3-1.7, the loss factors being measured according to JIS K7244-4 with an initial load of 20 g at a measuring frequency of 1 Hz at a temperature of 26 C. in a tensile mode over a strain range from 0.01 to 0.1%, and (3) the Shore DO hardness according to ASTM D2240 is 60-80.

A polishing pad has a polishing layer that is formed of a polyurethane foam having fine cells. The polyurethane foam is a reaction cured body of a chain extender and an isocyanate-terminated prepolymer which is obtained by reacting a prepolymer starting material composition that contains an isocyanate component, a high molecular weight polyol and an aliphatic diol. The high molecular weight polyol contains a polyalkylene glycol A that has a peak of the molecular weight distribution within the range of 200 to 300 and a polyalkylene glycol B that has a peak of the molecular weight distribution within the range of 800 to 1200.

Provided are buffing pads that have intertwined seams such that any hard or unyielding edges are covered and not exposed during a buffing or polishing process. A double-sided buffing pad for polishing surfaces comprises a backing plate; two fibrous buffing media with filaments of textiles extending therefrom that are affixed one media to each face of the backing plate; and a seam that is intertwined by a portion of the filaments from each media are intertwined. The filaments may be intertwined by needle-tacking, air entanglement, or hydro-entanglement.

The polishing pad according to an embodiment comprises a multifunctional low-molecular-weight compound as one of the polymerization units of the polyurethane-based resin that constitutes the polishing layer, thereby reducing the unreacted diisocyanate monomer in the production process to enhance the processability and quality and to increase the crosslinking density. Thus, the polishing pad may be applied to a process of preparing a semiconductor device, which comprises a CMP process, to provide a semiconductor device such as a wafer of excellent quality.