A polishing or grinding pad with a multilayer reinforcement is provided. In one aspect, a floor polishing or grinding pad assembly employs a flexible pad, at least two reinforcement layers or rings with different characteristics, and multiple floor-contacting tools such as abrasive disks. In another aspect, a workpiece polishing or grinding pad assembly includes a flexible and rotatable pad, a polymeric reinforcement layer coupled to the pad and a metallic reinforcement layer to which are coupled abrasive tools. In yet another aspect, a floor-facing reinforcement is more flexible than a pad-facing reinforcement which is more rigid.

The present disclosure relates to a tool for sanding and buffing an irregularly shaped surface that includes a head having a rounded surface, a first abrasive material adapted for sanding or buffing, the first abrasive material attached to the rounded surface via an adhesive substance or other attaching means and at least partially covering the rounded surface, and a handle attached to the head. The tool may further include a second abrasive material attached to the rounded surface via the adhesive substance or other attaching means that at least partially covers a portion of the rounded surface not covered by the first abrasive material. If the first and second abrasive materials have varying properties such as their coarseness, the user may find each material to be especially efficient for use in separate sanding, buffing, or polishing processes.

An abrasive article and method of making same wherein the abrasive article comprises a mounting assembly and an abrasive attachment assembly wherein the first interlock member of the mounting assembly and the second interlock member of the abrasive attachment assembly are configured to align the central axis of the abrasive attachment assembly and the central axis of the mounting assembly, and the first interlock member releasably engages the second interlock member. The abrasive article is adapted to clean a work surface area around studs using a rotary tool, including, for example, a drills or die grinder.

A polishing machine is described in which a surface treatment tool is moved across the surface of a workpiece in accordance with a predefined tool-path, in order to carry out the desired treatment process. The tool-path is non-periodic and preferably pseudo-random. Various techniques are described for generating data representing the tool-path to be followed. A technique is also described for determining optimum control parameters used to control the polishing machine for a given tool-path. The surface treatment may be a shaping technique in which material is removed from the surface, or a technique for adding material to the surface of the workpiece, or a technique for modifying the surface or a region under the surface of the workpiece.

A tool for fine machining surfaces has a working medium carrier with a top face and a bottom face, wherein the bottom face is an attachment side. A set of individual exchangeable strip-shaped lamella holders are provided that each have one or more lamellas in individual or bundled arrangement. The lamellas each are oriented away from the attachment side of the working medium carrier and form in a downward direction remote from the attachment side a common working plane. The lamella holders on a side facing the attachment side are provided with first hooking members and the attachment side of working medium carrier is provided with second hooking members complementary to the first hooking members. The first and second hooking members are joined to each other in a direction perpendicular to the attachment side.

A wiping system for a robotic repair unit is presented that includes a motive robot arm with a motor, a connection mechanism coupled to the motive robot arm, and a wiping medium coupled to the connection mechanism. The wiping medium includes a base layer and a plurality of features extending from the base layer. The motive robot arm, powered by the motor, moves the wiping medium. The motive robot arm is configured to move the wiping medium toward, or away from, a worksurface. The motive arm is configured to press the wiping medium toward the worksurface during a wiping operation. During the wiping operation, the wiping medium is driven by a wiping motor against the surface.

A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125 or more and less than 180. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, Spring Hardness Test Type C Testing Method. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.

An elastic self-lubricating polishing tool includes an elastic grinding layer including an abrasive member and an elastic base layer affixed to the abrasive member, an absorbing layer absorbing and sustainedly releasing liquid inside of the absorbing layer, and an adhesive layer overlappedly connected with the elastic base layer of the elastic grinding layer and the absorbing layer. The elastic self-lubricating polishing tool is elastic and self-lubricating to sand and polish a surface of a workpiece.

A tool for removing fusion bonded epoxy coating from the surface of a pipe has an elongate rotatable shaft suitable for being received in a rotating tool holder of a machine. Extending radially outward of the distal end of the shaft are a plurality of fingers, the outer ends of which are spaced apart. Each of the fingers is made of a spring metal, and at the distal end of each finger is an abrasive pad having diamond particles embedded in soft metal. Spring force is independently applied by each spring finger to its associated abrasive pad.

There is provided a surfacing station for processing of surfaces of optical elements as workpieces, including a processing unit configured to process surfaces of optical elements; a controller unit configured to communicate with a database containing processing protocols, which can be carried out by the surfacing station, and to control operation of the processing unit in accordance with the processing protocols; and an identification tag base configured to communicate with the controller unit and configured to determine identification tags of consumable items used by the surfacing station, the controller unit being configured to enable a surfacing protocol for processing of the optical elements as workpieces in function of an identified consumable item.