A polishing pad for polishing a surface, material for a polishing pad and a method for manufacturing material for a polishing pad. A polishing pad has a backing layer and a polishing layer made of sheep wool fibres fixed onto a surface of the backing layer, wherein the polishing layer has loops made of sheep wool fibres.

The invention relates to a polishing disc for a tool for fine processing optically active surfaces on spectacle lenses, having a main body which has a central axis and to which an intermediate layer that is softer than the main body and is made of a resilient material is secured, a polishing medium carrier resting on the intermediate layer. The intermediate layer has at least two regions with different degrees of hardness, said regions being arranged one behind the other in the direction of the central axis of the main body. The intermediate layer region adjoining the main part is softer than the intermediate layer region on which the polishing medium carrier rests.

A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.

The quick connector cleaning wand directly connects a cleaning towel to a hand-operated cleaning wand. The quick connector is located around the periphery of the cleaning wand to provide balanced and even mechanical movement of the attached towel. The present invention provides an interface between a hand polisher and cleaning or polishing towels in order to take advantage of the mechanical action of the machines to provide faster and more efficient use of towels. An exemplary embodiment of the present invention is a towel quick connector cleaning wand having of a plurality of retaining apertures for attaching and securing a towel.

A polishing pad is provided. The polishing pad comprises a polishing layer and a metal-containing layer. The polishing layer has a polishing surface and a backside surface opposite to each other, wherein the backside surface has a plurality of cavities. The metal-containing layer is disposed on the backside surface of the polishing layer and fills into the cavities, wherein a first contact area is between the metal-containing layer and the backside surface of the polishing layer, and the first contact area is larger than the orthogonal projection area of the polishing layer.

The present disclosure describes a chemical mechanical polishing device and a chemical mechanical polishing method. The chemical mechanical polishing device includes: a cleaning apparatus and a polishing pad conditioner disc positionally configurable relative to the cleaning apparatus, where the cleaning apparatus includes: a cleaning disc; a pre-polishing pad disposed inside the cleaning disc and configured to perform a pre-polishing operation of the polishing pad conditioner disc when positioned in contact with the polishing pad conditioner disc; a pre-polishing grinding liquid dispensing assembly disposed on a side edge of the cleaning disc and configured to supply a pre-polishing grinding liquid to the pre-polishing pad; and a rotation driver configured to drive the pre-polishing pad to rotate during the pre-polishing operation. The present disclosure beneficially reduces wafer scratches and increases evenness of distribution of a grinding liquid during polishing.

A weather-resistant polishing pad, including an upper layer operating for polishing, a buffer layer, and a transparent base. The buffer layer is disposed between the upper layer and the transparent base, and the upper layer, the buffer layer, and the transparent base are bonded via a pressure sensitive adhesive or an adhesive agent. The upper layer includes a weather-resistant polyurethane prepolymer, a curing agent, and a functional filler. The polyurethane prepolymer is a polymerization product of polyol and polyfunctional isocyanate. The polyfunctional isocyanate includes a first isocyanate containing no benzene ring, or the first isocyanate having an isocyanato group and a benzene group, and the isocyanato group and the benzene group are connected indirectly.

An operation control unit includes a storage device storing a program which includes commands of: obtaining a correlation between a supply position of the polishing liquid in the radial direction of the polishing pad using the liquid injection nozzle and an average polishing rate of the substrate and an distribution of the polishing rate within the substrate; determining a movable range of the liquid injection nozzle according to a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate; determining an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle; and moving the liquid injection nozzle to the determined supply position to polish the substrate.

A method for the zonal polishing of a workpiece includes using a polishing tool to guide a structured polishing pad over the surface of workpiece to remove material from the workpiece. A structured polishing pad includes a structuring adapted to the movement of a polishing tool.

The invention is a highly-efficient apparatus and system for removing impurities and debris from wheel components in a time-optimized and cost-controlled manner to ensure consistent results. The system is a single integrated tool on which employees can be quickly trained to perform all wheel cleaning functions by using the tool's components in any order, increasing the probability that all operations will be performed.