Sanding pads are disclosed. A sanding pad has at least about 1/32 inch thickness, having one top flat surface and an opposite flat bottom surface. The top and bottom surfaces are capable of providing attachment for an abrasive material, such as a pressure adhesive sand paper. The sanding pad is formed of various geometric shapes and made from an expanded PVT material which has a Shore D durometer hardness value between 30 and 60. The sanding pad comes in a kit that includes several sanding pads, each of a different shape and situated purpose.

There is provided a surfacing station for processing of surfaces of optical elements as workpieces, including a processing unit configured to process surfaces of optical elements; a controller unit configured to communicate with a database containing processing protocols, which can be carried out by the surfacing station, and to control operation of the processing unit in accordance with the processing protocols; and an identification tag base configured to communicate with the controller unit and configured to determine identification tags of consumable items used by the surfacing station, the controller unit being configured to enable a surfacing protocol for processing of the optical elements as workpieces in function of an identified consumable item.

An abrasive rotary tool includes a tool shank defining an axis of rotation for the rotary tool, and an abrasive external working surface. The abrasive external working surface includes a resin, and a plurality of porous ceramic abrasive composites dispersed in the resin, the porous ceramic abrasive composites including individual abrasive particles dispersed in a porous ceramic matrix. At least a portion of the porous ceramic matrix comprises glassy ceramic material. A ratio of the average porous ceramic abrasive composite size to the average individual abrasive particle size is no greater than 15 to 1.

An abrasive rotary tool includes a tool shank a flexible planar section positioned opposite the tool shank. The flexible planar section forms a first abrasive external surface on a first side of the flexible planar section and a second abrasive external surface on a second side of the flexible planar section. The flexible planar section facilitates abrading, corners of a workpiece across multiple angles relative to the axis of rotation for the rotary tool through bending of the flexible planar section when the abrasive external surfaces are applied to a corner of the workpiece.

A method is disclosed for maintaining a hard surface, the method comprising treating the surface with a flexible pad (1), in the presence of abrasive particles, bonded to the pad, on a contact surface between the pad (1) and the hard surface. The abrasive particles comprise diamond particles, and the treating is performed in the absence of an effective amount of crystallization agent on the contact surface. A tool for use in the method is also provided, as well as a floor surfacing machine comprising such a tool and a method for manufacturing such a tool.

A platen for a metallographic grinder has an outer peripheral rim with an upper surface having a lower height. Also, fingers engaging a specimen are allowed to move laterally (i.e., wobble) to minimize the tipping forces on the specimen during the grinding process. Either one or both of these structures can be employed and results in a much flatter specimen surface for use in subsequent analysis.

A polishing pad for polishing a surface, material for a polishing pad and a method for manufacturing material for a polishing pad. A polishing pad has a backing layer and a polishing layer made of sheep wool fibres fixed onto a surface of the backing layer, wherein the polishing layer has loops made of sheep wool fibres.

The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80 and no greater than 98.

The present disclosure describes a chemical mechanical polishing device and a chemical mechanical polishing method. The chemical mechanical polishing device includes: a cleaning apparatus and a polishing pad conditioner disc positionally configurable relative to the cleaning apparatus, where the cleaning apparatus includes: a cleaning disc; a pre-polishing pad disposed inside the cleaning disc and configured to perform a pre-polishing operation of the polishing pad conditioner disc when positioned in contact with the polishing pad conditioner disc; a pre-polishing grinding liquid dispensing assembly disposed on a side edge of the cleaning disc and configured to supply a pre-polishing grinding liquid to the pre-polishing pad; and a rotation driver configured to drive the pre-polishing pad to rotate during the pre-polishing operation. The present disclosure beneficially reduces wafer scratches and increases evenness of distribution of a grinding liquid during polishing.

A buffing pad assembly having a buffing pad, an attachment means, and an insert (e.g., plastic ring) is provided. In one embodiment, a channel is cut into a side of the buffing pad, creating first and second side portions. The attachment means is then affixed (glued) to a back surface of the buffing pad and the insert is centered on an upper surface of the attachment means. The insert is then heated, affixing it to the upper surface of the attachment means. The insert is then deformed (while it is still pliable) into an L-shape, forming a cavity on the backside of the buffing pad assembly. And because the insert is affixed to the attachment means, and the attachment means is affixed to the buffing pad, deforming the insert results in deforming the back surface of the buffing pad, while maintaining a flat front surface.