An example test head manipulator includes a tower having a base and a track, where the track is vertical relative to the base, and arms to enable support for the test head. The arms are connected to the track to move the test head vertically relative to the tower, and the arms are configured to control rotation of the test head. Each of the arms includes a cam that is rotatable, and at least one plunger in contact with the cam and that is configured to contact the test head. Rotation of the cam is controllable to move the at least one plunger to offset an uncontrolled rotation the test head.

A device for removing a framed wafer from a wafer tray is described. The wafer tray including a wafer receptacle for receiving the framed wafer. The wafer receptacle being configured to hold the wafer perpendicular to the wafer plane and to remove it from the wafer tray in this manner. The wafer receptacle including at least one wafer receptacle edge contact element arranged and configured to abut against the front frame edge. The device including a drive and control device configured to guide the wafer receptacle along a predetermined path of movement into the access to the wafer tray. Each wafer receptacle edge contact element is spring-mounted in the direction of the path of movement and the wafer receptacle is movable from a first position to a second position.

The disclosure relates to a rotary driving tool for handling closure elements on vehicle containers for holding operating fluids, which are fed into the respective circuits and containers of the vehicles in the manufacturing process of the vehicles on assembly lines of the automotive industry by robot-based assemblies arranged on the assembly line from filling systems via connecting lines and adapters, wherein the robot-based assemblies are displaceable in operation between a home position and a filling position and have at least one robot arm. It is the problem of the disclosure to create such a rotary driving tool that enables automated handling of the closure elements even in confined or poorly accessible installation spaces. This problem is solved in that the rotary driving tool has a plate-shaped base body, a centric gripper, a drive motor, a first pneumatic compensating element for deviations in the XY plane and a second pneumatic compensating element for deviations in the Z direction, wherein specific designs and arrangements are proposed for these assemblies.

An electromechanical system operates in part through physical interaction with an operator, and includes a multi-axis robot, a controller, and a counterbalance mechanism connected to the robot. The counterbalance mechanism includes a base structure connected to a set of linkages, a pneumatic cylinder, a spring-loaded cam assembly, and an optional constant force spring. The linkages form a four-bar parallelogram assembly connectable to a load. The cylinder and cam assembly, and optional constant force spring, each impart respective vertical forces to the parallelogram assembly. The forces combine to provide gravity compensation and self-centering functions or behaviors to the load, enabling the load to move with a vertical degree of freedom when manually acted upon by the operator, and to return the load to a nominal center position.

The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics. The apparatus, system and method of providing at least a planar alignment of at least one component or device in relation to a secondary reference plane may include at least: a frame and stator assembly, having, at an upper portion thereof, at least a semi-spherical receiving interface; a movable assembly that moves within the frame and stator assembly, and that is connectively associated therewith by at least a plurality of springs; a semi-spherical stage, suitable for reception by the semi-spherical receiving interface and capable of at least rotational movement therewithin; a chuck within the semi-spherical stage and capable of at least co-planar, post-planar, and ante-planar positioning in relation to a plane provided by a topmost portion of the semispherical stage, wherein the chuck is capable of receiving the component or device; and at least two gripper jaws suitable for receiving and holding, at an upper portion thereof, the component or device, wherein the two gripper jaws comprise, at a lower portion thereof, at least ramps capable of physically interacting with ones of the motion stops.

The present disclosure shows a device for the automated establishment of a plug-in connection of a plug arranged at a cable to a plug mating element, such as for cabling battery modules, and in the manufacture of vehicles having hybrid and/or electric drives, comprising: a gripper for gripping the plug, a handling unit having a plurality of axes for moving the gripper, with it being a multi-axis robot and/or a surface portal, and a control for controlling the gripper and the handling unit. Provision is made in this process that the gripper comprises a plug-in actuator for moving the plug into a plugged-in position with the plug mating element.

A device for inserting the blind fastener in the fastening site, a pulling and extracting device for swaging the blind fastener in the fastening site and a passive compliance device that binds the inserting device to the pulling and extracting device. The passive compliance device allows the installation of the bind fastener without sensors.

A vibration reduction assembly (24) for reducing a magnitude of a vibration being transferred from a first component (14) (e.g. a robot assembly) to a second component (12) (e.g. a payload) includes a first vibration reduction system (30) and a second vibration reduction system (32). The first vibration reduction system (30) reducing vibration along a first axis that is oriented parallel with gravity. The second vibration reduction system (32) reducing vibration along a second axis that is orthogonal to the first axis. The first vibration reduction system (30) and the second vibration reduction system (32) are connected in series between the first component (14) and the second component (12).

A power supply apparatus includes: a power supply portion connected to a power receiving portion of an electrical apparatus and configured to supply electric power to the power receiving portion; an arm including a tip end at which the power supply portion is provided, the arm further including at least one of a linear motion joint portion and a rotational joint portion; and a controller. The controller controls at least one of the linear motion joint portion and the rotational joint portion to move the arm such that the power supply portion is connected to the power receiving portion.

A device for removing a framed wafer from a wafer tray is proposed, said wafer tray including an access for depositing or removing the framed wafer, wherein the deposited framed wafer has a front frame edge facing the access and the wafer tray includes at least one wafer tray edge contact element for abutting against the rear frame edge, comprising a wafer receptacle for receiving the framed wafer, the wafer receptacle being configured to hold the wafer perpendicular to the wafer plane and to remove it from the wafer tray in this manner and including at least one wafer receptacle edge contact element arranged and configured to abut against the front frame edge, and with a drive and control device configured to guide the wafer receptacle along a predetermined path of movement into the access to the wafer tray and out of it, wherein each wafer receptacle edge contact element is spring-mounted in the direction of the path of movement and the wafer receptacle is movable from a first position, in which each wafer receptacle edge contact element is located at a distance in front of the front frame edge, to a second position, in which each wafer receptacle edge contact element abuts against the front frame edge, the rear frame edge abuts against the wafer tray edge contact element and the spring mounting of each wafer receptacle edge contact element is compressed by a predetermined spring travel, and back. A method for removing a framed wafer from a wafer tray is also proposed.