A glazing panel removal device comprising a winder unit having first and second winder spools for winding a cutting filament and a drive, for driving the winder spools. The drive means includes a single or common drive input for driving both the first and second winder spools. The drive may be a rotary input drive, and driving the rotary input in a first rotary direction may cause winding of the filament onto the first winder spool and driving the rotary input in the opposite direction causes winding of the filament onto the second winder spool.

A cutting device includes a tool drive, cutting tool having first and second connecting parts respectively connected to first and second followers, and a guiding device, that includes a first guiding unit with first and second guiding modules. The first guiding module includes guiding wheels, which are held each by related bearing devices rotatable in a guiding plane, peripherally adjacent to each other at a first transfer position. The guiding wheels include an outwardly open receiving opening suitable for receiving the first follower, rotatable by the tool drive in opposite directions with the same angular velocity. The guiding wheels are arranged so that their receiving openings lie opposite one another at the first transfer position after each revolution, so that the first follower is transferable alternately from one receiving opening into the other at the first transfer position and is guidable alternately along the periphery of the a guiding wheel.

A cutting device includes a tool drive, cutting tool having first and second connecting parts respectively connected to first and second followers, and a guiding device, that includes a first guiding unit with first and second guiding modules. The first guiding module includes guiding wheels, which are held each by related bearing devices rotatable in a guiding plane, peripherally adjacent to each other at a first transfer position. The guiding wheels include an outwardly open receiving opening suitable for receiving the first follower, rotatable by the tool drive in opposite directions with the same angular velocity. The guiding wheels are arranged so that their receiving openings lie opposite one another at the first transfer position after each revolution, so that the first follower is transferable alternately from one receiving opening into the other at the first transfer position and is guidable alternately along the periphery of the a guiding wheel.

A diamond-wire dicing machine includes a machine chassis, which includes a bottom support. A base extends upwards from the bottom support. A plurality of tension regulation arms are arranged on the base and are each provided with a tension roller. A plurality of guide rollers are also arranged on the base. The tension rollers and the guide rollers are spaced from each other. A plurality of wire winding/releasing devices are respectively arranged at two sides of the base and are each provided with a wire winding/unwinding wheel. A diamond wire extends through the tension rollers, the guide rollers, and the wire winding/unwinding wheels, and the surface of the diamond wire is provided with diamond particles. The wire winding/releasing devices are operable to take up and release the diamond wire for reciprocally moving the diamond wire to bring new ones of the diamond particles to contact and cut a wafer.

A diamond-wire dicing machine includes a machine chassis, which includes a bottom support. A base extends upwards from the bottom support. A plurality of tension regulation arms are arranged on the base and are each provided with a tension roller. A plurality of guide rollers are also arranged on the base. The tension rollers and the guide rollers are spaced from each other. A plurality of wire winding/releasing devices are respectively arranged at two sides of the base and are each provided with a wire winding/unwinding wheel. A diamond wire extends through the tension rollers, the guide rollers, and the wire winding/unwinding wheels, and the surface of the diamond wire is provided with diamond particles. The wire winding/releasing devices are operable to take up and release the diamond wire for reciprocally moving the diamond wire to bring new ones of the diamond particles to contact and cut a wafer.

The cutting-off and grinding integrated machine includes a machine body, a feeding component, a blanking component, a cutting-off component, a grinding component, and a transfer component. The cutting-off component, the feeding component, the grinding component and the blanking component are juxtaposed in the machine body in a width direction of the machine body; the grinding component includes plane grinding components and chamfer grinding components, the chamfer grinding components and the plane grinding components are integrally disposed, and the feeding component and the blanking component are both movable in a length direction of the machine body; and the transfer component includes a manipulator movable in the width and height directions of the machine body, and a blanking position of the feeding component, a feeding position of the blanking component and machining positions of the cutting-off component and the grinding component are all located on a moving path of the manipulator.

The cutting-off and grinding integrated machine includes a machine body, a feeding component, a blanking component, a cutting-off component, a grinding component, and a transfer component. The cutting-off component, the feeding component, the grinding component and the blanking component are juxtaposed in the machine body in a width direction of the machine body; the grinding component includes plane grinding components and chamfer grinding components, the chamfer grinding components and the plane grinding components are integrally disposed, and the feeding component and the blanking component are both movable in a length direction of the machine body; and the transfer component includes a manipulator movable in the width and height directions of the machine body, and a blanking position of the feeding component, a feeding position of the blanking component and machining positions of the cutting-off component and the grinding component are all located on a moving path of the manipulator.

A windshield removal tool for removing a windshield from a vehicle may include a main plate having a large orifice and two smaller circular orifices extending therethrough; a pair of rotatable spools supported within a respective smaller orifice, such that the spools each extend outward from the top surface of the main plate; a handle mounted to the top surface of the main plate; a suction cup engaged with the large orifice, such that the suction cup extends outward from the bottom surface of the main plate; a clevis pin removably engaged with at least one of the rotatable spools; an adapter port extending into a top surface of each of the rotatable spools, the adapter port configured to removably accommodate insertion of an external tool therein, the external tool configured to rotate the spool; and a cord operatively attached to and extending between the spools.

A windshield removal tool for removing a windshield from a vehicle may include a main plate having a large orifice and two smaller circular orifices extending therethrough; a pair of rotatable spools supported within a respective smaller orifice, such that the spools each extend outward from the top surface of the main plate; a handle mounted to the top surface of the main plate; a suction cup engaged with the large orifice, such that the suction cup extends outward from the bottom surface of the main plate; a clevis pin removably engaged with at least one of the rotatable spools; an adapter port extending into a top surface of each of the rotatable spools, the adapter port configured to removably accommodate insertion of an external tool therein, the external tool configured to rotate the spool; and a cord operatively attached to and extending between the spools.

There is provided a solar panel disassembling apparatus. The solar panel disassembling apparatus includes: a first fixing plate and a second fixing plate that hold both surfaces of the solar panel, respectively, in a state of having a distance from each other without coming into close contact with each other such that bond lines at a perimeter of the bonding surface are exposed: a moving unit that moves the first fixing plate and the second fixing plate in a parallel direction parallel to the bonding surface; and a wire-shaped cutting blade that is disposed in front of the solar panel in a movement direction of the solar panel to be parallel to the bonding surface and cuts the bonding surface, while passing through the bond line exposed toward the front between the first fixing plate and the second fixing plate.