Patent classifications
B26D3/065
Mechanical locking system for floor panels
Floor panels are shown, which are provided with a mechanical locking system that may be locked with a vertical displacement of a first panel against a second panel. The locking system includes a flexible strip that during locking bends upwardly or downwardly. The locking system includes a first and a second joint edge section with different locking functions. One section provides a horizontal locking and another section provides a vertical locking.
LCD SCREEN POLARIZER CUTTING DEVICE
An LCD screen polarizer cutting device includes a cutting unit and a shoveling unit mounted on a control carrier. The cutting unit includes a first and a second cutter arrayed side by side with a space formed between them. The shoveling unit is located behind the cutting unit and includes a first and a second shovel blade. The second shovel blade is located behind the first shovel blade and has a flat end section. Both of the first and the second shovel blade are located corresponding to the space between the first and the second cutter. The cutting unit cuts the LCD screen polarizer and, the shoveling unit shovels up a waste polarizer strip and a glue layer produced after the cutting. By pre-forming a cut groove on the LCD screen polarizer, the LCD screen can be easily cut subsequently to ensure good cutting flatness and upgraded production yield.
Multi-pack container and machine for manufacturing the same
The invention relates to a multi-pack container which defines a series of containers (11) formed in a plastic sheet (L) that comprises at least a layer of PET (polyethylene terephthalate), and in which said containers (11) are joined by bridges (12), provided with a pre-cut upper line (13) and a pre-cut lower line (14) for breaking the bridge (12). The pre-cut upper line (13) and a pre-cut lower line (14) are arranged parallel to one another, laterally separated in a horizontal direction and vertically separated to prevent heating by compression and a variation of the properties of the PET layer, allowing for clean breakage of the bridge by rotating the containers with respect to said pre-cut upper and lower lines. The invention also comprises a machine for manufacturing the multi-pack container.
METHOD OF PROCESSING WORKPIECE
A method of processing a workpiece includes holding a face side of the workpiece on a holding table having a region made of a transparent material and forming a processed groove in the workpiece with a cutting blade. The forming a processed groove includes capturing an image of the processed groove on a reverse side and the face side of the workpiece, and detecting whether a position of a first central line of the processed groove on the reverse side and a position of a second central line of the processed groove on the face side are in conformity in a predetermined plane. If the positions of the first and second central lines are not in conformity, then the forming a processed groove further has correcting a position of the center of the cutting blade in order to bring the positions of the first and second central lines into conformity.
PACKAGING MATERIAL AND METHOD FOR PROVIDING A PACKAGING MATERIAL
A packaging material having a core layer and inside and outside laminate portions is provided. The packaging material comprises a first area to form a first package, and a second area to form a second and adjacent package. The first area and the second area have a transversal sealing area between them, and the core layer is provided with at least one weakening portion at the transversal sealing area.
WORKPIECE PROCESSING DEVICE AND METHOD
A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
WORKPIECE PROCESSING DEVICE AND METHOD
A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
WORKPIECE PROCESSING DEVICE AND METHOD
A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
WORKPIECE PROCESSING DEVICE AND METHOD
A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
Cutting apparatus
A cutting apparatus includes a processing feed direction determining mechanism. The processing feed direction determining mechanism includes an imaging unit that images a region including a cut groove and a recording unit that records chipping data of the imaged cut groove. The recording unit records first chipping data of a cut groove formed by cutting a workpiece from a first direction, second chipping data of a cut groove formed by cutting the workpiece from a direction opposite from the first direction, third chipping data of a cut groove formed by cutting the workpiece from a second direction orthogonal to the first direction, and fourth chipping data of a cut groove formed by cutting the workpiece from a direction opposite from the second direction.