A peeling apparatus includes an ingot holding unit holding an ingot in a hanging state where a portion of the ingot to be peeled off as the wafer is directed downwardly, a water container containing water therein, an ultrasonic unit immersed in the water in the water container, a moving unit moving the ingot holding unit vertically into a position where the ingot holding unit faces the ultrasonic unit and at least the portion of the ingot to be peeled off as the wafer is immersed in the water in the water container, and a nozzle ejecting water to the portion of the ingot to be peeled off as the wafer thereby to promote the peeling of the wafer from the ingot.

A coating removing device includes a main body that includes a blade used for coating removal; a gripping section that grips an optical fiber; and a slider that connects the main body and the gripping section together so as to be able to approach or separate from each other. The coating removing device removes a coating from the optical fiber by separating the main body and the gripping section after an incision has been made in the coating of the optical fiber using the blade. The slider includes a retention unit to retain the main body and the gripping section in a maximum separation state.

An apparatus for and method of removing a protecting synthetic coating (1) from an elongated element (2) in the form of an optical fiber (3) surrounded by the coating wherein a cut (8) is created into the coating by knife edges (6). The element is displaced with respect to the knife edges in the longitudinal direction of the element for displacing coating material (17) by the knives. At least one drop of liquid (12) with wetting properties is supplied to the cut for being sucked into a space created between the coating and the optical fiber during the displacement for acting as a lubricant for sliding the coating along the fiber to remove the coating from the fiber.

Blade for a stripping and peeling tool for stripping and peeling a pre-insulated pipe.

A fuel source shaving device and method(s) of use is described. Embodiments of the fuel source shaving device can include, but is not limited to, a housing, a blade, and a bore passing through the housing. The fuel source shaving device can be implemented to create ribbons and/or shavings of material from a fuel source to aid in starting a fire.

A mold separation device includes a carrying mechanism, a scraping mechanism, and two separation mechanisms. The carrying mechanism is adapted to carry a first mold and a second mold bonded to the first mold. The scraping mechanism is disposed at an edge of the carrying mechanism and is adapted to scrape off a spilled glue produced when the first mold is bonded to the second mold. The separation mechanisms are disposed at the edge of the carrying mechanism and are located on two opposite sides of the scraping mechanism. The separation mechanisms are adapted to pull open the first mold and the second mold so that the first mold and the second mold are separated from each other.

A peeling apparatus includes an ingot holding unit holding an ingot in a hanging state where a portion of the ingot to be peeled off as the wafer is directed downwardly, a water container containing water therein, an ultrasonic unit immersed in the water in the water container, a moving unit moving the ingot holding unit vertically into a position where the ingot holding unit faces the ultrasonic unit and at least the portion of the ingot to be peeled off as the wafer is immersed in the water in the water container, and a nozzle ejecting water to the portion of the ingot to be peeled off as the wafer thereby to promote the peeling of the wafer from the ingot.

A peeling device for insertion in a bowl of an electrical kitchen appliance includes a frame, a grater, and contact surfaces for a drive component of the kitchen appliance which cause the peeling device to rotate during operation of the kitchen appliance. A kitchen appliance with a bowl and a bowl bottom, wherein a cutting component are provided inside the bowl, and further include the peeling device.

A heat chamfering apparatus. A support unit supports a glass panel. A heat chamfering unit heat-chamfers an edge of the glass panel by applying thermal shock thereto. The support unit includes a contact support portion supporting the glass panel while in contact with the glass panel and a base portion configured to support the contact support portion. The contact support portion is formed from a first material. The base portion is formed from a second material. The first material has a smaller change in temperature due to lower thermal conductivity and a smaller change in size at high temperature due to a smaller coefficient of thermal expansion while being more ductile due to lower hardness, compared to the second material. In a heat chamfering method, a glass panel is located on a support unit, and an edge of the glass panel is heat-chamfered by applying thermal shock thereto.

A cutting device is for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate, a first active material layer, and a second active material layer, the cutting device including: a process unit that causes a cutting blade to cut the first active material layer and the current collector plate; and a support unit that supports the continuous body, has a groove at a position facing the cutting blade, and is configured to peel a portion of the second active material layer that overlaps the groove.