An SiC wafer producing method includes setting a focal point of a pulsed laser beam to a single crystal SiC inside an ingot at a predetermined depth from an end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced. The pulsed laser beam is applied to the ingot, thereby forming a small circular modified portion on a c-plane present in the ingot at the predetermined depth, in which the modified portion is a region where SiC has been decomposed into Si and C. A separation layer is formed for separating the wafer from the ingot, the separation layer being composed of a plurality of continuous modified portions and a plurality of cracks isotropically formed on the c-plane so as to extend from each modified portion.

A SiC wafer producing method produces an SiC wafer from a single crystal SiC ingot. The method includes a separation layer forming step of setting a focal point of a pulsed laser beam having a transmission wavelength to single crystal SiC inside the ingot at a predetermined depth from an end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the pulsed laser beam to the ingot, thereby forming a plurality of modified portions on a c-plane present in the ingot at the predetermined depth and also forming cracks isotropically on the c-plane so as to extend from each modified portion, each modified portion being a region where SiC has been decomposed into Si and C, the modified portions and the cracks constituting a separation layer along which the wafer is to be separated from the ingot.

A method for forming pieces of food dough and an apparatus thereof is able to cut the food dough continuously extruded through a nozzle along the shape of the hole of the nozzle without causing deformation, and to locate pieces of the food dough on a conveyor without causing deformation. The apparatus for forming pieces of food dough comprises an extruding device and a cutting device, wherein the extruding device comprises a nozzle to continuously extrude food dough downward, and the cutting device comprises a cutting blade to cut the food dough into the pieces of food dough, a moving mechanism to move the cutting blade forward from an initial position, then to move the cutting blade downward, and then to return the cutting blade to the initial position, and a carrying-out conveyor, which is disposed below the nozzle and moves in the direction that the cutting blade moves forward.

The invention relates to a method for producing an ice cream product with an ice cream machine having an extrusion nozzle and a cutting tool. The method comprises the steps of providing an ice cream mixture, extruding the ice cream mixture through the extrusion nozzle, cutting the ice cream mixture with the cutting tool into an ice cream product, wherein the cutting tool is an ultrasound cutting tool. The invention also relates to an ice cream machine for producing an ice cream product.

Systems and methods utilizing stationary and/or moveable cutting components provide limited interference with web processing operations, such as pad spin and pitch alteration. Heat, laser, fluid, or mechanical cutting operations may be used, including respectively, a heated element (e.g., wire, ribbon, bar, or embossing or perforating element) that may be triggered inductively, water or steam jets, or improved knife/anvil cooperation.

A cutting guide device for ultrasonic cutting of workpieces is provided. The cutting guide device includes a cutting edge with a cutting edge longitudinal axis held in the cutting guide device, an ultrasound generator which oscillates the cutting edge, a control unit which controls movement of the cutting edge on a cutting path, and a first force measuring device which measures an actual lateral force on the cutting edge transverse to the cutting edge longitudinal axis and transverse to the cutting direction. The first force measuring device sends actual lateral force measurement values to the control unit, which changes at least one cutting parameter based on the measured actual lateral force. A method for using the ultrasonic cutting device is also provided.

A unit for cutting thin films of synthetic material, the unit including: a worktable; and a cutting head including a shoe having a smooth bearing surface and a cutting member that can project from the smooth bearing surface, the smooth bearing surface being intended to be applied against the thin film of synthetic material, while the shoe is moved substantially parallel to the worktable so that it can cut the thin film of synthetic material. The worktable includes an adhesive coating having a static coefficient of friction in relation to the synthetic material, while the smooth bearing surface has a dynamic coefficient of friction in relation to the synthetic material, the dynamic coefficient of friction being lower than the static coefficient of friction.

A novel three-dimensional ultrasonic elliptical vibration cutting device, comprising has a two-dimensional ultrasonic vibration transducer, an asymmetric ultrasonic horn, and a cutter. The cutter is installed at the output end of the asymmetric ultrasonic horn, the two-dimensional ultrasonic vibration transducer is used for outputting ultrasonic longitudinal-flexural complex vibration, the asymmetric ultrasonic horn is used for converting and decomposing longitudinal vibration output by the two-dimensional ultrasonic vibration transducer into second-phase flexural vibration and longitudinal vibration, and outputting a three-dimensional ultrasonic elliptical vibration trajectory on the cutter in combination with first-phase flexural vibration output by the two-dimensional ultrasonic vibration transducer. A three-dimensional ultrasonic elliptical vibration trajectory is output in a double-excitation mode. The output three-dimensional ultrasonic elliptical vibration trajectory is adjusted according to different cutting applications and machining requirements so that the device has better adaptability.

A wafer manufacturing method includes: a crack layer forming step of applying a laser beam of such a wavelength as to be transmitted through an ingot to the ingot, with a focal point of the laser beam positioned in a region spaced from an end face of the ingot by a distance corresponding to the thickness of the wafer to be manufactured, to form a crack layer, a cut groove forming step of positioning a cutting blade on an extension line of the crack layer and forming a cut groove continuous with the crack layer in a periphery of the ingot; and a peeling step of applying an ultrasonic wave to the end face of the ingot to peel off the wafer to be manufactured, along the crack layer.

A device is described for cutting a sheet or layer of material (C) advancing on a working plane (32). A blade (30) cuts the material moved on the working plane,

To avoid wear or damages to the working plane (32) the blade (30) comprises a cutting edge (38) which is suspended within a cavity (34) formed in the working plane, so that the cutting edge can come out from the material in correspondence of the cavity.