An ultrasonic machining device (1) for machining a workpiece. At least one component, selected from the group including a generator (11), a converter (12), a booster (13), a sonotrode (14), a HV cable (15), a machine frame (16) and a receiving device for the workpiece (17), is/are assigned an identifier (18). The identifier (18) characterizes at least one individual parameter of the component. The device (1) is assigned an input interface (19) which reads in the identifier (18) or generated data from the identifier. The device (1) is assigned a data processing arrangement (20). By way of the data processing arrangement (20), based on the read-in identifier (18) or the data generated from the identifier (18), at least one parameter of the device (1) is determined in such a way that the device (1) is operated in a target operating state, e.g., a resonant vibrating state.

A method for determining a dimension between the back and the cutting edge of a vibrating blade mounted on a cutting head includes successively of acquiring a digital image of the blade mounted on the cutting tool so a line corresponding to a cutting edge of the blade and a line corresponding to a back of the blade are visible in the image, determining on the digital image along a straight line perpendicular to the line corresponding to the cutting edge of the blade the pixels comprised between the line corresponding to the cutting edge of the blade and the line corresponding to the back of the blade, and calculating a filtered dimension between the back and the cutting edge of the blade from the number of pixels comprised between the line corresponding to the cutting edge of the blade and the line corresponding to the back of the blade.

The invention relates to a cutting blade mounting device comprising a cutting blade comprising a shank, and an attachment member which receives at least sections of the shank of the cutting blade. The attachment member comprises a structure, in particular a thread, for attachment to a cutting blade holder of a cutting device.

The present disclosure discloses an ultrasonic cutting holder for a honeycomb core, including a holder, a swing mechanism, a transducer, a first-stage amplitude transformer, a second-stage amplitude transformer, an ultrasonic cutting tool, and an ultrasonic power transmission mechanism. The present disclosure provides an ultrasonic cutting holder for a honeycomb core with large amplitude output capacity and considering the interchangeability requirements among different vibration systems, which solves the problem of the applicability of ultrasonic cutting holder on the universal machine tool and improves the automation level of ultrasonic cutting.

Ultrasonic tool and method for machining a workpiece by means of mechanical ultrasonic oscillations.

A production method of a wafer includes a wafer production step in which ultrasonic water is ejected against an end face of an ingot with cleavage layers created therein, thereby severing the wafer from a rest of the ingot to produce the wafer.

An electrode assembly manufacturing apparatus includes an electrode sheet supply unit for supplying an electrode sheet on which electrode mixture coating and non-coating portions are formed, a cutting unit at the rear of the supply unit for forming an electrode tab at the electrode sheet, and a lamination unit at the rear of the supply unit and configured to laminate positive and negative electrodes stacked with a separator between them. A cutting unit die supports the electrode sheet and an ultrasonic cutter spaced from the die forms the tab. A cutting line of a cutting edge of the cutter corresponds to a periphery of a unit electrode in a tab forming direction. The cutting and lamination units are on the same line in a continuous process to reduce a necessary space for electrode assembly manufacture and prevent electrode sheet foil deformation and electrode mixture layer damage in the cut section.

In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of about 20 kHz to about 40 kHz, wherein the layer of coating is non-conductive. The method further comprises contacting the substrate with the ultrasonic cutter.

An apparatus for manufacturing a secondary battery is provided. The apparatus comprises a separation sheet supply device configured to supply two separation sheets configured to be disposed vertically. An electrode supply device is configured to supply electrodes to be disposed between the two separation sheets and on a top surface of one of the separation sheets. The one of the separation sheets is disposed at an upper side. A lamination device is configured to bond the two separation sheets and the electrodes to each other. An ultrasonic cutting device is configured to bond surfaces of the two separation sheets to each other and simultaneously cut a bonding surface of the two separation sheets.

An ultrasonic device is provided and includes an action member, a driving member and a rotating shaft connected to the driving member. The action member provides ultrasonic vibration and vibrates the driving member, so that the driving member oscillates to make the rotating shaft and a cutter oscillate in the same direction together, so the cutter can remove scrap by oscillating during the cutting operation.