Patent classifications
B26D7/28
METHOD FOR CUTTING BALE RUBBER AND BALE RUBBER CUTTING DEVICE
A method for cutting a bale rubber of an embodiment includes the steps of feeding the bale rubber to a cutting position and cutting out a bale rubber piece from the bale rubber which reaches the cutting position with a cutter and further includes the steps of measuring a weight of the cut-out bale rubber piece and determining a feed amount of the bale rubber in a subsequent step of feeding the bale rubber to the cutting position based on a difference between the measured weight of the bale rubber piece and a target weight of the bale rubber piece.
METHOD FOR CUTTING BALE RUBBER AND BALE RUBBER CUTTING DEVICE
A method for cutting a bale rubber of an embodiment includes the steps of feeding the bale rubber to a cutting position and cutting out a bale rubber piece from the bale rubber which reaches the cutting position with a cutter and further includes the steps of measuring a weight of the cut-out bale rubber piece and determining a feed amount of the bale rubber in a subsequent step of feeding the bale rubber to the cutting position based on a difference between the measured weight of the bale rubber piece and a target weight of the bale rubber piece.
Configurable Feedstock Measurement Device
In accordance with one embodiment of the present invention, there is provided a device for measuring length of feedstock being fed to a tool operated directly by a user. The device includes a body, configured to be removably attached to the tool. The device also includes a display, mounted in the body, and visually accessible to the user. The device also includes a measurement wheel mechanically mounted to the body and configured to be mechanically biased to the feedstock under a condition wherein the body is attached to the tool. The device also includes an encoder coupled to the measurement wheel and configured to generate a signal indicative of angular position of the wheel. The device further includes a processor, disposed in the body, coupled to the encoder and the display and configured to cause the display to show a measure indicative of a length of the feedstock that has been fed to the tool.
Configurable Feedstock Measurement Device
In accordance with one embodiment of the present invention, there is provided a device for measuring length of feedstock being fed to a tool operated directly by a user. The device includes a body, configured to be removably attached to the tool. The device also includes a display, mounted in the body, and visually accessible to the user. The device also includes a measurement wheel mechanically mounted to the body and configured to be mechanically biased to the feedstock under a condition wherein the body is attached to the tool. The device also includes an encoder coupled to the measurement wheel and configured to generate a signal indicative of angular position of the wheel. The device further includes a processor, disposed in the body, coupled to the encoder and the display and configured to cause the display to show a measure indicative of a length of the feedstock that has been fed to the tool.
Cutting mat
A dual surface cutting mat for, but not limited to, sewing, crafts, design and drawing. Constructed of Expanded Polystyrene (EPS) or cork on one side and polyvinyl chloride (PVC) or corrugated fiberboard on the other.
Cutting mat
A dual surface cutting mat for, but not limited to, sewing, crafts, design and drawing. Constructed of Expanded Polystyrene (EPS) or cork on one side and polyvinyl chloride (PVC) or corrugated fiberboard on the other.
CUTTING APPARATUS
A controller of a cutting apparatus obtains cutting data and specifies a pressure value corresponding to pressure to be applied to an attaching portion by a pressure changer during cutting processing for cutting a workpiece using a cutting blade based on the cutting data and a target range defining target positions of the attaching portion in a fifth direction. While causing the pressure changer to apply, to the attaching portion, the pressure corresponding to the specified pressure value, the controller executes the cutting processing by controlling a first moving mechanism and obtains the position of the attaching portion in the fifth direction. If the obtained position of the attaching portion is out of the target range, the controller changes the pressure value to another value and executes the cutting processing while causing the pressure changer to apply, to the attaching portion, the pressure corresponding to the other value.
CUTTING APPARATUS
A controller of a cutting apparatus obtains cutting data and specifies a pressure value corresponding to pressure to be applied to an attaching portion by a pressure changer during cutting processing for cutting a workpiece using a cutting blade based on the cutting data and a target range defining target positions of the attaching portion in a fifth direction. While causing the pressure changer to apply, to the attaching portion, the pressure corresponding to the specified pressure value, the controller executes the cutting processing by controlling a first moving mechanism and obtains the position of the attaching portion in the fifth direction. If the obtained position of the attaching portion is out of the target range, the controller changes the pressure value to another value and executes the cutting processing while causing the pressure changer to apply, to the attaching portion, the pressure corresponding to the other value.
METHOD FOR DETERMINING CUTTING POSITIONS OF OPTICAL FILM
Disclosed is a method that may include the steps of: (a) previously acquiring information on defect positions of the optical film along the length direction of the optical film; (b) dividing the whole area of the optical film into a plurality of large calculation areas for deriving a plurality of cutting positions, based on a normal cutting distance condition and minimum cutting distance condition in the length direction, and the information on the defect positions of the optical film; and (c) determining the cutting positions from an area, in which none of the cutting positions are determined in the length direction of the optical film, among the plurality of large calculation areas.
METHOD FOR DETERMINING CUTTING POSITIONS OF OPTICAL FILM
Disclosed is a method that may include the steps of: (a) previously acquiring information on defect positions of the optical film along the length direction of the optical film; (b) dividing the whole area of the optical film into a plurality of large calculation areas for deriving a plurality of cutting positions, based on a normal cutting distance condition and minimum cutting distance condition in the length direction, and the information on the defect positions of the optical film; and (c) determining the cutting positions from an area, in which none of the cutting positions are determined in the length direction of the optical film, among the plurality of large calculation areas.