A multilayered sheet assembly for forming a sign on an object includes a carrier layer including a first side and a second side, a sign layer that is arranged on the first side of the carrier layer via a first adhesive layer, and a strip layer that is arranged on the second side of the carrier layer via a second adhesive layer in an adhesively separable manner. The sign layer carries a third adhesive layer at an exposed side that is across from the carrier layer to allow a sign that is formed by the sign layer to adhere to the object at the exposed side while releasing from the carrier layer.

A film of material may be formed by providing a semiconductor substrate having a surface region and a cleave region located at a predetermined depth beneath the surface region. During a process of cleaving the film from the substrate, shear in the cleave region is carefully controlled. According to certain embodiments, an in-plane shear component (KII) is maintained near zero, sandwiched between a tensile region and a compressive region. In one embodiment, cleaving can be accomplished using a plate positioned over the substrate surface. The plate serves to constrain movement of the film during cleaving, and together with a localized thermal treatment reduces shear developed during the cleaving process. According to other embodiments, the KII component is purposefully maintained at a high level and serves to guide and drive fracture propagation through the cleave sequence.

A film of material may be formed by providing a semiconductor substrate having a surface region and a cleave region located at a predetermined depth beneath the surface region. During a process of cleaving the film from the substrate, shear in the cleave region is carefully controlled. According to certain embodiments, an in-plane shear component (KII) is maintained near zero, sandwiched between a tensile region and a compressive region. In one embodiment, cleaving can be accomplished using a plate positioned over the substrate surface. The plate serves to constrain movement of the film during cleaving, and together with a localized thermal treatment reduces shear developed during the cleaving process. According to other embodiments, the KII component is purposefully maintained at a high level and serves to guide and drive fracture propagation through the cleave sequence.

A multilayered sheet assembly for forming a sign on an object includes a carrier layer including a first side and a second side, a sign layer that is arranged on the first side of the carrier layer via a first adhesive layer, and a strip layer that is arranged on the second side of the carrier layer via a second adhesive layer in an adhesively separable manner. The sign layer carries a third adhesive layer at an exposed side that is across from the carrier layer to allow a sign that is formed by the sign layer to adhere to the object at the exposed side while releasing from the carrier layer.

A multilayered sheet assembly for forming a sign on an object includes a carrier layer including a first side and a second side, a sign layer that is arranged on the first side of the carrier layer via a first adhesive layer, and a strip layer that is arranged on the second side of the carrier layer via a second adhesive layer in an adhesively separable manner. The sign layer carries a third adhesive layer at an exposed side that is across from the carrier layer to allow a sign that is formed by the sign layer to adhere to the object at the exposed side while releasing from the carrier layer.

A multilayered sheet assembly includes a carrier layer on which a sign layer is arranged on a first side via a first adhesive layer. The sheet assembly further includes a strip layer which is arranged via a second adhesive layer in adhesively separable manner on a second side of the carrier layer. A further includes arranging the multilayered sheet assembly on a cutting device, arranging a peripheral cut in the sheet assembly along an outer periphery of a sign, arranging an inner cut in the sheet assembly along a peripheral line of at least one enclosed surface area not forming part of the sign, separating the strip layer with adhesive retention of the at least one enclosed surface area not forming part of the sign, and separating the sign layer from the carrier layer.

A multilayered sheet assembly includes a carrier layer on which a sign layer is arranged on a first side via a first adhesive layer. The sheet assembly further includes a strip layer which is arranged via a second adhesive layer in adhesively separable manner on a second side of the carrier layer. A further includes arranging the multilayered sheet assembly on a cutting device, arranging a peripheral cut in the sheet assembly along an outer periphery of a sign, arranging an inner cut in the sheet assembly along a peripheral line of at least one enclosed surface area not forming part of the sign, separating the strip layer with adhesive retention of the at least one enclosed surface area not forming part of the sign, and separating the sign layer from the carrier layer.

Provided are a method of full body cutting a brittle material without via the bend-breaking step, an apparatus of cutting a brittle material, a method of manufacturing a brittle material, and a cut brittle material. A method of cutting a brittle material, the method comprising: a conveyance cutting step of converging and irradiating an infrared ray to the brittle material linearly along a line using an infrared line heater while moving the infrared line heater relative to the brittle material in a direction along the line, thereby cutting the brittle material along the line.

Provided are a method of full body cutting a brittle material without via the bend-breaking step, an apparatus of cutting a brittle material, a method of manufacturing a brittle material, and a cut brittle material. A method of cutting a brittle material, the method comprising: a conveyance cutting step of converging and irradiating an infrared ray to the brittle material linearly along a line using an infrared line heater while moving the infrared line heater relative to the brittle material in a direction along the line, thereby cutting the brittle material along the line.

The purpose of the present invention is to provide an easy-to-use and efficient method for cutting a concrete member, in particular, a method that is for cutting a reinforced concrete member, that makes it easy to increase cutting depth and cutting width, and that is low in cutting cost. To achieve the purpose, the present invention provides a method for cutting a concrete member through irradiation of the concrete member with laser, the method being characterized in that: the concrete member includes a steel material; concrete is melted by scanning laser thereon to form a cutting region; the steel material is heated by means of laser to a temperature that causes progression of self-burning of the steel material; and the melting of the concrete is expedited by heat generation from said self-burning.