A method for producing a board according to the present invention includes the steps of: (A) dispersing a polycarboxylic acid, a saccharide, and ammonium sulfate in a collection of small wood pieces; and (B) subjecting the collection of small wood pieces containing the dispersed polycarboxylic acid, saccharide, and ammonium sulfate to hot press molding to form a board comprising the small wood pieces bonded together.

Engineered wood products and binder compositions are provided. In preferred embodiments, the engineered wood products include wax. Methods are also provided for formulating binders for wood comprising unmodified soy flour and synthetic adhesives. The soy-based formulations are prepared by mixing unmodified soy flour with the synthetic adhesive prior to application to the wood or by adding them sequentially to the wood. The present invention provides adequate bonding at reduced cost.

The invention is directed to a process for the manufacture of composite wood structures, which provides for increased production rates and machinability. More particularly, the process comprises combining wood particles with a composition comprising an aqueous protein and diluent dispersion.

A non-carbohydrate polyhydroxy component(s) is used in a binder composition to facilitate manufacture of wood particle boards.

It is provided a process to modify lignocellulosic materials with lignin, and incorporating lignin and isocyanates or other wood adhesive in wood products compositions, and their composition, preparation and application for bonding wood products are disclosed. The compositions comprise lignin, derived from a variety of natural resources, isocyanate compounds containing two or more isocyanate functional groups, or other wood adhesives.

The present disclosure describes aqueous adhesives comprising, inter alia, adhesives and saccharide fatty acid esters, particularly unsaturated fatty acid esters (uSFAE), including aqueous adhesive compositions containing such a combination and where such aqueous adhesive compositions show improved water resistance compared to adhesives which do not contain said uSFAE. Articles of manufacture comprising said aqueous adhesive compositions are also described.

Binders, methods for making same, and methods for making composite lignocellulose products therefrom. The binder can include about 30 wt % to about 40 wt % of solids that include a urea-modified aldehyde-based resin; about 0.1 wt % to about 3 wt % of solids that include an isocyanate-based resin; about 0.1 wt % to about 12 wt % of an extender; and about 50 wt % to about 62 wt % of water, where all weight percent values are based on a total weight of the binder. The binder can have a sodium hydroxide equivalent weight alkalinity of about 3 wt % to about 9 wt %.

A curable aqueous composition is disclosed comprising a carbohydrate, a crosslinking agent, and an amine base, wherein the curable aqueous composition has a pH adjusted by the amine base. Further disclosed is a method of forming a curable aqueous solution.

A particleboard includes a fiber component and an adhesive composition including a mixture of a modified guayule resin and soy protein. The modified guayule resin can be a base-solvent modified guayule resin or an H.sub.2O.sub.2-modified guayule resin. The fiber component can be a natural fiber such as a natural fiber selected from guayule bagasse, wood chips, wood particles, wood waste straw, wood fiber, and any combination thereof. The particleboard is formed by mixing the adhesive composition with the fiber component, introducing the mixture to a press, and pressing the mixture in the press.

The present invention relates to a process for preparing a bonding resin, lignin in solid form or in the form of a dispersion in water is mixed with a crosslinker; and optionally one or more additives followed by addition of a basic solution. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards, laminates or mineral wool insulation.