The invention relates to a floor plate, in particular for portable, handheld tools with a combustion engine, an essentially flat surface with an continuous outer edge and at least one first opening with a related edge and a second opening with a related edge, wherein the at least one edge of an opening exhibits an element that projects at an inclined angle, which serves as a baffle plate to divert sparks and particles, and further that at least the continuous edge of the floor plate and/or the edge of at least one opening are at least sectionally beaded or pulled up.

Embodiments herein provide a high stability saw chain comprising a first drive link including a first mating surface; a second drive link including a second mating surface; a first tie strap coupling the first drive link to the second drive link; wherein the first mating surface of the first drive link is configured to contact the second mating surface of the second drive link when the first and second drive links traverse an elongate portion of a guide bar to prevent reverse articulation of the saw chain less than a minimum radius of 20 inches.

Embodiments herein provide a high stability saw chain comprising a first drive link including a first mating surface; a second drive link including a second mating surface; a first tie strap coupling the first drive link to the second drive link; wherein the first mating surface of the first drive link is configured to contact the second mating surface of the second drive link when the first and second drive links traverse an elongate portion of a guide bar to prevent reverse articulation of the saw chain less than a minimum radius of 20 inches.

A machine (12) for working slabs of natural stone, agglomerate or ceramic material comprises: a work bench (14) adapted to receive a slab to be machined; a machining head (16) comprising a spindle (18); and movement means (20) for moving the machining head (16) above the work bench (14). The spindle (18) comprises coupling means (40) which allow a diamond chain tool (42) to be operatively fixed.

The present invention relates to a wall or floor chain sawing device (1), comprising a chain bar assembly (37) which in turn comprises a chain bar (2) having a longitudinal extension (17) and guiding a chain (3) at least partly around its perimeter. The chain bar assembly (37) further comprises a chain bar housing (6) that is attached to, and partially covers, the chain bar (2) and the chain (3). The chain sawing device (1) comprises a motor (9), a track interface (7) that is arranged to co-operate with a guiding track (8), and a power transmission arrangement (10) that is adapted to transfer a motion from said motor (9) to the chain (3). The sawing device (1) comprises a first pivotable support rod (12) and a second pivotable support rod (13), where each pivotable support rod (12, 13) has a corresponding first end (12a, 13a) and a second end (12b, 13b). Each first end (12a, 13a) is at least indirectly pivotably attached to the motor (9), and each second end (12b, 13b) is at least indirectly pivotably attached to the chain bar assembly (37).

A silicon single crystal is pulled up such that nitrogen concentration of the crystal is 110.sup.11 to 210.sup.13 atoms/cm.sup.3, the crystal cooling rate is about 4.2 C./min at a temperature of a silicon melting point to 1350 C. and is about 3.1 C./min at a temperature of 1200 C. to 1000 C., and oxygen concentration of a wafer is 9.510.sup.17 to 13.510.sup.17 atoms/cm.sup.3. After a heat treatment is performed on the wafer sliced from the silicon single crystal in a treatment condition of 875 C. for about 30 min, growth of an epitaxial layer is caused. Thus, an epitaxial wafer in which the number of epitaxial defects is not increased while maintaining predetermined oxygen concentration and slips do not occur is produced.

A silicon single crystal is pulled up such that nitrogen concentration of the crystal is 110.sup.11 to 210.sup.13 atoms/cm.sup.3, the crystal cooling rate is about 4.2 C./min at a temperature of a silicon melting point to 1350 C. and is about 3.1 C./min at a temperature of 1200 C. to 1000 C., and oxygen concentration of a wafer is 9.510.sup.17 to 13.510.sup.17 atoms/cm.sup.3. After a heat treatment is performed on the wafer sliced from the silicon single crystal in a treatment condition of 875 C. for about 30 min, growth of an epitaxial layer is caused. Thus, an epitaxial wafer in which the number of epitaxial defects is not increased while maintaining predetermined oxygen concentration and slips do not occur is produced.

A diamond wire saw includes a steel wire, a molded sleeve, and a plurality of diamond bead bearing units. The molded sleeve surrounds and is bonded to the steel wire. The diamond bead bearing units are disposed around and bonded to the molded sleeve. Each of the diamond bead bearing units includes a tubular body and a functional layer that covers the tubular body and that contains a plurality of abrasive diamond particles. The molded sleeve is made of polyether-type thermoplastic polyurethane, and has a Shore hardness of greater than or equal to 70 D.

In CNC wire cutting process, the deflection of the wire due to cutting force is proportional to square of the wire length. Hence it is beneficial to adjust wire length as per job size and keep it minimal. But existing wire cutting machines, wire length adjustment is not feasible. Hence there is a need to develop a simple user-friendly method of wire length adjustment. This invention proposes a simple user-friendly method of wire length adjustment in abrasive wire (100A) and hot wire cutting (100B) machines. This invention also proposes an intelligent faster cutting method without affecting wire life or pulley life. This invention also proposes an intelligent method of start point selection in CNC wire cutting machines, to avoid part defects.

A work tool (100) comprising: a cutting chain (110), a drive mechanism for driving the cutting chain (110), an annular member (120) arranged rotatably supported by one or more support rollers (130,140,150), wherein the annular member comprises a rim (230) adapted to support the cutting chain (110) during cutting, and a support wheel (160) arranged distanced from the annular member (120), wherein the cutting chain (110) is arranged supported on a rim segment (102) of the annular member (110) forming part of a cutting area of the tool (100) and supported on a rim segment (103) of the support wheel (160) in a direction away from the cutting area of the tool (100). An annular member and a method of producing an annular member are also disclosed.