The present invention is devised to solve the problems of the above-described conventional technologies. The purpose of the present invention is to provide a tempered glass cutting method and cutting apparatus which can prevent the defects of the tempered glass breaking when same is cut and improve the reliability of the product. To this end, provided is a tempered glass cutting method which comprises: a tempering step of generating compressive stress on a glass sheet to temper the glass sheet; a compressive stress relaxation step of applying heat to the cut portion of the tempered glass sheet to relax the compressive stress; and a cutting step of cutting the cut portion.

There are provided a nuclear power plant dismantling method and apparatus. The nuclear power plant dismantling method includes: selecting a nuclear reactor to be dismantled; and performing nuclear power plant dismantling work on the nuclear reactor through a nuclear reactor dismantling apparatus, wherein the nuclear reactor dismantling apparatus includes: a frame unit shielding the nuclear reactor to prevent contaminants in the nuclear reactor from being released to the outside; a cutting module provided on the frame unit and performing cutting work on the nuclear reactor; a link fixing module having a hollow area formed therein, entering an internal space of the nuclear reactor to link the frame unit and the nuclear reactor with each other, and having a bar shape; and a purging module entering the hollow area of the link fixing module and performing purging on the inside of the nuclear reactor in order to secure safety in the cutting work.

A glass plate separating apparatus, as one example, includes: a trigger device that forms a start point flaw in a first main surface of a glass ribbon on a division-planned line; a pair of holding members disposed at the first main surface side of the glass ribbon; and a heater disposed at a second main surface side of the glass ribbon. The pair of holding members, each of which extends parallel to the division-planned line, is brought into contact with the glass ribbon at both sides of the division-planned line while being lowered together with the glass ribbon. The heater extends along the division-planned line, and is brought into contact with and pressed onto the glass ribbon on the division-planned line while being lowered together with the glass ribbon.

A thermal break provides a break in thermal conduction between adjacent slabs of concrete. The thermal break can include a form body with a hollow center or core. The body can be an elongated hollow member in the shape of a rectangular tube that is hollow from a first longitudinal end to the opposite longitudinal end. The core can be filled with insulating foam. A plurality of concrete gripping elements such as T-shaped knobs can be provided to the long front and rear sides of the body to grip the concrete slabs adjacent to the respective front and rear sides.

A heat chamfering apparatus includes a heated body configured to peel an edge of a glass panel by applying thermal shock to the glass panel while being in contact with the edge of the glass panel and a heater heating the heated body. The heated body includes a heated region and a contact region in a longitudinal direction thereof, the heated region being heated by the heater, and the contact region being configured to be in contact with the glass panel. The cross-sectional area of the contact region is smaller than the cross-sectional area of the contact region. A heat chamfering method includes peeling an edge of a glass panel by applying thermal shock to the edge of the glass panel by moving a heated body heated by a heater relatively with respect to the glass panel along and in contact with the edge of the glass panel.

A heat chamfering apparatus. A support unit supports a glass panel. A heat chamfering unit heat-chamfers an edge of the glass panel by applying thermal shock thereto. The support unit includes a contact support portion supporting the glass panel while in contact with the glass panel and a base portion configured to support the contact support portion. The contact support portion is formed from a first material. The base portion is formed from a second material. The first material has a smaller change in temperature due to lower thermal conductivity and a smaller change in size at high temperature due to a smaller coefficient of thermal expansion while being more ductile due to lower hardness, compared to the second material. In a heat chamfering method, a glass panel is located on a support unit, and an edge of the glass panel is heat-chamfered by applying thermal shock thereto.

Techniques for processing a wafer involve patterning the wafer to define via locations within dies of the wafer and simultaneously define saw street indentation locations within saw street regions of the wafer. The saw street regions are disposed between the dies of the wafer. Such techniques further involve creating a set of indentations within the wafer. The set of indentations includes via indentations at the via locations within the dies configured to support electrically conductive interconnects and saw street indentations at the saw street indentation locations within the saw street regions configured to facilitate dicing.