A sprayer for squaring crystal rod includes a first sprayer for wire guide wheel cleaning and a second sprayer for cutting, the first sprayer for wire guide wheel cleaning is disposed at a side of the wire guide wheel, and a liquid spray direction of the first sprayer for wire guide wheel cleaning corresponds to a wire guide groove of the wire guide wheel, so as to flush foreign matters in the wire guide groove in a process of squaring crystal rod; the second sprayer for cutting is disposed at a side of the crystal rod, and the second sprayer for cutting corresponds to a slit in the process of squaring crystal rod, and sprays the slit to discharge powder.

Provided is a semiconductor package cutting system including a cutting device for partial-cutting at least a portion of a strip including a plurality of semiconductor packages, an inspection device mounted behind the cutting device to supply a first strip to be cut to the cutting device and to receive and inspect a second strip cut by the cutting device, and a storage device mounted behind the inspection device to supply the first strip stored therein, to the inspection device and to receive and store the second strip inspected by the inspection device, wherein the inspection device includes an inspection table for placing the first or second strip thereon and moving the first strip along a first direction.

The present disclosure provides an under-wire spray cleaning device for a wire cutting machine including: a spray assembly connected to a trough body, wherein the trough body is entirely disposed in an engaging slot of a nozzle pipe device; wherein the spray assembly includes first nozzles disposed on an inside of the trough body and second nozzles disposed on an outside of the trough body, the first nozzles are configured to clean a feed machine and a clamping mushroom head, and the second nozzles are configured to clean a sheave of the outside of the trough body. An advantage of the present disclosure is changing manually cleaning to cleaning by a spray device, which drastically improves cleaning efficiency and also prevents influence of human factors to cleanliness of the machine.

A method for solving a bright line scratched during lifting of a large-size silicon wafer comprises the steps of tooling preparation, crystal bar bonding, lifting preparation, and lifting. By optimizing and adjusting a lifting process, using a hollow plastic board and adding line-cutting fluid during lifting, the line-cutting fluid is attached to a diamond wire saw, which reduces the surface friction of the diamond wire saw, and improves lubricity. Furthermore, by adjusting the lifting process, lifting speeds varies due to different adsorption forces at different positions, so the diamond wire saw is prevented from scratching the surface of the silicon wafer, and the problem of scratching the bright line on the surface of the silicon wafer during lifting of the large-size silicon wafer is solved.

According to an exemplary embodiment of the disclosure, a method of removing a waste part of a substrate is provided. The method includes: using a laser to partially drill the substrate to define the waste part; and applying megasonic vibration to the substrate to remove the waste part from the substrate.

Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in correlation with a first correction profile, which specifies a travel of the floating bearings in dependence on the depth of cut. In dependence on the depth of cut, operating parameters are set, such as the feed rate, an amount of working fluid fed to the wire array per unit time, a temperature of the working fluid, a wire speed, a wire consumption per cut-off operation, or a wire tension.

Recessed spaces are formed along a circumferential direction on the front side and the rear side of an axial direction of a cutting blade. At the time of cutting a workpiece, a cutting liquid supplied from a cutting liquid supply nozzle to an outer circumferential part of the cutting blade enters the recessed spaces and is splashed back by an outer circumferential surface, to be supplied to a cutting region of an upper surface of the workpiece. As a result, the cutting liquid can efficiently be made to flow toward and collide against burrs of electrodes, the burrs being generated by cutting, so that the burrs can be separated and removed from the upper surface of the workpiece.

Disclosed are a filter device for cutting fluid, a cleaning method for the filter device, and a filter circulation system. The filter device includes a filter cartridge, a filter screen and an ultrasonic cleaning assembly, where the filter screen is disposed in the filter cartridge, and the filter screen is provided with a cutting fluid inlet and a drain outlet. The cutting fluid inlet is configured to allow to-be-filtered cutting fluid to flow into. The drain outlet is configured to discharge cleaning liquid and sewage in the filter screen. The filter cartridge is provided with a cutting fluid outlet, and the cutting fluid outlet is configured to discharge cutting fluid filtered.

A method cuts slices from workpieces using a wire saw with a wire array tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. A workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while controlling a temperature of the workpiece with a cooling medium, with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in dependence on a depth of cut and in correlation with a first correction profile, and while simultaneously moving the workpiece along the workpiece axis in accordance with a specification of a second correction profile, which specifies a travel of the workpiece. The first correction profile and the second correction profile being opposed to a shape deviation.

A slurry sprayer for supplying a slurry to a wire saw during ingot slicing is disclosed. The slurry sprayer includes a main body and a cover plate that is detachable from the main body for cleaning the slurry sprayer. In some embodiments, the slurry sprayer includes an adjustable support that allows the incline angle of the sprayer to be adjusted and allows the vertical and horizontal position of the slurry sprayer to be adjusted. In some embodiments, the slurry sprayer includes two feed openings to allow the slurry pressure to be more equalized across the slurry sprayer.