Wafers are sliced from a workpiece using a wire saw during slicing operations. The wire saw has a wire web of sawing wire and a setting device. The wire web is stretched in a plane between wire guide rollers that are mounted between fixed and moveable bearings. During each of the slicing operations, the setting device feeds the workpiece through the wire web along a feed direction perpendicular to a workpiece axis and perpendicular to the plane of the wire web. During each of the slicing operations, the movable bearings move oscillatingly axialy. The feeding of the workpiece through the wire web includes a simultaneous displacement of the workpiece along the workpiece axis using the setting element in accordance with a correction profile, which includes an oscillating component that is opposite to the effect which the axial moving of the movable bearings has on the shape of the sliced-off wafers.

The present disclosure provides a method for removing silicon powder in a coolant for monocrystalline silicon slicing with a diamond wire, including following steps: preparing an inorganic coagulation-inducing saline solution; mixing the inorganic coagulation-inducing saline solution with a waste coolant of the coolant after monocrystalline silicon slicing to obtain a mixture, and leaving the mixture to stand to carry out agglomeration and precipitation of the silicon powder. The inorganic coagulation-inducing saline solution has advantages of being inexpensive, non-toxic, easy to obtain, and achieving good agglomeration and precipitation. It is inexpensive to remove the silicon powder in the waste coolant for the monocrystalline silicon slicing with the diamond wire, and does not cause environmental pollution. The recovered silicon powder can be recycled and sold again, and the coolant can be reused for cutting after simple treatment.

Embodiments of the present disclosure are directed to a cleaning device for a net monitor and a slicer equipped with the cleaning device. The cleaning device includes a cleaning member. The cleaning member is constructed with a cavity and a plurality of the tunnels provided at one end of the cavity. The tunnels diverge from one end of the cavity to one side of the outer end face of the cleaning member. Angles between axes of the tunnels and an axis of the cavity are different from each other.

The present disclosure provides an under-wire spray cleaning device for a wire cutting machine including: a spray assembly connected to a trough body, wherein the trough body is entirely disposed in an engaging slot of a nozzle pipe device; wherein the spray assembly includes first nozzles disposed on an inside of the trough body and second nozzles disposed on an outside of the trough body, the first nozzles are configured to clean a feed machine and a clamping mushroom head, and the second nozzles are configured to clean a sheave of the outside of the trough body. An advantage of the present disclosure is changing manually cleaning to cleaning by a spray device, which drastically improves cleaning efficiency and also prevents influence of human factors to cleanliness of the machine.

A method of slicing wafers from a monocrystalline semiconductor ingot includes attaching a circumferential edge of the ingot to a bond beam and positioning sacrificial disks adjacent longitudinal end faces of the ingot. One sacrificial disk is positioned adjacent each of the longitudinal end faces. The method also includes connecting the bond beam to a wire saw that includes a wire web and performing a slicing operation on the ingot by operating the wire saw to drive the wire web and move the bond beam and the ingot in a movement direction towards the wire web to slice the wafers from the ingot. The sacrificial disks operate to inhibit uncontrolled breakage of the wafers during the slicing operation.

The fancy concave cutting gemstone faceting attachment device is a device that allows concave type faceting of gemstones by means of mounting this device to an existing faceting machine. This may be accomplished utilizing the existing machines drive motors and hardware. This device prevents the need to purchase completely separate concave faceting machines to accomplish the same task of concave faceting. This is preferably a universal machine design allowing this device to mount to many makes of faceting machines in the current marketplace.