A cutting blade mounting mechanism for mounting a cutting blade to a tip portion of a spindle includes: a blade mount mounted to the tip portion of the spindle; and an air supply unit supplying air to the blade mount. The blade mount includes: a columnar boss section inserted into a through-hole provided in an annular base of the cutting blade; a flange section projecting in a radial direction from a side of a base end of the boss section and having a support surface supporting the cutting blade; and an ejector type blade suction section having a first air passage connecting a supply port supplied with air from the air supply unit and a discharge port discharging air, and a second air passage connecting a suction port opening to a side of the support surface of the flange section and the first air passage.

A system and a method for squaring a ingot are provided, the system for squaring a ingot, including: a squaring chamber configured to remove cut edges of the ingot; and a movement stage disposed at one side of the squaring chamber in a first direction, wherein the movement stage is provided with a loading mechanism and a unloading mechanism, the loading mechanism and the unloading mechanism are respectively arranged on two sides of the movement stage opposite to each other in a second direction different from the first direction, and while the unloading mechanism collects the cut edges and removes the ingot after removal of the cut edges, the loading mechanism is configured to transport another ingot to be squared to the squaring chamber.

A slicing method and a slicing apparatus for an ingot are provided. The slicing method for the ingot comprises: setting an ingot on an ingot-feeding device; descending the ingot by the ingot-feeding device and loosening a diamond wire synchronously such that the ingot is surrounded with the diamond wire; and tightening the diamond wire to begin to slice after the ingot is descended to a cooling tank. The slicing method and the slicing apparatus for the ingot of the present disclosure could raise the slicing speed and reduce the temperature difference from a slicing area to a non-slicing area so that the wrap of a silicon chip is improved.

A cutting apparatus including a holding unit for holding a workpiece, a cutting blade having a peripheral cutting edge for cutting a workpiece, a spindle unit including a spindle for rotating the cutting blade, a blade cover mounted on the spindle unit for covering the cutting blade, the blade cover having a bottom portion formed with a slit for allowing projection of a part of the cutting edge of the cutting blade, and a cutting fluid supplying unit for supplying a cutting fluid to the upper surface of the workpiece on both sides of the slit. The cutting fluid is not directly supplied to the cutting blade, but it is supplied to the upper surface of the workpiece. Accordingly, there is no possibility that the cutting fluid may be scattered by the rotation of the cutting blade.

A blade mounting and dismounting jig is provided for mounting a blade on and dismounting a blade from a flange of a cutting apparatus which includes a boss, a blade mount for mounting the blade fitted thereover, the flange having an annular end face for supporting the blade thereon and being fixed to a distal end of a spindle, and a holder that cooperates with the flange in gripping and securing the blade in position. The blade mounting and dismounting jig includes a cylindrical jig body, a grip coupled to the jig body and having a diameter larger than the jig body, a plurality of first air ejection ports defined in a distal end portion of the jig body, a plurality of second air ejection ports defined in the jig body at a juncture between the jig body and the grip.

In order to respond flexibly to various processing modes, such as forming curved surface shapes, when cutting a workpiece using a wire saw, this wire saw device (1) is provided with: a single robot arm (2) that is capable of moving freely by means of multi-axis control; a wire saw unit (3) that is detachably connected to the robot arm (2) via a tool changer (7); a wire (8) that spans a plurality of pulleys supported within the wire saw unit (3); and a workpiece cutting zone (20) that is established between the pulleys. The workpiece is cut to a prescribed shape by moving the robot arm (2) in a preset direction while running the wire (8) of the wire saw unit (3) and pressing the wire (8) against the supported workpiece.

A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a slit which is open at an outer peripheral edge thereof. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

A saw wire includes a metal wire containing rhenium-tungsten alloy. A rhenium content of the metal wire is at least 0.1 wt % and at most 10 wt % with respect to a total weight of rhenium and tungsten, an elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa, a tensile strength of the metal wire is at least 3500 MPa, and a diameter of the metal wire is at most 60 m.

This wire saw machine having a dust collecting apparatus comprises a main roller for moving a wire by rotation; a first pulley system including a first upper dust collecting roller, a first lower dust collecting roller, and a first support roller; a second pulley system including a second upper dust collecting roller, a second lower dust collecting roller, and a second support roller; and a dust collecting unit which is provided under the first pulley system and the second pulley system to collect foreign substances that escape from the first pulley system and the second pulley system.

A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin, further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.