Semiconductor wafers having a subsurface-referenced nanotopography of the upper side surface of less than 6 nm, expressed as a maximum peak-to-valley distance on a subsurface and referenced to subsurfaces with an area content of 25 mm25 mm, are produced from a workpiece by feeding the workpiece through a wire web tensioned between wire guide rollers and divided into wire groups, the wires producing kerfs as the wires engage the workpiece. For each of the wire groups, a placement error of the kerfs of the wire groups is used to compensate movements of the wires of the wire group as a function of the placement error, in a direction perpendicular to the running direction of the wires during feeding of the workpiece through the arrangement of wires, by activating at least one drive element.

Disclosed are an upper jacking structure, a half-slitting machine and a half-slitting method. The upper jacking structure includes a lower jacking block, a cutting assembly, a first linear reciprocating device, an upper jacking block and an auxiliary tensioner. The lower jacking block is located below the upper jacking block, a clamping space is formed between the lower jacking block and the upper jacking block, a cutting end of the cutting assembly moves in a vertical direction and a horizontal direction in and out of the clamping space, a movable end of the first linear reciprocating device moves in the vertical direction, and the upper jacking block is provided on the movable end of the first linear reciprocating device; the upper jacking block has a first jacking surface provided with a first jacking head and a second jacking head at either side of a center line of the first jacking surface.

A method of slicing wafers from a monocrystalline semiconductor ingot includes attaching a circumferential edge of the ingot to a bond beam and positioning sacrificial disks adjacent longitudinal end faces of the ingot. One sacrificial disk is positioned adjacent each of the longitudinal end faces. The method also includes connecting the bond beam to a wire saw that includes a wire web and performing a slicing operation on the ingot by operating the wire saw to drive the wire web and move the bond beam and the ingot in a movement direction towards the wire web to slice the wafers from the ingot. The sacrificial disks operate to inhibit uncontrolled breakage of the wafers during the slicing operation.

A silicon rod cutting system, including: a machine base (1), wherein the machine base has at least two cutting stations, which are disposed at intervals; at least two cutting devices (4), which are fixed on the machine base, wherein the cutting devices are in one-to-one correspondence with the cutting stations, and the cutting devices are configured to cut a silicon rods on the cutting stations; a loading and unloading device (2), which is fixed with the machine base, wherein the loading and unloading device is configured to load a round silicon rod and unloading a square rod formed by cutting; and a transfer device (3), which is disposed on the machine base and is disposed between the cutting stations, wherein the transfer device is configured transfer, to the cutting station, the silicon rod loaded by the loading and unloading device, and transfer the square rod formed on the cutting stations to the loading and unloading device. The at least two cutting stations of the silicon rod cutting system share one loading and unloading device and one transfer device, so that the components of the silicon rod cutting system are fewer, and the occupied space is relatively small.

Disclosed are a lower jacking member, a wire withdrawal method based on the lower jacking member, and a squaring machine including the lower jacking member. The lower jacking member is used for axially fixing a bottom surface of an edge scrap formed by cutting a round rod, and a bottom outline of the edge scrap has a cutting edge. The lower jacking member includes at least two single components, and drive structures independently connected to the single components. A spacing between at least one of the single components and the cutting edge is different from a spacing between the rest of the single components and the cutting edge; and the drive structures are used for driving tops of the single components to abut against the bottom surface of the edge scrap.