A method for fabricating MAS NMR rotors and drive caps made of diamond to increase the maximum achievable spinning frequency and enhance MAS NMR sensitivity and resolution. Diamond is an excellent choice for making MAS NMR rotors due to its high tensile and flexural strength, however, micromachining diamond is difficult due to its hardness. Although laser cutting is often employed to cut diamond sheets, this process cannot be used to create the high aspect ratio and small features required for MAS NMR rotors. In the present invention, a laser micromachining process is used to create the desired high aspect ratio while maintaining the small lateral features. In this process, the laser is used to first convert the diamond into graphite followed by a conversion to carbon dioxide in the presence of oxygen. To create a rotor, a rectangular log has a center hole drilled by the laser, and is then micromachined into a hollow cylinder.

Method for cutting crystal boules using diamond wire, wherein this boule is driven about a main axis, a cutting wire is held taut and driven through a temporary drum immobilising each boule in position with respect to the main axis throughout the entire cutting operation, this temporary drum being made by overmoulding a coating material on at least one boule bonded onto a sacrificial core, the cutting being followed by the slicing of cut rings from which are detached, particularly using heat, crystalline plates with parallel faces.

A method for slicing an ingot, including: forming a wire row by a wire spirally wound between a plurality of wire guides and configured to travel in an axial direction; and pressing an ingot against the wire row while supplying a contact portion between the ingot and the wire with a slurry from a nozzle, thereby slicing the ingot into wafers. The slurry is supplied such that slurries whose temperatures are separately controlled by two or more lines of heat exchangers are respectively supplied from two or more sections of the nozzle which are orthogonal to a travelling direction of the wire row. Consequently, a wire saw and a method for slicing an ingot are provided which enable separate control of wafer shapes depending on ingot-slicing positions.

A cutting apparatus includes a blade changing unit demounting an old cutting blade from a blade mount and mounting a new cutting blade to the blade mount. The blade changing unit includes a blade holder for holding a support base of each cutting blade and a moving portion for moving the blade holder in the axial direction of a boss portion of the blade mount in the condition where each cutting blade is held by the blade holder, thereby mounting the new cutting blade to the boss portion or demounting the old cutting blade from the boss portion. The cutting apparatus further includes a control unit controlling the blade changing unit. The control unit measures a signal indicating a force applied to the moving portion in mounting or demounting, and determines the condition of the blade changing unit and blade mount according to the signal measured by the measuring portion.

A blade mounting and dismounting jig is provided for mounting a blade on and dismounting a blade from a flange of a cutting apparatus which includes a boss, a blade mount for mounting the blade fitted thereover, the flange having an annular end face for supporting the blade thereon and being fixed to a distal end of a spindle, and a holder that cooperates with the flange in gripping and securing the blade in position. The blade mounting and dismounting jig includes a cylindrical jig body, a grip coupled to the jig body and having a diameter larger than the jig body, a plurality of first air ejection ports defined in a distal end portion of the jig body, a plurality of second air ejection ports defined in the jig body at a juncture between the jig body and the grip.

A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a processing mode registration section in which commands to be output to components. The processing mode registration section registers therein a command in a cutting apparatus mode that causes the cutting unit to cut the workpiece and a command in an ultraviolet ray irradiation apparatus mode that causes the ultraviolet ray irradiation unit to irradiate the frame unit with ultraviolet rays.

A cleaving system employs a shaper, a positioner, an internal preparation system, an external preparation system, a cleaver, and a cropper to cleave a workpiece into cleaved pieces. The shaper shapes a workpiece into a defined geometric shape. The positioner then positions the workpiece such that the internal preparation system can generate a separation layer at the cleaving plane. The internal preparation system focuses a laser beam internal to the workpiece at a focal point and scans the focal point across the cleaving plane to create the separation layer. The external preparation system scores the external surface of the workpiece at a location coincident with the separation layer. The cleaver cleaves the workpiece by propagating the crack on the external surface along the separation layer. The cropper shapes the cleaved piece into a geometric shape as needed.

A cleaving system employs a shaper, a positioner, an internal preparation system, an external preparation system, a cleaver, and a cropper to cleave a workpiece into cleaved pieces. The shaper shapes a workpiece into a defined geometric shape. The positioner then positions the workpiece such that the internal preparation system can generate a separation layer at the cleaving plane. The internal preparation system focuses a laser beam internal to the workpiece at a focal point and scans the focal point across the cleaving plane to create the separation layer. The external preparation system scores the external surface of the workpiece at a location coincident with the separation layer. The cleaver cleaves the workpiece by propagating the crack on the external surface along the separation layer. The cropper shapes the cleaved piece into a geometric shape as needed.

A cleaving system employs a shaper, a positioner, an internal preparation system, an external preparation system, a cleaver, and a cropper to cleave a workpiece into cleaved pieces. The shaper shapes a workpiece into a defined geometric shape. The positioner then positions the workpiece such that the internal preparation system can generate a separation layer at the cleaving plane. The internal preparation system focuses a laser beam internal to the workpiece at a focal point and scans the focal point across the cleaving plane to create the separation layer. The external preparation system scores the external surface of the workpiece at a location coincident with the separation layer. The cleaver cleaves the workpiece by propagating the crack on the external surface along the separation layer. The cropper shapes the cleaved piece into a geometric shape as needed.

According to the present invention, there is provided an ingot clamp including: a clamp body configured to have a holder mounting groove and a cavity; a fixing part configured to support and fix one side of an ingot holder inserted in the holder mounting groove; a movable fixing part disposed in the cavity and the holder mounting groove and configured to press and fix the other side of the ingot holder; a cover assembly coupled with the clamp body and configured to cover the cavity; and an air supply part coupled with the cover assembly and configured to supply air into the cavity.