Patent classifications
B28D5/022
Hubbed blade
A hubbed blade to be mounted on a spindle includes a circular hub and a circular blade fixed on a side of a first side of the hub. The blade has an opening formed through its center. The hub includes a protrusion portion protruding from the first side and having an outer peripheral edge of a shape corresponding to a shape of the opening. The hub and the blade are connected together via an adhesive with the hub and the blade being aligned each other with the protrusion portion inserted in the opening.
CUTTING APPARATUS
A cutting apparatus includes a cutting unit that has a spindle with an annular cutting blade mounted to a tip part of the spindle through a blade mount, and a determining unit. The determining unit has a second flow path that is connected to a first flow path in a mounter of the blade mount for causing a negative or positive pressure to act on the first flow path, a measuring device that obtains a measured value of at least one of a pressure and a flow rate in the second flow path, and a screw-engaged state determining section that determines that a screw-engaged state of a fixed nut with a boss section of the mounter where the cutting blade is disposed is defective in a case where the measured value when the negative or positive pressure acts on the first flow path indicates an abnormal value.
METHOD FOR CUTTING POLYCRYSTALLINE SILICON ROD, METHOD FOR MANUFACTURING CUT ROD OF POLYCRYSTALLINE SILICON ROD, METHOD FOR MANUFACTURING NUGGET OF POLYCRYSTALLINE SILICON ROD, AND POLYCRYSTALLINE SILICON ROD CUTTING DEVICE
Provided is a method for preventing metal contamination during cutting of a polycrystalline silicon rod. A method for cutting a polycrystalline silicon rod (S) includes the step of cutting the polycrystalline silicon rod (S) by using a cutting tool (133). The step of cutting includes: delivering a liquid (L1) to a cutting position of the polycrystalline silicon rod (S) through a first nozzle (14); and delivering a liquid (L2) to a surface of the polycrystalline silicon rod (S) through a second nozzle (15).
Blade replacing apparatus and adjusting method of blade replacing apparatus
There is provided a blade replacing apparatus for replacing a cutting blade. The blade replacing apparatus includes a blade storage unit including a movable storage section configured to store the cutting blade, a transporting unit including a holding unit configured to hold the cutting blade and a moving mechanism configured to move the holding unit, a camera configured to photograph the holding unit, and a control unit including an operation control section configured to control operation of the blade storage unit and the transporting unit and a position registration section in which positions of the storage section and the holding unit. The storage section includes a first mark portion photographable by the camera, and the holding unit includes a second mark portion photographable by the camera.
Workpiece processing method
A workpiece processing method is provided for processing a workpiece including a device region, a peripheral surplus region surrounding the device region, and key patterns being arranged on a top surface side in the peripheral surplus region so as to correspond to a plurality of planned dividing lines, the method including: a resin sheet sticking step of sticking a resin sheet to the top surface side of the workpiece, and transferring the key patterns onto the resin sheet; a peripheral surplus region removing step of dividing the peripheral surplus region from the workpiece, and peeling off the peripheral surplus region from the resin sheet; and a device region processing step of identifying a position of at least one planned dividing line by using, as marks, traces of the key patterns exposed in the peripheral surplus region removing step, and processing the device region along the plurality of planned dividing lines.
INSPECTION SUBSTRATE
An inspection substrate for use in inspecting whether or not a constituent element of a cutting apparatus forms a scratch on a top surface of a workpiece when a cutting blade cuts the workpiece, the inspection substrate includes a top surface side of the inspection substrate having a groove portion for simulated cutting, the groove portion having a width that the cutting blade can pass through, and a paint layer disposed on the top surface side of the inspection substrate to improve visibility of a scratch formed on the top surface side.
METHOD AND APPARATUS FOR MANUFACTURING HIGH-HARDNESS DIAMOND SIMULANT BY CUTTING A GEMSTONE INTO 100-SIDED BODY
A technology for processing (and/or working) a gemstone is provided, and specifically, a method for, and an apparatus for manufacturing a high-hardness diamond simulant by cutting a gemstone into a 100-sided body are provided.
BLADE HOLDING JIG
A blade holding jig for holding a washer-type cutting blade via an annular retainer flange includes an annular flange holding portion configured to hold a first annular surface of the retainer flange under suction, and an annular non-contact suction portion arranged on an outer peripheral portion of the flange holding portion and configured to produce a negative pressure by ejection of a fluid toward the outer peripheral portion of the retainer flange held by the flange holding portion and to draw up the cutting blade toward the retainer flange. The cutting blade drawn up toward the retainer flange by the non-contact suction portion is held on the retainer flange by a suction force acting from the flange holding portion via a plurality of through holes disposed extending from a second annular surface to the first annular surface of the retainer flange.
METHOD FOR FORMING GROOVE IN HYBRID OPTICAL DEVICE, AND HYBRID OPTICAL DEVICE
A groove having any length is manufactured in a quartz-based waveguide chip without limitation of a chip size. A marker indicating a planned cutting line extending from a connection end surface of a quartz-based waveguide chip in an in-chip plane direction is formed in advance by processing a core layer of the waveguide of the quartz-based waveguide chip, an irradiation position of laser light is aligned with a position of a starting point of the marker in a state where quartz-based waveguide chip is placed on a stage, and a groove is manufactured in the connection end surface of the quartz-based waveguide chip by moving the stage in the extending direction of the marker while irradiating the quartz-based waveguide chip with the laser light from an upper side.
WORKPIECE PROCESSING METHOD
A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step of cleaning a back surface of the workpiece with cleaning water, after the cutting step is carried out.