The invention relates to a wire management system for a wire saw having a cutting wire guided through a cutting area. The system comprises a wire supplying unit for supplying cutting wire to the cutting area and a wire receiving unit for receiving cutting wire from the cutting area. At least one of the wire supplying unit and the wire receiving unit comprises: at least one rotatable reservoir spool for carrying the cutting wire in overlapping windings, at least one rotatable storage spool for temporarily receiving the cutting wire in windings, wherein the rotational axis of the storage spool coincides with the rotational axis of the reservoir spool, a wire guiding means for guiding the wire when being wound up on the storage spool, such that the wire windings on the storage spool do not overlap each other and/or have a lower density than the windings on the reservoir spool.

According to the present invention, there is provided an ingot clamp including: a clamp body configured to have a holder mounting groove and a cavity; a fixing part configured to support and fix one side of an ingot holder inserted in the holder mounting groove; a movable fixing part disposed in the cavity and the holder mounting groove and configured to press and fix the other side of the ingot holder; a cover assembly coupled with the clamp body and configured to cover the cavity; and an air supply part coupled with the cover assembly and configured to supply air into the cavity.

A diamond wire cutter, using an adjustable length pulley system, a diamond wire saw, and a movable pulley cart, can perform a through-cut of complete sections of a structure such as a tubular subsea by fitting a chain about an outer surface of the structure, securing the chain to the movable pulley cart and using the chain to move or otherwise guide the movable pulley cart about the outer circumference of the structure to cut while using a diamond wire to effect a cut between the movable pulley cart and the diamond wire saw.

The present invention provides a method of growing an ingot of group III nitride. Group III nitride crystals such as GaN are grown by the ammonothermal method on both sides of a seed to form an ingot and the ingot is sliced into wafers. The wafer including the first-generation seed is sliced thicker than the other wafers so that the wafer including the first-generation seed does not break. The wafer including the first-generation seed crystal can be used as a seed for the next ammonothermal growth.

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. The measured amount of displacement of the sidewall is stored as displacement data. Based on the stored data, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.

Disclosed is a method for solving a bright line scratched during lifting of a large-size silicon wafer, which includes the steps of tooling preparation, crystal bar bonding, lifting preparation, and lifting. By optimizing and adjusting a lifting process, using a hollow plastic board and adding line-cutting fluid during lifting, the line-cutting fluid is attached to a diamond wire saw, which reduces the surface friction of the diamond wire saw, and improves lubricity. Furthermore, by adjusting the lifting process, lifting speeds varies due to different adsorption forces at different positions, so the diamond wire saw is prevented from scratching the surface of the silicon wafer, and the problem of scratching the bright line on the surface of the silicon wafer during lifting of the large-size silicon wafer is solved. Therefore, the quality of the silicon wafer is guaranteed, scrap is avoided, and the production cost is reduced to a certain extent.

A method for obtaining a diameter is provided. The method is to be applied to a multi-roller module system and includes: designating a target linear velocity associated with a wire moving in the multi-roller module system, and a value of a presumed diameter parameter associated with a diameter of a main roller; calculating an initial rotational speed of the main roller; measuring a current rotational speed of the fixed-diameter rotating component; calculating an actual linear velocity of the wire; and determining that the value of the presumed diameter parameter equals an actual diameter of the main roller when it is determined that the ratio of the target linear velocity to the actual linear velocity is equal to one.

A method for manufacturing a wire saw apparatus including a wire supply reel; a long roller; wire guides; a wire winding reel; and a tension arm controlled to move within a control angle of ?A (?) set in advance and configured to apply tension to the wire, the method including the steps of: measuring a surface roughness Rmax of the long roller; measuring an angle a (?) of the tension arm at which the tension arm swings outside a range of the control angle set in advance while the wire is extending from the wire supply reel; calculating R1?2?A?(|a|+A)=R2, where R1 (?m) represents the measured surface roughness Rmax of the long roller; and adjusting the surface roughness Rmax of the long roller to the calculated numerical value R2 or less. The method for manufacturing a wire saw apparatus can prevent the tension arm from greatly swinging outside the control range.

The invention relates to a wire management system (7) for a wire saw (8) having a cutting wire (3) which is guided through a cutting area (13), the wire management system (7) comprising a wire supplying unit (5) for supplying cutting wire (3) to the cutting area (13) of the wire saw (8) and a wire receiving unit (6) for receiving cutting wire (3) from the cutting area (13) of the wire saw (8), wherein at least one of the wire supplying unit (5) and the wire receiving unit (6) comprises: at least one rotatable reservoir spool (1) for carrying the cutting wire (3) in overlapping windings, at least one rotatable storage spool (2) for temporarily receiving the cutting wire (3) in windings, wherein the rotational axis (2b) of the storage spool (2) coincides with the rotational axis (1 b) of the reservoir spool (1), a wire guiding means (9) for guiding the cutting wire (3) when being wound up on the storage spool (2), such that the wire windings on the storage spool (2) do not overlap each other and/or have a lower density than the windings on the reservoir spool (1).

A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by a wire saw using such wire guide rolls.