A machine (12) for cutting slabs, comprises a workpiece support bench (14) adapted to support at least one slab, and cutting means for automated cutting of the slab on the bench. The cutting means comprise two lateral support structures (16, 18). A first beam (20) is adapted to move along said lateral support structures (16, 18). The first beam (20) is adapted to slide on the lateral support structures (16, 18) via its ends (22, 24) and guiding means (25, 26) provided on the lateral support structures (16, 18). The first beam (20) is provided with a first carriage (28) adapted to be moved along the first beam (20). A first sleeve (30) adapted to be moved towards or away from the workpiece support bench (14) is provided on the first carriage (28). A first machining head (32) comprising a first cutting spindle (34) is provided on the first sleeve (30). A second beam (201) is adapted to move along the lateral support structures (16, 18). The second beam (201) is adapted to slide on the lateral support structures (16, 18) via its ends (221, 241) and guiding means (26) provided on the lateral support structures (16, 18), independently of the first beam (20). The second beam (201) is provided with a second carriage (281) which is adapted to be moved along the second beam (201). A second sleeve (301) adapted to be moved towards or away from the workpiece support bench (14) is provided on the second carriage (281). A second machining head (321) comprising a second cutting spindle (341) is provided on the second sleeve (301). At least either one of the first head (32) and the second head (321) is provided with a gripping device (42, 421) for the slabs or parts thereof.

A glass plate processing system includes a first aligning means. When first and second glass plates different upper and lower surface areas are processed, the first aligning means aligns a first side edge extending in a front-rear direction on one side in a width direction of a first glass plate to be processed first with a first side edge extending in the front-rear direction on the one side in the width direction of a second glass plate to be processed later. The glass plate processing system causes the first aligning means to align the first side edge of the second glass plate at a position of the first side edge of the first glass plate to perform processing on the second glass plate. The glass plate processing system shortens a moving distance and arrival time for a processing device and shortens cycle time of processing.

A glass-plate working apparatus 1 includes a cutting section 2 serving as a processing position for forming cut lines on a glass plate 5, a grinding section 3 serving as a processing position for grinding peripheral edges of the glass plate 5, a bend-breaking section 4 serving as a processing position between the cutting section 2 and the grinding section 3, and a glass-plate transporting section 6 for transporting the glass plates 5, and further includes a feed conveyor 7 disposed on the side of carrying in to the cutting section 2 and serving as a glass-plate carrying-in section, as well as a discharge conveyor 8 disposed on the side of carrying out from the grinding section 3 and serving as a glass-plate carrying-out section.

A cutting system (10; 10; 10) for slabs (50) which comprises: a longitudinal guide (20; 20; 20) comprising a pair of surfaces (23,24; 23,24; 23,24) opposite to each other, of which a lower surface (24; 24; 24) and an opposite upper surface (23; 23; 23); a suction cup (41; 41; 41) coupled to the lower surface (24; 24; 24) of the longitudinal guide (20; 20; 20) suitable to selectively adhere to a slab (50) and defining a contact surface of the longitudinal guide (20; 20; 20) on the slab (50); the longitudinal guide further comprising a pair of rails (231; 231; 231) parallel to each other coupled to the upper surface (23; 23; 23) of the longitudinal guide (20; 20; 20) and suitable for slidably coupling to a scoring slider (30; 30; 30). The rails (231; 231; 231) are arranged on opposite sides with respect to a median plane (A-A) of the suction cup (41; 41; 41) perpendicular to the contact surface thereof.

Machine (1) for machining slabs (L) made of stone, stone-like, agglomerate or ceramic material, comprising a pair of fixed support structures (12) intended to delimit a working area (A), a horizontal surface (8) for supporting the slabs (L) being machined, which is positioned within the working area (A), a fixed horizontal beam (14) supported by the fixed support structures (12) and a horizontal beam (18) movable with respect to the fixed horizontal beam (14) and comprising at least one spindle (20) slidably mounted on the movable horizontal beam (18) and designed for the mounting of at least one machining tool (22). Also provided are means (32) for moving the movable horizontal beam (18) with respect to the fixed horizontal beam (14) along a predetermined direction of advancing movement (Z) lying in a plane parallel to the support surface (8) and means (34) for rotation of the movable beam (18) with respect to the fixed beam (14) about a fixed rotation axis (R) arranged vertically. The invention also relates to a plant (100) for machining the slabs.

A wafer processing method includes: a holding step of holding a wafer on a chuck table through a dicing tape; and a dividing step of cutting the wafer along division lines by a cutting blade. In the dividing step, cleaning water including pure water mixed with carbon dioxide is supplied to the front surface of the wafer, and cutting water including pure water alone or pure water mixed with carbon dioxide in a concentration lower than that of the cleaning water is supplied to the cutting blade. During cutting, therefore, the cleaning water and the cutting water are always shielded by each other. Consequently, the cutting blade can be prevented from being corroded or excessively worn due to the cleaning water, and the cutting water can be prevented from contacting the front surface of the wafer to cause electrostatic discharge damage to the devices.

A processing apparatus includes a chuck table for holding a plate-like workpiece under suction. A suction unit is connected to the chuck table, and a processing unit is configured to process the workpiece while supplying processing water to the workpiece. The suction unit includes a first suction source, a first pipe providing fluid communication between the first suction source and the chuck table, a separator arranged in the first pipe, for separating a gas and a liquid drawn in from the chuck table, and a water discharging unit configured to discharge the liquid separated by the separator. The water discharging unit includes a second suction source, a second pipe providing fluid communication between the second suction source and a water discharge port of the separator, and a check valve arranged in the second pipe, for preventing a fluid from flowing from the second suction source to the separator.

A package substrate cutting jig table for use in cutting a package substrate is provided. The jig table includes a jig base and a holding member adapted to be detachably mounted on the jig base. The holding member includes a holding surface for holding the package substrate, a plurality of escape grooves formed on the holding surface for preventing the interference of a cutting blade with the holding member, the escape grooves corresponding to a plurality of division lines formed on the package substrate, and a plurality of suction holes formed in a plurality of separate regions defined by the escape grooves on the holding surface. The holding member is formed of a material having a dynamic viscoelastic modulus ranging from 0.16 to 0.41.

After a glass sheet (G) having a scribe line (S) formed thereon is placed on a placement table (10) and positioned so that the scribe line (S) is positioned in a bending stress applying portion (15) of the placement table (10), when the glass sheet (G) is split along the scribe line (S) by applying a bending stress to a formation region of the scribe line (S) by the bending stress applying portion (15), the glass sheet (G) is positioned by laying a resin sheet (9) under the glass sheet (G) on the placement table (10) and aligning one side (G1) of the glass sheet (G) extending in a direction along the scribe line (S) with marks (Ma to Nd) projected onto a protruding portion (9a) of the resin sheet (9) by laser markers (16a to 16d).

A machine for processing a stone or stone-like slab includes a frame. A bridge extends across a slab processing area and mounted for movement on the frame. A carriage is mounted for movement on the bridge to define movement of a lower end of the carriage along the X, Y and Z coordinate axes. A machine yoke is rotatably mounted at the lower end of the carriage and configured for C-axis rotation. A machining head is rotatably mounted between support arms of the machine yoke and configured for A-axis rotation. The machine yoke is rotated about the C-axis when routing or cutting on the slab. A controller is configured to rotate the machine yoke and maintain a support arm leading along the path of advancement of the finger bit to relieve stress on the A-axis when routing or cutting on the slab.