A resin molded product whose main component consists of an ethylene-vinyl acetate copolymer resin and carbon black. The ethylene-vinyl acetate copolymer resin has an MFR of 0.5 g/10 min or more and 20 g/10 min or less. The carbon black has an average primary particle diameter of 55 nm or more and 100 nm or less and a DBP oil absorption amount of 100 mL/100 g or more and 300 mL/100 g or less. The content of vinyl acetate is 2.9 parts by mass or more and 12.3 parts by mass or less based on 100 parts by mass of the main component. The resin molded product has a surface resistivity of 720 Ω/□ or less.

A water-soluble film includes a polyvinyl alcohol resin (A) as a main component, wherein the ratio (X.sub.TD/X.sub.MD) of a degree of elongation (X.sub.TD) in the transverse direction (TD) of the water-soluble film to a degree of elongation (X.sub.MD) in the machine direction (MD) thereof when the water-soluble film is floated on the surface of water at 20° C. for 60 seconds is from 1.05 to 1.5. The water-soluble film exhibits reduced curling, exhibits reduced positional shift, and shows satisfactory sealability while forming a package.

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

A melt-processable water soluble polymer composition having a high Melt Flow Index comprising a blend of a water soluble polymer with at least 15% by weight of the total composition of a hygroscopic salt to act as a lubricant to render the polymer extrudable and/or mouldable, wherein the water content of the salt is of less than 10% by weight, and optionally a solvent polymer plasticizer in a lower amount by weight percent than the hygroscopic salt.

The present invention provides methods for preparing the nut waste composites from a nut waste component, one or more binders, and an oil using a compounder/extruder.

Crosslinkable polymeric compositions comprising an ethylene-based polymer, an organic peroxide, and an amine-functionalized interpolymer. Such crosslinkable polymeric compositions and their crosslinked forms can be employed as polymeric layers in wire and cable applications, such as insulation in power cables.

A process for producing tyres including building a green tyre having two bead structures. Each bead structure includes a bead filler. The bead filler or another rigid component of the green tyre includes a final elastomeric compound produced by the following: feeding elastomeric polymer and reinforcement filler to a first batch mixing device; mixing and dispersing the reinforcement filler in the elastomeric polymer and unloading the obtained elastomeric compound; feeding the obtained elastomeric compound, along with at least 5 phr of reinforcement resin, to a continuous mixing device of intermeshing and co-rotating twin-screw or multi-screw type or of planetary type; mixing the reinforcement resin in the elastomeric compound and unloading the obtained elastomeric compound; and feeding the obtained elastomeric compound along with the components capable of facilitating the cross-linking to a second batch mixing device and mixing to obtain the final elastomeric compound. The first and second batch mixing device have two counterrotating rotors.

Rheology-modified, additive-containing ethylenic polymer compositions are prepared in a continuously operated extruder comprising first, second and third zones by a process comprising the steps of: mixing in the second zone of the extruder an ethylenic polymer and a high-temperature decomposing peroxide at a temperature such that the half-life of the peroxide is equal to or greater than (≥) one minute and for a sufficient period of time to modify the rheology of the ethylenic polymer to produce a rheology-modified, melted ethylenic polymer for transfer to the third zone of the extruder; and adding to the third zone one or more additives to the rheology-modified, melted ethylenic polymer to produce the rheology-modified, additive-containing ethylenic polymer.

A simulation device for calculating a predetermined physical quantity in a kneading extruder, the simulation device comprises: an acquisition unit configured to acquire at least a characteristic of a first raw material and a characteristic of a second raw material, the first raw material and the second raw material being injected into the kneading extruder; and a calculation unit configured to calculate a physical quantity of a mixture of the first raw material and the second raw material based on the characteristics of the first raw material and the second raw material acquired by the acquisition unit.

The present invention relates to a process for producing a compacted material comprising the steps of providing a powder material and a polymer binder, simultaneously or subsequently feeding the powder material and the polymer binder into a high speed mixer unit, mixing the powder material and the polymer binder in the high speed mixer unit until formation of a compacted material, and reducing the temperature of the obtained compacted material below the melting point or glass transition temperature of the polymer binder.