B29B11/10

SYSTEMS AND METHODS OF ADDITIVE PRINTING OF FUNCTIONAL ELECTRONIC CIRCUITS
20220195222 · 2022-06-23 · ·

A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.

SYSTEMS AND METHODS OF ADDITIVE PRINTING OF FUNCTIONAL ELECTRONIC CIRCUITS
20220195222 · 2022-06-23 · ·

A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.

Systems and methods of additive printing of functional electronic circuits
11299642 · 2022-04-12 · ·

A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.

Systems and methods of additive printing of functional electronic circuits
11299642 · 2022-04-12 · ·

A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.

BIAXIALLY ORIENTED THERMOPLASTIC PIPETTE, AND METHOD AND APPARATUS FOR FORMING SAME

Unitary measuring pipettes include a tubular body of biaxially oriented thermoplastic material, together with size reduction, elimination, and/or reorientation of longitudinally spaced, raised circumferential witness features, to mitigate or avoid interference between such witness features and graduated volumetric markings on an outside surface of the tubular body. Methods and apparatus for vacuum forming of unitary measuring pipettes are also provided. Gas permeable apertures or pores having a maximum width of no greater than 150 microns, in ranges of 10-100 microns, 10-50 microns, or subranges thereof, may be defined in face plates or inserts received by mold blanks, or defined in molding surface of cooperating mold bodies, and may be used to produce a tubular pipette body having reduced height witness features. Cooperating mold bodies may each be produced from multiple mold body sections with gas passages defined therein and/or therebetween.

BIAXIALLY ORIENTED THERMOPLASTIC PIPETTE, AND METHOD AND APPARATUS FOR FORMING SAME

Unitary measuring pipettes include a tubular body of biaxially oriented thermoplastic material, together with size reduction, elimination, and/or reorientation of longitudinally spaced, raised circumferential witness features, to mitigate or avoid interference between such witness features and graduated volumetric markings on an outside surface of the tubular body. Methods and apparatus for vacuum forming of unitary measuring pipettes are also provided. Gas permeable apertures or pores having a maximum width of no greater than 150 microns, in ranges of 10-100 microns, 10-50 microns, or subranges thereof, may be defined in face plates or inserts received by mold blanks, or defined in molding surface of cooperating mold bodies, and may be used to produce a tubular pipette body having reduced height witness features. Cooperating mold bodies may each be produced from multiple mold body sections with gas passages defined therein and/or therebetween.

Method and Apparatus for Recycling Post-Consumer Plastic Waste
20210323198 · 2021-10-21 ·

A method of recycling post-consumer plastic waste into mono filament for use in fused filament fabrication, injection molding, or other plastic manufacturing processes. Contaminated curbside plastic waste is sorted and granulated to uniform sized flakes. The plastic regrind is cleaned in a closed-loop wash cycle and dried at 160° F. and −70 dew point to reduce the moisture content to less than 0.03%. The effluent water is purified to be reused in the system. The flake plastic is extruded to a molten state and passes through additional melt filtration. A laser micrometer measures extrudate metrics like diameter and ovality to dynamically control feed and flow rates of the extruder to maintain diameter uniformity within 0.018 mm of target diameter.

Method and Apparatus for Recycling Post-Consumer Plastic Waste
20210323198 · 2021-10-21 ·

A method of recycling post-consumer plastic waste into mono filament for use in fused filament fabrication, injection molding, or other plastic manufacturing processes. Contaminated curbside plastic waste is sorted and granulated to uniform sized flakes. The plastic regrind is cleaned in a closed-loop wash cycle and dried at 160° F. and −70 dew point to reduce the moisture content to less than 0.03%. The effluent water is purified to be reused in the system. The flake plastic is extruded to a molten state and passes through additional melt filtration. A laser micrometer measures extrudate metrics like diameter and ovality to dynamically control feed and flow rates of the extruder to maintain diameter uniformity within 0.018 mm of target diameter.

MOLDED FOAM
20210283819 · 2021-09-16 · ·

The present invention relates to molded foam having no hollow space caused in a plate-shaped portion. The molded foam comprises a tube body and a plate-shaped portion joined to the outer side of the tube body. The expansion ratio of the molded foam is lower than two, and a value of a thickness B/a thickness A as a relationship between the thickness A of the tube body at the periphery of a point joined to the plate-shaped portion and the thickness B of the plate-shaped portion is less than 2.82.

MOLDED FOAM
20210283819 · 2021-09-16 · ·

The present invention relates to molded foam having no hollow space caused in a plate-shaped portion. The molded foam comprises a tube body and a plate-shaped portion joined to the outer side of the tube body. The expansion ratio of the molded foam is lower than two, and a value of a thickness B/a thickness A as a relationship between the thickness A of the tube body at the periphery of a point joined to the plate-shaped portion and the thickness B of the plate-shaped portion is less than 2.82.