The invention relates to a device (10) and method for measuring the curing process of a curable material by means of dielectric spectroscopy, said device comprising: a mobile transmission unit (12) having a sensor (14) for making contact with a sample of the curable material, and a receiving unit (18), which is physically separate from the transmission unit (12), is configured to communicate wirelessly with the transmission unit (12) and contains an analysis device (22). The sensor (14) is formed on a sensor board (44) that is adapted to be detachably connected to the transmission unit, and the analysis device (22) of the receiving unit (18) is designed to determine, on the basis of frequency changes detected during a measurement process, at least three states: a first state of decreasing frequency which corresponds to the sample of the uncured material being applied to the sensor (14), a second state of a substantially constant first frequency which corresponds to a completed application of the sample of the uncured organic material to the sensor (14), and a third state of a substantially constant second frequency which corresponds to a desired curing state of the curable material being reached, wherein the constant second frequency is higher than the constant first frequency.

A process for manufacturing a timepiece component having a first step (E1) consisting in arranging a metal insert in an injection mold, one surface of said metal insert being at least partially coated with a primer, a second step (E2) of injecting an elastomer material into the injection mold in order to overmold the elastomer material over the metal insert, a third step (E3) of vulcanizing the elastomer material, wherein the temperature of the injection mold is variable, and a step (E31) of increasing the temperature of the injection mold between a first temperature at a first instant during the injection second step (E2), and a second temperature higher than the first temperature at a second instant, during the vulcanization third step (E3).

Aspects of the disclosure are directed to methods and apparatus involving the extrusion of polymers or other materials. As may be implemented in accordance with various embodiments, a polymer is delivered into an inlet of a nozzle structure having the inlet and an outlet. The polymer is viscously heated and melted by rotating the nozzle structure about an axis extending through the inlet and the outlet, therein facilitating extrusion of the melted polymer through the nozzle structure outlet. A polymer supply may deliver the polymer into the nozzle structure inlet, and a coupler may facilitation rotation of the nozzle structure. A driver may further operate to control rotation of the nozzle structure relative to the coupler, for instance by generating a rotational output that causes rotation of the nozzle structure.

A composite forming apparatus includes an end effector, a forming feature that is coupled to the end effector, and a heating element that is coupled to the forming feature to heat the forming feature. The end effector moves the forming feature relative to a composite ply to form the composite ply over a forming tool or over a prior formed composite ply. The forming feature heats the composite ply via conduction.

According to an embodiment, disclosed is a curing-device comprising: a stage; a light emitting module including a substrate disposed on the stage and a plurality of light emitting elements disposed on the substrate; and a plurality of transparent blocks disposed between the light emitting module and the stage, wherein the substrate includes a plurality of first sections and a plurality of second sections which are disposed in a first direction, the intervals in the first direction between the light emitting elements disposed in the first sections is smaller than the intervals in the first direction between the light emitting elements disposed in the second sections, and the plurality of transparent blocks are disposed on the first sections.

Techniques are described for applying an edge sealant to the edge of a multi-layer optical device. In particular, embodiments provide an apparatus that performs a precision measurement of the perimeter of an eyepiece, applying the edge sealant (e.g., polymer) based on the precision-measured perimeter, and subsequently cures the edge sealant, using ultraviolet (UV) light that is directed at the edge sealant. The curing process may be performed within a short time following the application of the edge sealant, to ensure that any wicking of the edge sealant between the layers of the eyepiece is controlled to be no greater than a particular depth tolerance. In some examples, the edge sealant is applied to the optical device prevent, or at least reduce, the leakage of light from the optical device, and also to ensure and maintain the structure of the multi-layer optical device.

The present invention provides an imprint apparatus for transferring a pattern of a mold to a shot region on a substrate by curing an imprint material on the substrate while the mold and the imprint material are in contact with each other, comprising a heating unit configured to deform a shape of the shot region by heating each of a plurality of portions of the substrate, and a control unit configured to obtain a target heat quantity in each of the plurality of portions so that the shape of the shot region becomes closer to a target shape, generate a heating profile for each of the plurality of portions so that a heat quantity in the portion becomes equal to the target heat quantity, and control the heating unit to heat each of the plurality of portions according to the generated heating profile.

A procedure for repairing a polymer matrix composite component is provided. The procedure includes the steps of: providing a polymer matrix composite component having a site prepared for repair by removal of damaged or defective material; locating an uncured, polymer matrix composite repair patch at the site to re-build the component thereat; and curing the polymer matrix of the repair patch by heating the patch using eddy currents induced by one or more alternating current coils. The repair patch is without metallic additives, such that the repaired polymer matrix composite after the curing step is also without metallic additives in the vicinity of the repair patch.

A method of manufacturing a sealed circuit card assembly includes disposing a circuit card assembly within a volume defined by a housing and at least partially filling the volume with a curable liquid such that the curable liquid encapsulates at least a circuit card. The method may also include curing the curable liquid to form a potted circuit card assembly and, after at least partially filling the volume with the curable liquid and after curing the curable liquid, vacuum impregnating the potted circuit card assembly with a sealant to seal any exposed interfaces or cracks to form the sealed circuit card assembly. Accordingly, the sealed circuit card assembly may include a first cured material encapsulating the circuit card of the circuit card assembly and a second cured material disposed within, for example, a porosity of the first cured material.

In a first aspect of the invention there is provided a method of making a wind turbine component, the method comprising supporting a layup (14) of fibrous reinforcing material in a mould (12); providing a supply of resin (16); providing a supply of hardener (20) comprising at least a first hardener (20a) and a second hardener (20b), the second hardener being faster than the first hardener; mixing resin with the first and/or second hardener to create a resin mixture (24); supplying the resin mixture (24) to the layup (14) during an infusion process; monitoring one or more process parameters of the infusion process; and controlling the speed of the hardener (20) by varying the relative proportions of the first and second hardeners (20a, 20b) in the resin mixture (24) during the course of the infusion process in dependence upon the one or more process parameters.