In one example, a housing for an electronic device may be disclosed which may include a first multi-layer structure. The first multi-layer structure may include a first layer and a second layer formed on the first layer. Each of the first layer and the second layer may include a plurality of protruding features and a plurality of recessing features on an edge of the first layer and the second layer. At least one of the plurality of recessing features of one layer may intersect at least one of the plurality of protruding features of other layer.

A strut comprises a composite cylinder with a mid-strut fitting mounted on an interface region on a mid-portion of said cylinder. At least in the interface region, layers of helical-filaments are displaced radially-outward and even inclined with respect to an axis of the cylinder such that they may follow a path with a radial component. A mid-strut fitting is provided which has a plurality of teeth on an inner circumferential surface. The plurality of teeth engage the helical-filaments in the interface region to provide a mechanical connection. Portions of surface and intermediate layers of the helical-filaments may be removed to expose ends of those filaments in the interface region before mounting the mid-strut fitting on the cylinder.

A method of repairing a polymeric composite workpiece. The method comprises identifying a localized area of the polymeric composite workpiece having a defect. A plurality of three dimensional interface structures are aligned adjacent at least a portion of the localized area. The method includes applying a polymeric composite patch to the localized area such that the interface structures are disposed between the polymeric composite workpiece and the polymeric composite patch. An alternating electromagnetic field may be introduced to selectively induce localized heating of the interface structures. The localized heating softens regions of the polymeric composite workpiece and the polymeric composite patch adjacent the interface structures, causing the interface structures to penetrate a distance into the respective polymeric composite workpiece and the polymeric composite patch.

A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

A plastics molding process is provided in which a first (2) and a second plastic part (3) are molded such that a contact surface is formed between the two parts. The first part (2) is molded firstly and, while at least the contact surface is still in a liquid or plastic state, an attachment promoting powder (16) that is compatible with, and has the characteristic of attaching to, the plastic of the first part (2), is applied to it. Thereafter, the second part (3) is molded so as to contact the first part at the contact surfaces such that as it solidifies, it attaches to the attachment promoting powder (16) and thereby to the first part (2). The second part (3) may be a plastic foam filling for a hollow first part (2). The attachment promoting powder (16) may be a suitable grade of diatomaceous earth or a natural or synthetic equivalent.

Feedstocks for additive manufacturing are provided. The feedstock may include a matrix material, and one or more capsules disposed in the matrix material, wherein the one or more capsules are configured to be removable from a surface portion when the matrix material is solidified to form one or more cavities in the surface portion. Methods of depositing the feedstocks and objects formed from the feedstocks are also provided.

A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

A component joining structure having: a first component provided with a joint portion for joining components together; a second component formed from a resin material in which fibers are oriented in multiple directions; and a joined portion that is integrally formed to the second component using a resin material, that is in close contact with the joint portion and is joined to the joint portion, and in which the fibers are oriented in multiple directions.

A method of forming a joint between a composite component and a metallic component is disclosed. The method includes forming a first groove in an outer surface of the metallic component on a first end of the metallic component. The first groove extends circumferentially on the outer surface relative to a center axis of the metallic component, and the first groove extends radially inward from the outer surface relative the center axis. The method further includes inserting the first end of the metallic component into a first end of the composite component. A second groove on the composite component over the first groove of the metallic component such that the composite component extends radially inward into the first groove of the metallic component. A composite hoop reinforcement is then applied in the second groove in a circumferential direction and the composite component, and the composite hoop reinforcement are solidified.

Methods and apparatus for tooling in layered structures for increased joint performance are disclosed. A disclosed example method includes placing a tool onto a first substrate to define an impression in the first substrate, curing the first substrate, removing the tool from the first substrate to define a joint interface corresponding to the impression, and coupling, at the joint interface, the first substrate to a second substrate.