The present invention relates to a process for manufacturing the so-called bladders, that is generally tubular elements made of rubber, which can be inflated and used as compacting tools in the processed for curing composites, allowing to distribute homogeneously, on the surface in contact to the portion to be cured, the pressure obtained by inletting air or other gas inside thereof.

A method of forming an implant having a porous tissue ingrowth structure and a bearing support structure. The method includes depositing a first layer of a metal powder onto a substrate, scanning a laser beam over the powder so as to sinter the metal powder at predetermined locations, depositing at least one layer of the metal powder onto the first layer and repeating the scanning of the laser beam.

A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 m or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 m, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.

A method for roughening a surface of a body by a laser, the laser acting on the surface of a body and thereby creating recesses in the surface, and the laser thereby being directed and guided onto the surface and set in terms of its power output in such a way that recesses with at least two substantially different depths are created in the surface of the body.

A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

Methods and systems are provided for fabricating a composite structure. In one example, the composite structure may include a honeycomb core sandwiched between face sheets. An edge of the honeycomb core may be abraded and a top face sheet may be perforated. As such, a likelihood of delamination of the composite structure during a curing step may be reduced.

A fastening insert made of plastic with a T-shaped configuration consisting of an insert disc and a hollow cylindrical shaft fastened to the insert disc. The insert disc has a plurality of passage openings arranged off-center, at least one of which has an edge projection extending circumferentially continuously or circumferentially in sections, which is formed as toothing and extends on one side or both sides beyond the respective fastening side of the insert disc. This toothing ensures an additional form-fit connection or fixation of the fastening insert in a preferably fiber-reinforced composite material.

A method for producing a component made of fiber-reinforced plastic includes comprises the steps of providing at least one insert part, placing the insert part in a mold and embedding the insert part using a matrix material and at least one fiber mat in the mold. The insert part is provided as a closed capsule.

A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

In one example, a housing for an electronic device may be disclosed which may include a first multi-layer structure. The first multi-layer structure may include a first layer and a second layer formed on the first layer. Each of the first layer and the second layer may include a plurality of protruding features and a plurality of recessing features on an edge of the first layer and the second layer. At least one of the plurality of recessing features of one layer may intersect at least one of the plurality of protruding features of other layer.