The invention provides a method producing contact lenses, comprising the step of: separating the mold into the male and female mold halves, with the silicone hydrogel contact lens adhered on one of the male and female mold halves; bring a shaped ultrasonic horn in direct contact with at least one area of a non-optical surface of the female mold half or the male mold half having the molded silicone hydrogel contact lens attached thereon; and applying a ultrasonic vibrational energy to the at least one area of the non-optical surface of the female mold half or the male mold half having the molded silicone hydrogel contact lens attached thereon so as to separate the molded silicone hydrogel contact lens from the mold half attached thereon.

A method for forming a stick for lips includes positioning a mould (2) made of an elastic material, such as silicone, on a first support (11), the said mould comprising a casting cavity (4) endowed with an opening (5). The method further includes centring a cup (3) in the casting cavity (4) opening (5), pouring a melted cosmetic product through the cup (3) and into the casting cavity (4), waiting for the solidification of the melted cosmetic product in the casting cavity (4) so as to form the stick, and extracting the stick (7) from the cavity by gripping the cup (3).

A method for potting electrical components into complex finishing forms is presented. A releasing agent is added into a mold cavity. Next, an initial layer of potting compound is added into the mold cavity. A label layer is added into the initial layer of the potting compound. A set of electronic components is added over the label layer. An interstitial layer of potting compound is added over the set of electronic components. A reinforcement layer is added along the interstitial layer. A finishing layer of the potting compound is added over the reinforcement layer forming an uncured potted electronic product. The uncured potted electronic product is cured within the mold cavity in order to produce a cured potted electronic product. The cured potted electronic product is released from the negative mold using a releasing device.

A method for potting electrical components into complex finishing forms is presented. A releasing agent is added into a mold cavity. Next, an initial layer of potting compound is added into the mold cavity. A label layer is added into the initial layer of the potting compound. A set of electronic components is added over the label layer. An interstitial layer of potting compound is added over the set of electronic components. A reinforcement layer is added along the interstitial layer. A finishing layer of the potting compound is added over the reinforcement layer forming an uncured potted electronic product. The uncured potted electronic product is cured within the mold cavity in order to produce a cured potted electronic product. The cured potted electronic product is released from the negative mold using a releasing device.

A method for potting electrical components into complex finishing forms is presented. A releasing agent is added into a mold cavity. Next, an initial layer of potting compound is added into the mold cavity. A label layer is added into the initial layer of the potting compound. A set of electronic components is added over the label layer. An interstitial layer of potting compound is added over the set of electronic components. A reinforcement layer is added along the interstitial layer. A finishing layer of the potting compound is added over the reinforcement layer forming an uncured potted electronic product. The uncured potted electronic product is cured within the mold cavity in order to produce a cured potted electronic product. The cured potted electronic product is released from the negative mold using a releasing device.

A method for potting electrical components into complex finishing forms is presented. A releasing agent is added into a mold cavity. Next, an initial layer of potting compound is added into the mold cavity. A label layer is added into the initial layer of the potting compound. A set of electronic components is added over the label layer. An interstitial layer of potting compound is added over the set of electronic components. A reinforcement layer is added along the interstitial layer. A finishing layer of the potting compound is added over the reinforcement layer forming an uncured potted electronic product. The uncured potted electronic product is cured within the mold cavity in order to produce a cured potted electronic product. The cured potted electronic product is released from the negative mold using a releasing device.

A reusable countertop mold in accordance with the present invention includes a bracket member detachably secured to a rail portion of a cabinet member for a substantially horizontal substrate that receives deformable material upon a surface of the substrate. The bracket member includes vertical, horizontal and channel members integrally joined together for enabling a channel member to removably receive the rail member. The mold further includes a locking bolt for detachably securing the bracket member to the rail portion of the support member. A form member is detachably secured to the bracket member, the form member continuously extending outside the perimeter of the substrate and receives deformable material that ultimately solidifies; whereby, the substrate surface and the form member cooperate to configure a countertop that continuously extends upon and outside the perimeter of the substrate, thereby forming a countertop having an integrally joined overhang portion; whereupon, the reusable countertop mold is removed from the solidified countertop overhang portion and the rail portion.

A mold for encapsulating an electrical component. The mold includes an encapsulation chamber and an air inlet. The encapsulation chamber is defined by a housing, an open top, and a solid bottom. The housing includes a solid outer wall, a permeable inner wall, and an air chamber between the solid outer wall and the inner wall. The air inlet is configured to introduce a gas into the air chamber. The encapsulation chamber is sized and shaped to receive the electrical component while leaving a gap for the introduction of encapsulant around the electrical component. The encapsulant may be silicone rubber. To remove an encapsulated electrical component, pressurized air may be introduced through the air inlet into the air chamber, passing through the permeable inner wall, separating the outer surface of the encapsulant from the housing, and allowing the combination casting to be removed from the mold.

A mold for encapsulating an electrical component. The mold includes an encapsulation chamber and an air inlet. The encapsulation chamber is defined by a housing, an open top, and a solid bottom. The housing includes a solid outer wall, a permeable inner wall, and an air chamber between the solid outer wall and the inner wall. The air inlet is configured to introduce a gas into the air chamber. The encapsulation chamber is sized and shaped to receive the electrical component while leaving a gap for the introduction of encapsulant around the electrical component. The encapsulant may be silicone rubber. To remove an encapsulated electrical component, pressurized air may be introduced through the air inlet into the air chamber, passing through the permeable inner wall, separating the outer surface of the encapsulant from the housing, and allowing the combination casting to be removed from the mold.

An article manufactured in a mould and which comprises a structural composite of plastics layers, the article having a wall defining an internal space for holding contents therein; wherein, the wall is formed from at least two layers of plastics materials; wherein a first of said layers comprises a thermoplastics material and at least a second layer comprises a thermosetting resin and a fibrous layer.