Patent classifications
B29C39/44
Process for Jointing Cables, Apparatus for Performing Such a Process and Thermoplastic Joint So Manufactured
In one example, an apparatus for jointing power cables includes a mold extending along a longitudinal axis, and having a feeding inlet and being made of two halves forming a longitudinal pass-through seat for receiving the cables. An extruder is connected to the feeding inlet. A heating system and a cooling system is associated with the mold. A measuring system for detecting temperature or pressure includes a plurality of probes for detecting temperature or pressure.
POLYAMIDE-IMIDE FILM AND METHOD FOR PRODUCING SAME
An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2=8 to 32 as a baseline, the film shows a peak area of 50% or above around 2=23 with respect to a peak area seen around 2=15.
POLYAMIDE-IMIDE FILM AND METHOD FOR PRODUCING SAME
An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2=8 to 32 as a baseline, the film shows a peak area of 50% or above around 2=23 with respect to a peak area seen around 2=15.
POLYAMIDE-IMIDE FILM
One embodiment may provide a polyamide-imide film which is colorless and transparent while having an adequate level of solubility and excellent mechanical properties, the polyamide-imide film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, for a square cross-section of 1 cm1 cm and a thickness of 30 um to 100 mm, the polyamide-imide film has a dissolution time of 5-60 minutes in 10 ml of dimethylacetamide (DMAc), and for a thickness of 50 mm, the polyamide-imide film has a yellowness of at most 5, a haze of at most 2%, a permeability of at least 85% and a modulus of at least 5.0 GPa.
POLYAMIDE-IMIDE FILM AND METHOD FOR PREPARING SAME
An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4X/Y12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.
METHOD OF MANUFACTURING MICRONEEDLE ARRAY
Provided is a method of manufacturing a microneedle array in which an active ingredient is concentrated at a tip while an active ingredient content is guaranteed. In order to achieve the object, a method of manufacturing a microneedle array in which needle-like recessed portions of a mold are filled with a liquid to form one dose of a patch includes determining a filling amount of the liquid from a difference in mass of the mold before and after filling of the liquid, determining a filling state of the liquid in the mold filled with the liquid, sucking the mold in which the filling amount and the filling state of the liquid are determined to be normal from a rear face, and evaporating and drying a solvent of the liquid of the sucked mold.
METHOD OF MANUFACTURING MICRONEEDLE ARRAY
Provided is a method of manufacturing a microneedle array in which an active ingredient is concentrated at a tip while an active ingredient content is guaranteed. In order to achieve the object, a method of manufacturing a microneedle array in which needle-like recessed portions of a mold are filled with a liquid to form one dose of a patch includes determining a filling amount of the liquid from a difference in mass of the mold before and after filling of the liquid, determining a filling state of the liquid in the mold filled with the liquid, sucking the mold in which the filling amount and the filling state of the liquid are determined to be normal from a rear face, and evaporating and drying a solvent of the liquid of the sucked mold.
INSTALLATIONS AND METHODS FOR MOULDING FOOD PRODUCTS WITH A PRESSURIZED AIR FOOD PRODUCT EJECTION SYSTEM FROM A MOULD DRUM
A moulding installation and method for moulding food products from a pumpable foodstuff mass are described. A revolving mould drum is provided with multiple mould cavities and a mass feed member is arranged at a fill position to transfer foodstuff mass into passing mould cavities. The foodstuff mass forms a food product in the mould cavity. A pressurized air food product ejection system includes air ducts in the mould drum that extend to the cavities and at least a portion of the surface delimiting a mould cavity is air permeable. The ejection system further includes a pressurized air source to feed pressurized air at a regulated ejection air pressure thereof to the air ducts. A controller is adapted to input at least one target parameter related to filling of the mould cavities with the foodstuff mass via the mouth of the mass feed member. The controller is adapted to automatically set an ejection air pressure by the pressurized air source on the basis of the inputted target parameter.
METHOD FOR CURING ROOM TEMPERATURE CURABLE SILICONE COMPOSITIONS
This disclosure relates to a method for reducing gas bubble entrapment from bulk cured room temperature condensation curable silicone compositions. The method comprising applying a predefined volume of a bulk cured room temperature condensation curable silicone composition bulk curable silicone composition onto or into a target substrate. The method further comprising at least initially curing the composition in an atmosphere having a relative humidity of X %, wherein X has a value in the range of 0<X?40%, for a predetermined time or until no gas bubbles remain visible in the composition.
STRUCTURE AND METHOD FOR MONITORING DIRECTED SELF-ASSEMBLY PATTERN FORMATION
A capacitive sensor array for in-situ monitoring directed self-assembly of a self-assembling material is provided. The capacitive sensor array includes a bottom electrode plate including a plurality of bottom electrodes that are spaced apart and electrically isolated from one another, template structures located on the bottom electrode plate, wherein the template structures define trenches therebetween, each of the trenches exposing at least one of the plurality of bottom electrodes; and a top electrode plate assembled on the bottom electrode plate, wherein the top electrode plate includes a plurality of top electrodes that are spaced apart and electrically isolated from one another, the top electrodes facing and intersecting, but electrically isolated from, the bottom electrodes.