Patent classifications
B29C43/18
METHOD OF MANUFACTURING ELASTOMER ARTICLES HAVING EMBEDDED ELECTRONICS
A method of manufacturing a medical component includes molding a first member of the medical component from an elastomeric material. The first member includes a first end defined by a closed base wall, an opposing second end which is an open end, a sidewall extending between the first and second ends, and an internal recess to receive at least one electronic device. The method further includes positioning the electronic device within the recess of the first member to form an assembly, such that the electronic device is received in an inverted open cavity defined by the sidewall. The method further includes applying a protective film on the second end of the first member, such that the protective film covers an exposed surface of the electronic device. In addition, the method includes overmolding the assembly with the elastomeric material to form the medical component having the electronic device embedded therein.
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
CERAMIC MATRIX COMPOSITE COMPONENTS WITH MICROSTRUCTURE FEATURES
A method of forming a ceramic matrix composite component. The ceramic matrix composite component is adapted for use in a gas turbine engine. The method including forming the component using ceramic materials and infiltrating the component with a matrix material.
CERAMIC MATRIX COMPOSITE COMPONENTS WITH MICROSTRUCTURE FEATURES
A method of forming a ceramic matrix composite component. The ceramic matrix composite component is adapted for use in a gas turbine engine. The method including forming the component using ceramic materials and infiltrating the component with a matrix material.
Tissue Integration Devices And Methods Of Making The Same
One aspect of the present disclosure relates to a tissue integration device. The tissue integration device can be produced by forming a polymer mixture into a shape. The polymer mixture can include a polymer resin and a growth-promoting medium. Next, at least one polymer forming the polymer resin can be oriented in at least one direction. The shaped polymeric material can then be formed into the tissue integration device.
Optical element, optical apparatus, image pickup apparatus, and method for producing optical element
An optical element includes a first substrate having a first surface, a resin member disposed on the first surface, and a second substrate disposed above the resin member with a joining member interposed therebetween. The resin member has a first region contacting the joining member and a second region surrounding the first region and not contacting the joining member. An inclined portion having a thickness increasing from a starting point located in the second region toward an outer circumference of the resin member, is disposed in the second region. A tangent of the first surface, orthogonal to a normal of the first surface passing through the starting point, and a straight line passing through the starting point and a point at which the inclined portion has a largest thickness, form an angle of 25° or more and 45° or less.
Crystalline radical polymerizable composition for electrical and electronic component, molded article of electrical and electronic component using the composition, and method of the molded article of electrical and electronic component
[Problems] An object of the present invention is to provide a crystalline radical polymerizable composition which is excellent in flowability and is easy to handle. [Solution Means] The crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention is characterized by comprising at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. In addition, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention, the crystalline radical polymerizable compound is characterized by comprising one or more selected from unsaturated polyester, epoxy (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, -polyether (meth) acrylate, radical polymerizable monomer and radical polymerizable polymer.
PISTON INCLUDING A COMPOSITE LAYER APPLIED TO METAL SUBSTRATE
A piston for a heavy duty diesel engine including a composite layer forming at least a portion of a combustion surface is provided. The composite layer has a thickness greater than 500 microns and includes a mixture of components typically used to form brake pads, such as a thermoset resin, an insulating component, strengthening fibers, and an impact toughening additive. According to one example, the thermoset resin is a phenolic resin, the insulating component is a ceramic, the strengthening fibers are graphite, and the impact toughening additive is an aramid pulp of fibrillated chopped synthetic fibers. The composite layer also has a thermal conductivity of 0.8 to 5 W/m.Math.K. The body portion of the piston can include an undercut scroll thread to improve mechanical locking of the composite layer. The piston can also include a ceramic insert between the body portion and the composite layer.
PISTON INCLUDING A COMPOSITE LAYER APPLIED TO METAL SUBSTRATE
A piston for a heavy duty diesel engine including a composite layer forming at least a portion of a combustion surface is provided. The composite layer has a thickness greater than 500 microns and includes a mixture of components typically used to form brake pads, such as a thermoset resin, an insulating component, strengthening fibers, and an impact toughening additive. According to one example, the thermoset resin is a phenolic resin, the insulating component is a ceramic, the strengthening fibers are graphite, and the impact toughening additive is an aramid pulp of fibrillated chopped synthetic fibers. The composite layer also has a thermal conductivity of 0.8 to 5 W/m.Math.K. The body portion of the piston can include an undercut scroll thread to improve mechanical locking of the composite layer. The piston can also include a ceramic insert between the body portion and the composite layer.