Composite structures and methods of forming composite structures may include at least one ply of material extending along a length of the composite structure. The at least one ply of material includes sections of material extending along the length of the composite structure.

Composite structures and methods of forming composite structures may include at least one ply of material extending along a length of the composite structure. The at least one ply of material includes sections of material extending along the length of the composite structure.

A method for manufacturing an electrode disclosed herein includes: steps of forming a coating film composed of an electrode material by passing the electrode material through a gap between a rotating first roll and a rotating second roll; adhering the coating film to the second roll and conveying the coating film; and transferring the conveyed coating film onto an electrode current collector conveyed by a conveying device to form an electrode mixture layer composed of the coating film. The speed ratio between a peripheral speed of the second roll and a conveying speed of the electrode current collector is changed by changing the peripheral speed of the second roll on the basis of the thickness of the coating film or the width of the gap. The timing of the change in the speed ratio is allowed to be based on the Equation (1) described in the description.

A resin multilayer substrate includes a stacked body provided by stacking and thermocompression bonding resin layers, a first conductor pattern inside the stacked body, and a first protective coating covering at least a first surface and a side surface of the first conductor pattern. The resin layers are made of a first thermoplastic resin, and the first protective coating is made of a second thermoplastic resin. Both of the first and second thermoplastic resins soften at a predetermined press temperature or less. The second thermoplastic resin has a storage modulus lower than a storage modulus of the first thermoplastic resin at a temperature equal to or less than the predetermined press temperature and equal to or more than room temperature.

A resin multilayer substrate includes a stacked body provided by stacking and thermocompression bonding resin layers, a first conductor pattern inside the stacked body, and a first protective coating covering at least a first surface and a side surface of the first conductor pattern. The resin layers are made of a first thermoplastic resin, and the first protective coating is made of a second thermoplastic resin. Both of the first and second thermoplastic resins soften at a predetermined press temperature or less. The second thermoplastic resin has a storage modulus lower than a storage modulus of the first thermoplastic resin at a temperature equal to or less than the predetermined press temperature and equal to or more than room temperature.

A method for assembling an assembly comprising a tape (100) of retaining elements and a substrate (200), said method comprising the following steps: a step of forming a tape of retaining elements by dispensing a molding material into a molding device (1), so as to form a tape (100) of retaining elements comprising a base (51) presenting a bottom face (511) and a top face (512), the top face (511) of the base (51) being provided with retaining elements; and a step of applying a substrate (200) against the bottom face (511) of the base (51) prior to said bottom face (512) of the base (51) solidifying in such a manner as to cause the substrate (200) to penetrate at least in part beyond a plane defined by the bottom face (511) of the base (51) of the tape (100).

A method for assembling an assembly comprising a tape (100) of retaining elements and a substrate (200), said method comprising the following steps: a step of forming a tape of retaining elements by dispensing a molding material into a molding device (1), so as to form a tape (100) of retaining elements comprising a base (51) presenting a bottom face (511) and a top face (512), the top face (511) of the base (51) being provided with retaining elements; and a step of applying a substrate (200) against the bottom face (511) of the base (51) prior to said bottom face (512) of the base (51) solidifying in such a manner as to cause the substrate (200) to penetrate at least in part beyond a plane defined by the bottom face (511) of the base (51) of the tape (100).

A method for manufacturing a single- or multi-layered substrate, which is suitable for a floor panel, where, for forming a substrate layer, thermoplastic material is strewn, for example, onto a transport device. The strewn thermoplastic material is consolidated under the influence of pressure and/or heat, preferably in a press device, where the thermoplastic material to be strewn comprises micronized material.

A method for manufacturing a single- or multi-layered substrate, which is suitable for a floor panel, where, for forming a substrate layer, thermoplastic material is strewn, for example, onto a transport device. The strewn thermoplastic material is consolidated under the influence of pressure and/or heat, preferably in a press device, where the thermoplastic material to be strewn comprises micronized material.

A retaining device includes an elastic film extending in a longitudinal direction, and a plastics tape extending in the longitudinal direction having a base presenting a bottom face and a top face and including a plurality of retaining elements extending from the top face, the device being characterized in that the film, the base, and the retaining elements are formed integrally by extrusion.