A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.

Continuous compression molding machines (CCMMs) and methods of continuous compression molding a consolidated thermoplastic matrix composite material are disclosed herein. The CCMMs include a mold, a heat zone heating structure, a consolidation zone heating structure, and a stress relaxation zone heating structure. The CCMMs also include a press structure, a demold structure, and a supply structure. The methods include providing a thermoplastic matrix composite material (TMCM) that includes a thermoplastic material to a CCMM. During the providing, the methods also include heating the TMCM within a heat zone of the CCMM, cooling and consolidating the TMCM within a consolidation zone of the CCMM, relaxing stress within the TMCM within a stress relaxation zone of the CCMM, demolding the TMCM within a demold zone of the CCMM at a mold temperature that is greater than a glass transition temperature of the thermoplastic material, and periodically compressing the TMCM.

This fiber-reinforced resin molded article has: a sheet molding compound layer; a continuous fiber reinforcing material layer; and a harrier layer, wherein the barrier layer is interposed between the sheet molding compound layer and the continuous fiber reinforcing material layer.

This fiber-reinforced resin molded article has: a sheet molding compound layer; a continuous fiber reinforcing material layer; and a harrier layer, wherein the barrier layer is interposed between the sheet molding compound layer and the continuous fiber reinforcing material layer.

A powder spraying device has a first powder spraying tube and a second powder spraying tube arranged parallelly. The first powder spraying tube has a first opening formed on a bottom thereof. A first gate is mounted moveably on the first opening to selectively cover the first opening. The second powder spraying tube has a second opening formed on a bottom thereof. A second gate is mounted moveably on the second opening to selectively cover the second opening. When the first powder spraying tube and the second powder spraying tube are filled with different plastic particles, the first opening and the second opening are opened and closed at different times to spray different plastic particles so that the specific molding method requirements are met.

A powder spraying device has a first powder spraying tube and a second powder spraying tube arranged parallelly. The first powder spraying tube has a first opening formed on a bottom thereof. A first gate is mounted moveably on the first opening to selectively cover the first opening. The second powder spraying tube has a second opening formed on a bottom thereof. A second gate is mounted moveably on the second opening to selectively cover the second opening. When the first powder spraying tube and the second powder spraying tube are filled with different plastic particles, the first opening and the second opening are opened and closed at different times to spray different plastic particles so that the specific molding method requirements are met.

Provided a method for supplying a resin by which appropriate replacement of a cartridge enables resin supply to be performed appropriately. The method for supplying a resin includes: a primary resin supplying step of supplying a liquid resin contained in a first cartridge to a supply target, the first cartridge having a remaining amount of liquid resin smaller than a target supply amount appropriate for one-time resin supply to the supply target; a cartridge replacing step of replacing, after the primary resin supplying step, the first cartridge with a second cartridge already subjected to dripping out; and a secondary resin supplying step of supplying a liquid resin contained in the second cartridge to the supply target after the cartridge replacing step.

A vehicle trim element and method for manufacturing the trim element. The method includes the steps of: supplying a substrate comprising natural fibers and thermoplastic fibers entangled together, supplying a first layer comprising a base layer and provided with at least one reinforcing and/or decorative element, and compressing the first layer against the substrate. The method also includes, prior to compression, aligning the first layer and the substrate by aligning a first positioning element of the substrate and a second positioning element of the first layer arranged outside the at least one reinforcing and/or decorative element.

This mold for prepreg lamination includes a first surface only having a surface flat along one direction; second surfaces having a surface flat along the one direction and disposed at a predetermined angle with respect to the first surface; and a third surface with a cross-sectional shape, which is a surface yielded from a cut in an orthogonal direction to the one direction, that is an arc, and with one end side connected to the first surface and the other end side connected to the second surface. First bend sections having a protruding shape are formed on the second surface and the third surface and serve as boundaries, and one of the surfaces is slanted relative to the other surfaces. On the third surface, the diameter of the arc on the other surface becomes gradually smaller as further away from the first bend section along the one direction.

Resin pellets (7) supplied to a resin block forming space (150) are heated and melted by a heater unit (300) and the melted resin pellets (7) are cooled and solidified to form a resin layer. Since a lifting mechanism (230) of a lifting unit (200) lowers a bottom surface plate (215) whenever forming each of the resin layers, the resin layers formed by the resin block forming space (150) are sequentially laminated to form a large resin block.