A molding method for making a monolithic component made of C-SMC and internally including a cavity, including preparing a press including first and second half molds and movable side carriages defining a molding space, and placing a core inside the molding space. The core comprises a membrane, delimiting a containing space shaped to form the cavity, and at least one connector engaged with the membrane. The method includes wrapping a charge of material to be molded around the core, fixing the core inside one between the first and the second half molds, and filling the containing space of the membrane with a filling material. After closing the half molds, applying a molding pressure and then emptying the containing space of the filling material and, after opening the half molds, removing the core from the molded monolithic component.

A molding method for making a monolithic component made of C-SMC and internally including a cavity, including preparing a press including first and second half molds and movable side carriages defining a molding space, and placing a core inside the molding space. The core comprises a membrane, delimiting a containing space shaped to form the cavity, and at least one connector engaged with the membrane. The method includes wrapping a charge of material to be molded around the core, fixing the core inside one between the first and the second half molds, and filling the containing space of the membrane with a filling material. After closing the half molds, applying a molding pressure and then emptying the containing space of the filling material and, after opening the half molds, removing the core from the molded monolithic component.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

A molding apparatus for injection molding or compression molding includes an “A” portion of a mold, a “B” portion of the mold, and at least one core plunger/ejector. The core plunger/ejector provides dual functionality, wherein it participates in molding operations by consolidating a feed material in the mold cavity, and also is responsible for separating the part from various mold surfaces and ejecting it from the mold.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

The present invention is to improve the quality and appearance of a second molded product such as a secondary molded product obtained by further resin-molding a first molded product such as a primary molded product, for example. The present invention is a method for manufacturing a resin molded product in which a second molded product is obtained by further performing resin molding on a resin-molded first molded product using a first mold with a cavity formed and a second mold facing the first mold, the method including a disposing step of disposing the first molded product in the cavity and disposing a resin material on the first molded product, and a mold clamping step of clamping the first mold and the second mold after the disposing step.

The present invention is to improve the quality and appearance of a second molded product such as a secondary molded product obtained by further resin-molding a first molded product such as a primary molded product, for example. The present invention is a method for manufacturing a resin molded product in which a second molded product is obtained by further performing resin molding on a resin-molded first molded product using a first mold with a cavity formed and a second mold facing the first mold, the method including a disposing step of disposing the first molded product in the cavity and disposing a resin material on the first molded product, and a mold clamping step of clamping the first mold and the second mold after the disposing step.

An electronic device of the present invention comprises: an exterior housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a display of which at least a part is exposed through the first surface; and a polymer plate which forms at least a part of the second surface of the housing. The polymer plate comprises: at least one opaque layer; at least one polymer layer that is translucent or transparent and is disposed on the at least one opaque layer; and a coating layer that is disposed on the at least one polymer layer and has a hardness greater than or equal to a selected hardness. Each of the at least one opaque layer, the at least one polymer layer, and the coating layer may comprise a first surface, and a second surface extending from the first surface so that at least a part thereof is bent. Other embodiments are also possible.

An electronic device of the present invention comprises: an exterior housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a display of which at least a part is exposed through the first surface; and a polymer plate which forms at least a part of the second surface of the housing. The polymer plate comprises: at least one opaque layer; at least one polymer layer that is translucent or transparent and is disposed on the at least one opaque layer; and a coating layer that is disposed on the at least one polymer layer and has a hardness greater than or equal to a selected hardness. Each of the at least one opaque layer, the at least one polymer layer, and the coating layer may comprise a first surface, and a second surface extending from the first surface so that at least a part thereof is bent. Other embodiments are also possible.