The present invention relates to cylindrical expanded thermoplastic elastomer beads provided with through-holes, the expanded thermoplastic elastomer beads including a core layer in an foamed state constituted of a base polymer containing a thermoplastic elastomer and a cover layer covering the core layer and constituted of a thermoplastic polymer, wherein a coefficient of dynamic friction of the thermoplastic polymer is 0.8 or less, and a difference between a melting point (Tmc) of the base polymer and a melting point (Tms) of the thermoplastic polymer is −20° C. or more and 20° C. or less. The present invention also relates to an expanded thermoplastic elastomer beads molded article formed by subjecting expanded thermoplastic elastomer beads provided with through-holes to in-mold molding, the molded article including a core layer in a foamed state and a cover layer covering the core layer, wherein a voidage is 15% or more, a density is 10 kg/m.sup.3 or more and 200 kg/m.sup.3 or less, and the product of a tensile strength (MPa) and a tensile elongation (%) is 5 or more.

The invention refers to a method for producing expanded polymer pellets, which comprises the following steps: melting a polymer comprising a polyamide; adding at least one blowing agent; expanding the melt through at least one die for producing an expanded polymer; and pelletizing the expanded polymer. The invention further concerns polymer pellets produced with the method as well as their use, e.g. for the production of cushioning elements for sports apparel, such as for producing soles or parts of soles of sports shoes. A further aspect of the invention concerns a method for the manufacture of molded components, comprising loading pellets of an expanded to polymer material into a mold, and connecting the pellets by providing heat energy, wherein the expanded polymer material of the pellets or beads comprises a chain extender. The molded components may be used in broad ranges of application.

The present disclosure relates to a polishing pad, a method for manufacturing the polishing pad, and a method for manufacturing a semiconductor device using the polishing pad. The polishing pad increases the area in direct contact with the semiconductor substrate during the polishing process and can prevent defects occurring on the surface of the semiconductor substrate by forming a plurality of uniform pores in the polishing layer, thereby adjusting the surface roughness characteristics of the polishing surface of the polishing layer. Further, the present disclosure may provide a method for manufacturing a semiconductor device to which the polishing pad is applied.

A foaming resin composition of the present invention contains an aromatic vinyl-based resin and zinc oxide, wherein the size ratio (B/A), in which peak A is a 370 nm to 390 nm region and peak B is a 450 nm to 600 nm region, of zinc oxide is approximately 0.01 to approximately 1 when photoluminescence is measured, and the BET surface area thereof is approximately 1 m.sup.2/g to approximately 10 m.sup.2/g.

An expanded bead having a through hole and including a foamed core layer which defines the through hole therein and which is constituted of a resin composition containing two kinds of polypropylene-based resins having different melting points, and a cover layer covering the foamed core layer and constituted of a polyolefin-based resin. The expanded bead gives a DSC curve in which an endothermic peak intrinsic to the resin composition and another endothermic peak on a higher temperature side thereof appear in a specific heat of fusion ratio. Molded articles include a multiplicity of the expanded beads.

A polyurethane, in particular a thermoplastic polyurethane, is obtainable or obtained by reacting at least a polyisocyanate composition and a polyol composition. The polyol composition contains at least one polyester diol or polyether diol, having a number-average molecular weight in the range from 500 to 3000 g/mol, and at least one polysiloxane having two terminal isocyanate-reactive functionalities selected from a thio group, a hydroxyl group, and an amino group. A process can be used for preparing this polyurethane, and a molded body containing the polyurethane is useful. Foam beads based on polyurethane can be obtained or obtainable from the polyurethane, and a process can be used for producing foam beads. Corresponding bead foams are useful.

A process for producing shaped parts from particle foams comprising providing particle foam particles, wetting the particle foam particles with an aqueous emulsion of at least one polyolefin and thereby obtaining functionalisable particle foam particles, drying the wetted and functionalisable particle foam particles, shaping the functionalisable particle foam particles, heating the shaped functionalisable particle foam particles to a temperature below the melting range of the particle foam particles and thereby functionalising the shaped functionalisable particle foam particles, heating the shaped, functionalisable particle foam particles to a temperature below the melting range of the particle foam particles and thereby functionalising the shaped, functionalisable particle foam particles, wherein the particle foam particles are bonded together, and cooling and thereby obtaining the particle foam moulding, wherein the aqueous emulsion of the at least one polyolefin is an aqueous emulsion comprising at least one polyolefin converted to the liquid state with an anhydride of an unsaturated carboxylic acid and modified with methacrylic acid ester copolymers.

A perforated expanded low density polyethylene foam layer, wherein in the expanded low density polyethylene layer at least 80% of the blowing agents are dissipated from closed cells within the expanded low density polyethylene layer forming evacuated closed cells whereby a partial vacuum is formed within the closed cells of the low density polyethylene layer.

Methods of making molded polystyrene articles are described. The methods include introducing steam into a mold simultaneous to filling the mold with foam particles, and cooling the mold without the use of cooling water. The method can be performed faster and with a lower temperature differential than conventional molding processes, permitting faster turn-around to the production of subsequent molded articles. The molded articles produced by the method can have thicker side walls, improved foam particle fusion, and improved compression properties as compared to conventional EPS molding processes.

The present invention provides expanded beads comprising a crosslinked multi-block copolymer containing an ethylene block and an ethylene-α-olefin copolymer block, having an apparent density of 40 to 300 g/L, a gel fraction of 30 to 70% by weight by a hot xylene extraction method, an average cell diameter (a) of 50 to 180 μm, and an average surface layer thickness (b) of 3 to 27 μm, and the expanded beads are excellent in in-mold moldability, and can produce an expanded beads molded article being excellent in tensile characteristics in a well balanced manner.