The present invention relates to a mould for encapsulating a carrier with electronic components, comprising: at least two mould parts, one of which with at least one mould cavity recessed into a contact side for enclosing electronic components placed on a carrier, and a feed channel for moulding material recessed into the contact surface of the mould part provided with the mould cavity. The invention also relates to a moulding apparatus, a method for at least partially encapsulating a carrier with electronic components and a carrier with electronic components encapsulated with moulding material.

A probe assembly and a method of manufacturing a probe assembly. In one aspect there is a method of manufacturing a probe assembly comprising providing an electrode carrier carrying a plurality of electrodes, the electrode carrier comprising a top wherein the plurality of electrodes are exposed relative to the top and a bottom having a plurality of electrical contacts in electrical communication with the plurality of electrodes respectively; moulding a body around the electrode carrier to retain the electrode carrier whilst leaving the plurality of electrodes exposed. The invention also extends to a biomass monitoring system comprising a flexible enclosure including a probe assembly and support arrangement for receipt of the probe assembly in an engaged configuration.

A method of manufacturing suspension seating includes providing a blank to be used in a suspension member. The blank has a non-visible marker. The method also includes illuminating the non-visible marker with an excitation source. The non-visible marker becomes detectable when illuminated by the excitation source. The method further includes sensing the non-visible marker with a sensor. The sensor is configured to detect the non-visible marker when illuminated by the excitation source. The method also includes determining, by a controller, a characteristic of the blank using the non-visible marker. The controller is in communication with the sensor and configured to receive information related to the non-visible marker from the sensor. The method further includes adjusting the blank to achieve the desired characteristic.

A new type of RFID tag is provided. A gaming chip that incorporates a sticker-type RFID tag comprises: an enclosing member having a predetermined shape for enclosing the RFID tag; a body member that is injection-molded to encapsulate the enclosing member with the RFID tag; and a gaming chip for amusement. The enclosing member consists of a first part and a second part, and at least the first part or the second part has a flat surface to which a sticker-type RFID tag can adhere, and the first part and the second part are combined to form an enclosing member, in which the sticker-type RFID tag is covered by the first part and the second part.

A mold is provided for producing a composite part comprising at least one insert and a thermoplastic overmolding covering, at least partially, said at least one insert. The mold comprises at least one clamp capable of contacting said at least one insert in order to secure said at least one insert.

A battery pack according to an embodiment of the present disclosure includes a plurality of battery cells, and a pack case in which the plurality of battery cells are accommodated, wherein the pack case includes a potting resin which covers all sides of the plurality of battery cells and is filled to a predetermined height between the plurality of battery cells.

A method of manufacturing an electronic component having a housing with terminals insert-molded thereon. Each of the terminals includes a tapered portion having a tapered width and an extension extending from the tapered portion. A mold defining a cavity includes an upper die and sliding dies. After positioning the extension in one of grooves formed in one surface of each of the sliding dies, sliding the sliding dies relative to the extension to make tip edges of opposite side surfaces of the groove facing the cavity abut against opposite side surfaces of the tapered portion; and performing molding while keeping the upper die in close contact with the one surface, and keeping part of the tapered portion and the extension ying in the groove held between a bottom surface of the groove and the upper die with a remaining portion of the tapered portion lying in the cavity.

A packaging system for packaging components includes a plurality of frames arranged on top of one another. A laminar structure is fixed to each of the frames. At least one component is arranged and held between two laminar structures—one laminar structure is fixed to one frame—supported by two frames, which forms a holding component of the packaging system.

An injection molding one-piece cutting board (2) comprises two pre-molding wear-resistant chopping plates (21) spaced apart from each other in parallel. Two holding holes (211) of the two chopping plates (21) are respectively press-fitted at an upper side and a lower side of a positioning block (31) arranged inside an injection molding mold (3). Two open groove portions (32) of the mold (3) are respectively arranged corresponding to an upper side of one chopping plate (21) and a lower side of the other chopping plate (21). A cover groove portion (33) of the mold (3) is surrounded the peripherals of the two chopping plates (21). A plastic material is injected into a space defined between the two chopping plates (21) and then filled with the plastic material to form a middle thickness support (22) and the cover groove portion (33) to form a frame (23).

A mold for encapsulating a Pin-Fin type power module with resin is disclosed. The power module includes a DBC or IMS, power chips and multiple terminals provided on a first surface of the DBC or IMS and a Pin-Fin structure provided on a second surface of the DBC or IMS. The mold further includes: a cavity for containing the power module; multiple terminal protecting elements corresponding to the terminals, respectively, each for receiving at least a part of a terminal; and an injection hole provided on the bottom of the mold or on the side wall of the mold, The first surface faces the bottom of the mold and the injection hole is below the first surface when the power module is placed in the cavity. A method for manufacturing a power module is also provided.