A method for producing a media-tight material composite, in particular comprising a metal solid body and an optionally electrically insulating plastic at least partially surrounding the solid body, preferably as a component of a preferably shielded electrical interface, wherein surfaces of the solid body that the plastic contacts are subjected to a surface pretreatment in order to promote the adhesion of the plastic to the solid body. The disclosure further relates to a cylindrical metal sleeve, in particular as part of a plug connector, and a plug connector or sensory comprising a metal sleeve, produced by the foregoing method.

A robotic device having in-mold electronics is provided. According to one or more aspects, a robotic device includes an electronic computing unit for controlling the robotic device and a molded part. The molded part includes a thermoformed first film, structural layer, electronic circuit, and a functional component. The molded structural layer is arranged under the first film. The thermoformed second film arranged under the structural layer. The electronic circuit arranged over the second film and adjacent the structural layer. The electronic circuit includes a functional component communicably coupled to the electronic computing unit. The first film is arranged to cover the structural layer, the second film, and the electronic circuit to define an exposed surface of the molded part.

A mold die includes: a mold die body that is configured to hold an object to be molded, the object including a substrate and a chip mounted in a central area of the substrate, and that has a cavity which is rectangular in a plan view and which is configured to receive a resin material, the mold die body including: a pot for containing the resin material; a gate disposed at one side of the cavity and configured to allow the resin material to flow into the cavity; and a flow-path restricting mechanism that is disposed on both lateral sides of the cavity that are perpendicular to the one side and that is configured to narrow lateral flow paths, the lateral flow paths being flow paths for the resin material flowing through the cavity in which the chip is not disposed.

Embodiments herein are directed to an assembly that includes a circuit board, a plurality of terminal pins, a first material layer, a second material layer, and a third material layer. The plurality of terminal pins extend from the circuit board. The first material layer encases a portion of the circuit board. The second material layer encapsulates a portion of the plurality of terminal pins and encases the first material layer. The second material layer defines a connector interface. A material of the second material layer is different from a material of the first material layer. The third material layer encases the first material layer and at least a portion of the second material layer. The third material layer defines a housing that is formed from a material different then the material of the first material layer and different from the material of the second material.

In one example, an apparatus for jointing power cables includes a mold extending along a longitudinal axis, and having a feeding inlet and being made of two halves forming a longitudinal pass-through seat for receiving the cables. An extruder is connected to the feeding inlet. A heating system and a cooling system is associated with the mold. A measuring system for detecting temperature or pressure includes a plurality of probes for detecting temperature or pressure.

An injection molding method for a product with a connection elastic sheet, a loudspeaker and an electronic device are provided. The method comprises: providing a blank material comprising at least one connection piece and a material connection strip, and each connection piece comprising an elastic arm portion and a wire portion; positioning the blank material as an insert in a first injection mold by means of the material connection strip; injecting a first injection plastic part into the first injection cavity to obtain a first injection product; processing the first injection product for bending up the elastic arm portion toward an outer surface of the first injection plastic part; placing the processed first injection product into a second injection cavity of a second injection mold, and sealing the elastic arm portion; and injecting a second injection plastic part into the second injection cavity.

In an embodiment a sensor includes a sensor element, a connecting element configured for electrical connection and a housing located on the sensor element, wherein the housing comprises a housing material with cured liquid silicone rubber (LSR) as a main component.

Various techniques are provided to enclose at least a portion of a thermal imaging system in a thermoplastic material to create a waterproof thermal imaging system and encapsulate associated electrical components. In one example, a method includes placing at least a portion of a thermal imaging system comprising a plurality of exposed electronic components into a mold. The method also includes injecting a thermoplastic material into the mold to deposit the thermoplastic material onto the electronic components and encapsulate the electronic components in an overmolded solid enclosure formed by the thermoplastic material. Additional methods and systems are also provided.

A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the sealing step, the conductive members are sealed with a resin injected into a die while a force is applied by the resin to the individual conductive members in directions to approach each other in a facing orientation of the pair of conductive members.

An apparatus and a method for manufacturing a reactor capable of preventing a core from being cracked due to a resin pressure during molding are provided. An apparatus for manufacturing a reactor provided with a core includes a mold with a cavity for housing the core. The mold includes a core support pin brought into contact with the core and configured to support the core against a resin pressure during molding. Resin flow paths during molding includes an inner flow path passing through inside the core and an outer flow path passing through outside the core. The core support pin is disposed at a position where a width of the inner flow path is greater than a width of the outer flow path.