In a bus bar unit in which a plurality of bus bars are formed by insert molding and arranged in an axial direction of a stator, each bus bar includes: a main body portion extending in a circumferential direction of the stator; a through hole formed in the main body portion, into which a support pin for supporting the main body portion of another bus bar is inserted in the axial direction of the stator during insert molding; and a projecting portion provided on a side portion of the main body portion in alignment with the through hole so as to increase a sectional area of the main body portion.

A method for producing a multi-core cable includes arranging first and second contact elements in a contact carrier having first and second longitudinal channels connecting a contacting side to a cable side, and first and second through-openings respectively crossing the first and second longitudinal channels, and a second through-opening crossing the second longitudinal channel. The first and second longitudinal channels and the first and second through-openings are sealed in a fluid-tight manner by inserting two first sealing pieces into the first through-opening and two second sealing pieces into the second through-opening. In an injection-molding method, a connecting piece is formed connecting the contact carrier to the outer sheath of the cable by overmolding at least a rear section of the contact carrier comprising the first and second through-openings and a section of the cable protruding on the cable side.

A molded connector (10) includes a terminal fitting (2) connected to a cable (11), a terminal holding member (3) including a resin and holding the terminal fitting (2), and a molded resin portion (4) formed by injection molding using a mold (5) and holding the terminal holding member (3) and an end portion of the cable (11). The terminal holding member (3) includes a main body (30) holding the terminal fitting (2) and protruding portion (31) that is formed protruding from the main body (30) and includes a tip end surface (31a) in contact with an inner surface of a cavity (5a) in the mold (5) during injection molding. The protruding portion (31) is locked to a locking portion (521) provided on the mold (5 to restrict the movement of the terminal holding member (3) during injection molding. At least a part of the protruding portion (31) is fusion-bonded to the molded resin portion (4).

An LED luminaire and potting method having the following steps: introducing a configured luminaire into an at least partly optically transparent potting mold (16), such that the luminaire does not come into contact with the walls of the potting mold; introducing an optically transparent potting compound (18) into the potting mold (16) until at least the luminaire is surrounded; and detecting a quantity of bubbles by an optical sensor or image detector (14), wherein the pressure in the vacuum chamber (11) is controlled in order to influence the bubbles and/or a pivot/inclination device (12) is controlled in order to move the vacuum chamber (11) and/or the potting mold (16) in order to expel detected gas/air bubbles (19) out of the optically transparent potting compound (18).

An injection molded article is provided with: a flat molded resin body that has a flat rectangular parallelepiped shape and is formed from an injection molded resin; and a base sheet affixed to the surface of the molded resin body. The base sheet has formed therein a first conductive layer on a first surface and a through hole passing through from the first surface to a second surface. The through hole is filled with a conductive material, and a second conductive layer is formed so as to be electrically connected with the first conductive layer via the conductive material with which the through hole is filled. In addition, a sealing material is formed on the first conductive layer so as to cover the through hole. The molded resin body is fixed together with the first surface side of the base sheet so as to cover the sealing material.

Molding methods and molds for making a synthetic resin molded product include disposing a curable liquid resin mixture in a recess of a female mold. The curable liquid resin mixture is then simultaneously agitated and degassed by a mixer while under a partial vacuum. More specifically, at least the female mold is orbited around an orbital axis while being rotated about a rotational axis that is eccentric to the orbital axis. After being thoroughly mixed and degassed, the liquid mixture is then cured in the mold unit.

A method of manufacturing an assembly with a housing part and at least two conductors of shape sheet metal parts may include providing at least one first conductor formed from at least one sheet metal part and at least one second conductor formed from at least one sheet metal part. The method may then include arranging the first and second conductors in an injection mould in such a way that the first conductor may come into mechanical contact with the second conductor in a common contact zone to produce an electrical connection. The method may then include at least partially overmoulding the first and second conductors with a plastic to form a joint housing part. The method may further include bonding the first and second conductors in a region of the common contact zone after at least partially overmoulding the first and second conductors.

A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other.

A cable accessory for injecting fluid into a cable. The accessory has first and second ends configured to be coupled to the cable and an external cable accessory, respectively. The accessory has an injection port configured to introduce the fluid to a stranded conductor of the cable. The accessory may include a body and conductive rod. The body defines a through-channel configured to receive the conductor. The rod has a first portion that extends outwardly from the second end to be received inside the external cable accessory and to form an electrical connection therewith. The rod has a second portion configured to be coupled to the conductor and form an electrical connection therewith. The second portion (with the conductor coupled thereto) is positionable inside the through-channel with the first portion extending outward from the second end. The fluid is injectable into the conductor through injection port, which extends into the through-channel.

An electronic device and related method that includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.