A multi-camera vision system for a vehicle includes a plurality of video cameras having respective fields of view external of the vehicle. Captured image data is provided to and processed at a central data processor in order to detect objects that are within the field of view of at least some of the video cameras. The vehicle is equipped with a sensor system having at least one non-visual sensor that senses sensor data in a region external of the vehicle. The sensed sensor data is provided to the central data processor. A potential hazard present exterior the vehicle is determined to exist via processing at the central data processor of at least one of received image data and received sensor data.

By a simple configuration, contact members can be well retained with a housing in a mutually opposed state, and productivity can be improved. When the contact members in the mutually opposed state are to be attached to the housing, a contact retainer prepared by molding in advance is used by disposing the contact retainer in part of the contact opposed region. As a result, the contact members are stably retained in the mutually opposed state even in injection molding molds. Even in a case in which the contact members normally cannot be retained in the mutually opposed state in the injection molding molds, the housing and the contact members can be integrally molded by well retaining the contact members in the mutually opposed state by using the contact retainer and a contact retainer auxiliary and executing an injection molding process.

A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.

A film (2) which has at least one electric or electronic functional layer (22), wherein at least one electric and/or electronic component is provided in a functional area of the functional layer (22), and wherein at least one electrical connection is provided in a contact area of the at least one functional layer (22), which electrical contact is galvanically coupled to at least one component, wherein the film (2) has a contact flap which provides at least one part of the contact area (20b, 20b′), has a further layer (23a, 23b, 24″), in a thickness of at least 300 nm and preferably at least 1 μm, particularly preferably of at least 7 μm, on the functional layer (22) at least in a transition area (20c) between the functional area (20a) and the contact area (20b), which comprises at least a partial area of the contact flap. Alternatively, in a transition area the flap can taper away from the functional area.

The present invention relates a setting method for a conductive object of electrochemical test strip. In the embodiment, this manufacturing process is not complex, convenient, and has well precision, such that the cost of manufacturing an electrochemical test strip is reduced effectively, and the disadvantage of past manufacturing process is improved. The present invention is highly applied and convenient, so that wide application can be expected in the future.

An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

A process produces an electrical line which extends in the longitudinal direction and the line has a line core and an outer shell. In a continuous shaping process, individual shell portions of the outer shell are formed successively by surrounding the line core with a curable plastic substance. In at least one portion, the outer shell is produced having a cross-sectional geometry which can be varied in the longitudinal direction of the line.

The present invention provides a connection structure and a manufacturing method therefor capable of increasing reliability of a connection part compared to the prior arts. A connection structure according to the present invention includes a plurality of conductive members, a connection part that electrically connects the conductive members, and an electrically insulating molded body in which the connection part is embedded. It is thereby possible to physically reinforce the connection part of the conductive members, keep the connection part in a hermetically sealed condition, thereby prevent corrosion and increase reliability compared to the prior arts.

In a bus bar unit formed by performing secondary insert molding on a primary molded member, which is formed by performing primary insert molding on a plurality of primary molding bus bars, and a plurality of secondary molding bus bars such that the primary molding bus bars and the secondary molding bus bars are arranged in a bus bar axial direction, each primary molding bus bar includes an insertion hole into which a support pin for supporting another primary molding bus bar during the primary insert molding is inserted in the bus bar axial direction, and a through hole through which an insulating resin can pass during the secondary insert molding is formed in each secondary molding bus bar in a position opposing the insertion hole.