B29C45/14836

MULTI-STEP MOLDING PROCESS FOR ELECTRONIC DEVICE CHASSIS

An electronic device chassis is manufactured with a multi-step molding process. The process includes at least two separate injection molding steps. During the first step, an electronic component is placed in a first mold, and a first material is injected into the first mold to create a first chassis that surrounds part of the electronic component. In the second step, the first chassis is placed in a second mold, and a second material is injected into the second mold to create a second chassis that surrounds part of the first chassis. The second step can be performed at a higher pressure than the first step, which can produce a smoother exterior surface. Furthermore, the first chassis shields the electronic component from the higher pressure of the second step, which reduces the likelihood of damage to the electronic component.

INSERT MOLDING METHOD AND INSERT MOLDING COMPONENT
20190105820 · 2019-04-11 · ·

An insert molding component includes a primary molding section with a concave portion formed on one surface thereof, an insert component disposed on a bottom side of the concave portion of the primary molding section, a heat-insulating component disposed in the concave portion of the primary molding section and disposed on a top of the insert component, and a secondary molding section disposed in contact with the one surface of the primary molding section.

Method and apparatus for producing hollow articles made of injection moulded plastic material
20190084202 · 2019-03-21 ·

A method and apparatus for producing hollow articles made of injection moulded plastic material by a mould having a die within which there is inserted a core, and at least one injector including a pin valve displaceable between a closing position and an opening position for injecting the pressurized plastic material into a space comprised between the die and the core. During the injection, any flexural deflection of the core is detected and the pin valve of the or of each injector is displaced in a controlled fashion to adjust a pressure and a flow rate of the injected plastic material, so as to reduce or eliminate such deflection of the core.

INJECTION MOULDING OF OPTICAL COMPONENTS

A method for injection moulding an optical component (20), e.g. a cover for a luminaire, with an incorporated optical function, the component (20) comprising an injection moulded body (18) and at least one optically functional relief structure (4) applied thereto, the relief structure (4) forming or contributing to the optical function of the component (20) to be moulded, wherein the method comprises: (i) providing an insert (2) comprising the said optical structure (4) in the form of an open-face relief structure (4) provided on a face, surface or portion of the insert (2), (ii) mounting the insert (2) inside a mould cavity (11) in which the component (20) is to be moulded, with the open-face relief structure (4) facing and at least partially abutting a surface portion of the mould cavity (11), and (iii) rear-injection moulding a body (18) of the component (20) within the mould cavity (11) so as to incorporate the insert (2) in the component body (18), wherein the said method is carried out with parameters selected and/or controlled such that during the injection moulding step (iii) the temperature at or on the face, surface or portion of the insert (2) provided with the relief structure (4) remains below the lowest of the glass transition temperature, melting temperature and temperature of onset of thermal decomposition of the material of that face, surface or portion of the insert (2).

METHOD FOR APPLYING A SEAL TO A PLATE

A method for applying a seal onto a plate, including, providing a tool containing at least one support element made of solid material including a recess, a support element made of flexible material including a first part and a second part where said support element made of flexible material is arranged at least partially in said recess, and a means for exerting a pressure in a compensation chamber of said recess, where said compensation chamber is delimited at least partially by said second part of said support element made of flexible material.

ELECTRONIC-COMPONENT-ATTACHED RESIN HOUSING AND METHOD FOR MANUFACTURING THE SAME

An electronic-component-attached resin housing is provided that comprises a housing and an electronic component mounting film. The housing is made of resin. The electronic component mounting film includes a base film, a circuit pattern layer, an electronic component, and a reinforcing layer. The base film is disposed along an inner surface of the housing. The circuit pattern layer is formed on at least a surface of the base film opposite to a housing side of the base film. The electronic component is connected to the circuit pattern layer and mounted on the surface of the base film opposite to the housing side of the base film. The reinforcing layer is formed on the housing side of the base film facing the electronic component. The electronic component is integrated with the housing without the electronic component being buried in the housing.

Pipe joint manufacturing method and mold
12030268 · 2024-07-09 · ·

A manufacturing method for manufacturing a pipe joint including a circular tube-shaped housing and an elastically deformable circular tube-shaped seal member provided at an inner peripheral side of the housing. The pipe joint manufacturing method includes a process of placing the seal member inside a mold in a state in which the seal member is fitted to an outer periphery of a retaining pin, and a process of causing a molten resin to flow into the mold so as to mold the housing in a state in which the seal member is cooled through the retaining pin.

Resin-sealed electronic component and method for manufacturing the same
12030230 · 2024-07-09 · ·

A resin-sealed electronic component includes an electronic component main body sealed with a resin housing. The resin housing includes a pair of resin members aligned in a first direction with sandwiching a housing space housing the electronic component main body, and a sealing member including a molding resin and being molded so as to cover at least a portion of each of the pair of resin members. A portion of one resin member of the pair of resin members and a portion of the other resin member are aligned in a second direction intersecting the first direction to constitute a suppression structure that suppresses the molding resin from entering the housing space.

Method for producing a composite component

The invention relates to a process for the production of a composite component (33) which comprises a molding (1) made of a thermoplastic polymer foam and which comprises a functional layer (37) made of an unfoamed thermoplastic, comprising the following steps: (e) insertion of the molding (1) made of thermoplastic polymer foam into a mold (3), (f) application of a thermoplastic polymer by an injection process, where the pressure during the application of the thermoplastic polymer is smaller than 100 bar.

METHOD OF FORMING A HEADREST ASSEMBLY

A method of forming a headrest assembly includes providing a first mold that encloses a first cavity in a closed condition. A support is positioned in the first cavity. A first material is blow molded into the first cavity and around a portion of the support to form a core part. The core part and support are removed from the first mold. A second mold encloses a second cavity in a closed condition. The core part and the support are placed into the second mold in an open condition. A fluid is injected into the core part through the support. The second mold is converted to the closed condition. A second material is injection molded into the second cavity and around the core part to form an outer shell around the core part. A fluid is withdrawn from the core part through the support.