A method for injection moulding an optical component (20), e.g. a cover for a luminaire, with an incorporated optical function, the component (20) comprising an injection moulded body (18) and at least one optically functional relief structure (4) applied thereto, the relief structure (4) forming or contributing to the optical function of the component (20) to be moulded, wherein the method comprises: (i) providing an insert (2) comprising the said optical structure (4) in the form of an open-face relief structure (4) provided on a face, surface or portion of the insert (2), (ii) mounting the insert (2) inside a mould cavity (11) in which the component (20) is to be moulded, with the open-face relief structure (4) facing and at least partially abutting a surface portion of the mould cavity (11), and (iii) rear-injection moulding a body (18) of the component (20) within the mould cavity (11) so as to incorporate the insert (2) in the component body (18), wherein the said method is carried out with parameters selected and/or controlled such that during the injection moulding step (iii) the temperature at or on the face, surface or portion of the insert (2) provided with the relief structure (4) remains below the lowest of the glass transition temperature, melting temperature and temperature of onset of thermal decomposition of the material of that face, surface or portion of the insert (2).

A method for applying a seal onto a plate, including, providing a tool containing at least one support element made of solid material including a recess, a support element made of flexible material including a first part and a second part where said support element made of flexible material is arranged at least partially in said recess, and a means for exerting a pressure in a compensation chamber of said recess, where said compensation chamber is delimited at least partially by said second part of said support element made of flexible material.

An injection molded part is formed of a base part and a soft component which includes a cushioning shaped part fastened thereto. Injection (molding is performed without additional connection steps by having the cushioning shaped part have a soft, cast gel body completely covered on its boundary surface with a hard component that is a flexible and elastically deformable material which forms a circumferential flange-like rim protruding laterally beyond the cast gel body. During injection molding the hard component is being surrounded by the material of the base part while shielding the cast gel body from the injected material used to form the base part.

An encapsulation for electronics is provided. The encapsulation includes a circuit card assembly (CCA) on which a component of the electronics is operably disposed, a compliant thermal buffer coating (TBC), thermoset material and high-performance thermoplastic materials. The compliant TBC is layered over the component and a first area of the CCA, which extends about a periphery of the component. The thermoset material is cast over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC. The high-performance thermoplastic material is injection molded over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material.

[Problem] To provide: a polyarylene sulfide resin composition having excellent high- and low-temperature impact properties and excellent low warpage; and an insert-molded article using the resin composition.

[Solution] A polyarylene sulfide resin composition that contains a polyarylene sulfide resin A, an inorganic filler B, and an olefinic copolymer C containing a structural unit derived from an -olefin and a structural unit derived from a glycidyl ester of an a, p-unsaturated acid, the inorganic filler B containing a fibrous inorganic filler B1 having a different diameter ratio, which is a ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 1.5 or less, and a fibrous inorganic filler B2 having a different diameter ratio of 3.0 or more, the mass ratio B1/B2 of the fibrous inorganic filler B1 and the fibrous inorganic filler B2 being 0.2 or more and 5.0 or less.

An injector for introducing a fluid includes a main body designed as an insert and including a first tool contact surface for an injection-molding tool and a second tool contact surface for the injection-molding tool; and an injection-molded housing that completely encloses the main body on at least one portion of the main body, the injection-molded housing including at least one first opening that extends linearly towards the main body.

Systems and processes produce a plastic-metal composite component composed of at least one hollow profile and at least one fluid to be used in an interior of the at least one hollow profile.

A process for producing a plastic-metal composite component composed of at least one hollow profile and at least one application of plastic to be applied to the outside by means of injection molding or compression.

Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.