Patent classifications
B29C45/1679
Decorative Functional Component Having a Transparent Partial Surface
A decorative functional component with a transparent partial surface includes a substrate and a flat cover body. The substrate is of a first plastic material and has a recess. The cover body is of a transparent second plastic material and covers the recess of the substrate. The substrate and the cover body are connected together by a loose form-fit connection. The substrate and the cover body and are jointly coated with a low viscosity curing transparent plastic flooded thereon.
CLASS A, CARBON FIBER-REINFORCED THERMOPLASTIC COMPOSITES THROUGH IN-MOLD COATING
A method of injection molding of a class A surface part comprising the steps of first providing a first injections mold cavity for forming a part geometry and a second injection mold cavity for molding of a final class A surface around the part geometry with a second material. Then a fiber reinforced polyamide with an effective amount of an ABS material is compounded and the first injection mold cavity is used to form a part geometry. Thereafter, a colored polyurethane material is injected around the part geometry in the second injection molded cavity for providing a class A surface coating on the part.
METHOD FOR PRODUCING A COMPONENT AND DEVICE FOR PRODUCING A COMPONENT
A method for producing a component, wherein in the method the following steps are carried out, in particular in the following sequence: providing at least one upper mold carrier and at least one lower mold carrier, wherein the at least one upper mold carrier has at least two upper mold modules and the at least one lower mold carrier has at least one lower mold module; moving the at least one upper mold carrier and/or the at least one lower mold carrier in at least one direction into at least one predetermined position; combining a first upper mold module of the at least two upper mold modules of the at least one upper mold carrier and a first lower mold module of the at least one first lower mold module of the at least one lower mold carrier in the at least one predetermined position such that one or more work stations for carrying out at least one step for producing the component are formed; carrying out the at least one production step to form the component, as well as a device for producing a component.
METHOD FOR MANUFACTURING A HANDLE FOR A PERSONAL CARE IMPLEMENT
A method for manufacturing a handle for a personal care implement includes molding from a fiber-reinforced material, preferably by injection-molding, a core-connector unit having a core structure and a connector for attaching and detaching a head to and from the handle, and molding, preferably by injection-molding, a polymeric material onto the core structure to form a component that at last partially covers the core structure.
Injected LED light assembly
A light assembly and method of forming light assemblies includes a flexible light layer, a thermoplastic housing, and an IMC layer. The flexible light layer has a flexible substrate, a printed circuit, and a plurality of LEDs extending outward from the flexible substrate. The IMC layer is formed opposite the flexible light layer from the thermoplastic housing and covers the LEDs. Forming may include placing the flexible light layer within a mold cavity, injecting the thermoplastic structure on one side of the flexible light layer, and injecting the IMC layer on the opposite side of the flexible light layer from the thermoplastic structure. Injecting the thermoplastic structure into the mold cavity may change the shape of the flexible light layer. Datum features of the flexible light layer may align the thermoplastic structure relative to the datum features.
Method for producing a composite part
A method for producing a composite part. According to the method, a substrate is provided, the substrate having an integrated mixing portion for mixing a component system close to the substrate. The substrate provided is introduced into a cavity of a coating tool in an additional step. The substrate is then coated by flooding the cavity with the component system. The component system is mixed inside the cavity by means of the mixing portion of the substrate.
HEART VALVE
The invention relates to a method of manufacturing a heart valve, comprising: a step of injection moulding a first part (110) of the heart valve from a first block-copolymer, wherein the injection moulding is performed at a temperature below an order-disorder transition temperature of the block copolymer, such that a phase structure is present in the molten block-copolymer; a step of injection moulding a second part (114) of the heart valve from a second block-copolymer that is different to the first block-copolymer, by over-moulding over the first part (110) to form an over-moulded structure, wherein the injection moulding is performed at a temperature below order-disorder transition temperatures for the first and second block copolymers, such that a phase structure is present in the molten second block-copolymer and remains present in the first block-copolymer; and a step of cooling the over-moulded structure, without heating it above the order-disorder transition temperatures between the step of injection moulding the second part (114) and the step of cooling, so as to preserve an arrangement of the phase structures created during the steps of injection moulding and produce anisotropic physical properties in the second part (114). The invention also relates to the thus manufactured heart valve.
IN-MOLD SPRAYING SYSTEM AND PROCESS METHOD
For in mold spraying, a double-inclined mixing nozzle is connected obliquely and fixedly with a side surface of a third half-mold through a lateral sealing structure and connected with a side surface of a first half-mold in an inclined and sealing manner, side faces of a first half-mold and the third half-mold are respectively provided with installation inclined surfaces. A lateral sealing structure includes a mounting plate and a sealing member. The sealing member is sleeved on the double-inclined mixing nozzle and is in transition fit with the double-inclined mixing nozzle and the mounting plate respectively. A butt sealing groove provided on the installation inclined surface of the first half-mold and is in sealing fit with the mounting plate.
SELF-RELEASING IN-MOLD COATING (IMC) FOR COATING SUBSTRATES
Described herein is a pigmented composition which is suitable for coating components in an in-mold coating process, a process for coating components, and a method of using the composition for improving the flow behavior of compositions used for producing components. The composition includes at least one solvent L, at least one alkoxylated fatty acid and/or fatty alcohol, at least one alkoxylated polysiloxane, and at least one color base BF.
Panel-molded electronic assemblies
A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.